内容概况：芯片测试接口，俗称测试插座或测试座，一种应用于芯片测试的硬件，是测试机台与待测芯 片连接的媒介。2024年，人工智能、先进计算需求爆发，叠加消费电子市场复苏，全球集成电路市场规 模恢复至5395.05亿美元，同比增长25.9%，其中逻辑芯片规模为2157.68亿美元，存储芯片规模为 1655.16亿美元。2025年，受益于人工智能应用及数据中心基础设施的强劲需求，推动了对于逻辑芯片 和存储芯片需求的增长，带动集成电路市场规模达6778.52亿美元，同比增长25.6%，预计2026年将大幅 增长至8742.91亿美元。半导体测试行业的需求扩张以及工艺升级都将促使测试接口行业的技术升级与 规模提升。近年来，全球集成电路产业发展迅速，高端数字芯片与存储芯片市场需求不断增加，推动测 试需求增加，这种需求传导效应进一步推动上游芯片测试接口环节市场规模加速扩张。数据显示，2025 年全球芯片测试接口及配件市场规模约为29.5亿美元，同比增长13.4%。中国大陆是芯片封测重要力 量，对芯片测试接口需求较大。尤其是近年来，中国半导体行业在政策支持和市场需求的推动下，实现 了快速发展，带动芯片测试接口市场规模明显扩张 ...

截至1月21日收盘，PCB概念上涨2.79%，位居概念板块涨幅第8，板块内，156股上涨，大族数控20%涨 停，广合科技、宏和科技、中钨高新等涨停，芯碁微装、科翔股份、英诺激光等涨幅居前，分别上涨 16.26%、12.48%、10.19%。跌幅居前的有瑞华泰、凯华材料、艾森股份等，分别下跌5.79%、4.30%、 3.85%。 PCB概念资金流入榜 | 代码 | 简称 | 今日涨跌幅 | 今日换手率 | 主力资金流量（万 | 主力资金净流入比率 | | --- | --- | --- | --- | --- | --- | | | | （%） | （%） | 元） | （%） | | 000657 | 中钨高 新 | 10.00 | 7.32 | 54251.25 | 12.65 | | 002463 | 沪电股 份 | 4.03 | 4.04 | 43503.72 | 7.62 | | 002436 | 兴森科 技 | 8.30 | 13.76 | 36953.27 | 7.07 | | 600176 | 中国巨 石 | 7.07 | 2.54 | 28671.03 | 14.12 | | 002938 | ...

Group 1 - The core viewpoint of the news is that Xingsen Technology (兴森科技) experienced a significant stock price increase, reaching a limit up of 10% on January 21, 2026, driven by strong financial performance and positive market conditions in the semiconductor sector [1][2]. Group 2 - Xingsen Technology reported impressive third-quarter results, with net profit increasing by 516.08%, non-recurring net profit rising by 1195.59%, and operating revenue growing by 23.48%, indicating substantial business expansion [2]. - The company highlighted an improvement in the storage chip sector, which is expected to positively impact its business, as rising storage chip prices may enhance product pricing and overall performance [2]. - Xingsen Technology is making steady progress in its FCBGA packaging substrate business, with capacity expansion and product yield preparations in place, while also focusing on CoWoP packaging technologies and actively pursuing new industry opportunities [2]. - The semiconductor and components sector saw capital inflows on January 21, 2026, with multiple related stocks rising, and Xingsen Technology, being a competitive player in the sector, benefited from this sector-wide momentum [2]. - Technical indicators suggest that if the MACD forms a golden cross and the stock price breaks through significant resistance levels, it may attract more technical investors, further driving the stock price up [2].

Group 1 - The CPO concept stocks have seen a significant rise, with the sector index increasing by over 3% as of January 21 [1] - Notable stocks include Zhixiang Technology, which rose by 18.85%, and Robotech, which increased by 13.76% [2] - Other companies such as Lian Technology and Kexiang Co. also experienced substantial gains, with increases of 12.79% and 12.71% respectively [2][3] Group 2 - Several companies reached their daily limit up, including Huada Technology, Woge Optoelectronics, and Tongfu Microelectronics, all showing strong performance [3] - The stock of Zhixiang Technology surged by 18%, while Robotech and Lian Technology both rose by over 10% [3] - The overall market sentiment for CPO stocks appears positive, indicating potential investment opportunities in this sector [1][3]

Core Viewpoint - The article highlights significant stock price increases for various companies, with several reaching their daily limit up, indicating strong market performance and investor interest in the technology sector [2]. Group 1: Stock Performance - Zhishang Technology (致尚科技) saw a remarkable increase of 18.85%, with a total amount of 12.05 billion and a market capitalization of 208.0 billion [1]. - Robot Technology (罗博特科) experienced a rise of 13.76%, with a total amount of 36.16 billion and a market cap of 556.8 billion [1]. - Liante Technology (联特科技) increased by 12.79%, with a total amount of 22.10 billion and a market cap of 268.617 billion [1]. - Kexiang Co., Ltd. (科翔股份) rose by 12.71%, with a total amount of 15.44 billion and a market cap of 101.8 billion [1]. - SIRUI Technology (思瑞浦) increased by 11.16%, with a total amount of 14.16 billion and a market cap of 271.5 billion [1]. - Huatian Technology (华天科技) and Woge Optoelectronics (沃格光电) both saw increases of 10.01% and 10.00%, respectively, with Huatian having a total amount of 46.41 billion and a market cap of 462.1 billion, while Woge had a total amount of 7.07 billion and a market cap of 87.98 billion [1]. - Tongfu Microelectronics (通富微电) also increased by 10.00%, with a total amount of 75.34 billion and a market cap of 851.5 billion [1]. - Other companies like Guanghe Technology (广合科技) and Kecuan Technology (可川科技) also showed significant gains, with increases of 10.00% and 9.99%, respectively [1][2]. Group 2: Market Trends - The overall trend indicates a bullish sentiment in the technology sector, with multiple stocks hitting their daily limit up, reflecting strong investor confidence and market dynamics [2]. - The performance of these companies suggests a growing interest in technology stocks, particularly in the context of recent market developments [2].

Core Viewpoint - The storage chip sector experienced a significant rally, with multiple companies reaching their daily price limits, indicating strong market interest and potential investment opportunities in this industry [1] Group 1: Company Performance - Jin Sun (300606) and Xingsen Technology (002436) hit the daily limit up, showcasing robust investor confidence [1] - Yingfang Micro (000670), Zhizheng Co. (603991), Dagang Co. (002077), and Tongfu Microelectronics (002156) also reached their daily limit up, reflecting a broader trend in the storage chip market [1] - Zhaoyi Innovation (603986) surged over 6%, achieving a new historical high, indicating strong growth potential [1] Group 2: Market Trends - The overall performance of the storage chip sector is highlighted by the significant price increases of various companies, suggesting a bullish sentiment in the market [1] - Other notable performers include Saiteng Co. (603283), Unisoc (002049), and China Electric Port (001287), which also showed substantial gains, further emphasizing the positive momentum in the industry [1]

Group 1 - The core viewpoint of the news is that Xingsen Technology's stock has shown significant growth this year, with a 12.09% increase since the beginning of the year and a notable 23.59% increase over the past 20 days [2] - As of January 20, Xingsen Technology's stock price was 23.73 yuan per share, with a market capitalization of 403.33 billion yuan and a trading volume of 7.52 billion yuan [1] - The company's main business segments include PCB (Printed Circuit Board) at 71.45%, IC packaging substrate at 21.09%, and semiconductor testing board at 3.17% [2] Group 2 - For the fiscal year 2025 (January to September), Xingsen Technology reported a revenue of 5.373 billion yuan, representing a year-on-year growth of 23.48%, and a net profit attributable to shareholders of 131 million yuan, which is a remarkable increase of 516.08% [2] - The company has distributed a total of 1.129 billion yuan in dividends since its A-share listing, with 270 million yuan distributed over the past three years [3] - As of September 30, 2025, the top ten circulating shareholders include Hong Kong Central Clearing Limited and Southern CSI 500 ETF, with notable changes in their holdings [3]

Group 1 - The core viewpoint of the article is that the company is making steady progress in expanding its FCBGA packaging substrate business and customer certification, with no abnormalities found in the substrate based on feedback from testing results [1] - The company has adequately prepared for mass production in terms of capacity scale and product yield, with the pace of large-scale production primarily dependent on industry demand recovery, customer mass production progress, and supplier management strategies [1]

Market Overview - The component sector experienced a decline of 0.19% on January 19, with Jingwang Electronics leading the drop [1] - The Shanghai Composite Index closed at 4114.0, up 0.29%, while the Shenzhen Component Index closed at 14294.05, up 0.09% [1] Top Gainers in the Component Sector - Huazheng New Materials (603186) saw a closing price of 63.81, with a significant increase of 10.00% and a trading volume of 164,700 shares, totaling a transaction value of 1.025 billion [1] - Jin'an Guoji (002636) closed at 20.37, up 9.99%, with a trading volume of 306,300 shares and a transaction value of 616 million [1] - Tongfeng Electronics (600237) increased by 7.00% to close at 10.86, with a trading volume of 811,800 shares [1] Top Losers in the Component Sector - Jingwang Electronics (603228) closed at 68.60, down 4.62%, with a trading volume of 293,900 shares [2] - Dongshan Precision (002384) decreased by 3.14% to close at 77.81, with a trading volume of 406,700 shares [2] - Shengyi Electronics (688183) saw a decline of 2.93%, closing at 95.00, with a trading volume of 135,100 shares [2] Capital Flow Analysis - The component sector experienced a net outflow of 506 million from main funds, while retail investors saw a net inflow of 488 million [2][3] - Notable net inflows from retail investors were observed in several companies, including Xingsen Technology (002436) with a net inflow of 34.3 million [3] - Jin'an Guoji (002636) had a significant retail net inflow of 183 million, despite a main fund outflow of 92.6 million [3]

Core Viewpoint - The company is making steady progress in expanding its FCBGA packaging substrate business, with customer certification and market development on track [1] Group 1: Business Development - The company has reported that the feedback from testing results shows no abnormalities in the substrates [1] - The company is fully prepared for mass production in terms of capacity scale and product yield [1] Group 2: Production and Market Factors - The pace of large-scale mass production primarily depends on the recovery of industry demand, the customer's own mass production progress, and their supplier management strategies [1]