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兴森科技(002436.SZ):ABF载板目前处于小批量生产阶段
Ge Long Hui· 2025-12-10 06:58
格隆汇12月10日丨兴森科技(002436.SZ)在互动平台表示,公司BT载板整体产能规模5万平米/月,原3.5 万平/月产能已满产,新扩1.5万平/月产能处于量产爬坡阶段;ABF载板目前处于小批量生产阶段。 ...
兴森科技:公司BT载板整体产能规模5万平米/月,ABF载板目前处于小批量生产阶段
Mei Ri Jing Ji Xin Wen· 2025-12-10 04:03
(记者 胡玲) 兴森科技(002436.SZ)12月10日在投资者互动平台表示,公司BT载板整体产能规模5万平米/月,原3.5 万平/月产能已满产,新扩1.5万平/月产能处于量产爬坡阶段;ABF载板目前处于小批量生产阶段。 每经AI快讯,有投资者在投资者互动平台提问:请问公司规模量产的是BT载板?还是ABF载板?以哪 种为主? ...
兴森科技:公司IC封装基板为芯片封装原材料
Zheng Quan Ri Bao· 2025-12-05 15:48
(文章来源:证券日报) 证券日报网讯 12月5日,兴森科技在互动平台回答投资者提问时表示,公司IC封装基板为芯片封装原材 料,应用于CPU、GPU、FPGA、ASIC、存储芯片、射频芯片等领域。芯片产品具体应用场景由客户根 据自身需求确定。 ...
兴森科技(002436.SZ):ABF膜是FCBGA封装基板的核心原材料
Ge Long Hui· 2025-12-05 06:57
格隆汇12月5日丨兴森科技(002436.SZ)在投资者互动平台表示,ABF膜是FCBGA封装基板的核心原材 料。 ...
兴森科技:公司FCBGA封装基板项目样品持续交付认证中
Zheng Quan Ri Bao· 2025-12-03 11:13
(文章来源:证券日报) 证券日报网讯 12月3日,兴森科技在互动平台回答投资者提问时表示,公司FCBGA封装基板项目样品 持续交付认证中,数量稳速增加,截至目前,FCBGA封装基板已反馈封测结果均为未发现基板异常。 ...
兴森科技:截至目前,FCBGA封装基板已反馈封测结果均为未发现基板异常
Mei Ri Jing Ji Xin Wen· 2025-12-03 10:48
兴森科技(002436.SZ)12月3日在投资者互动平台表示,公司FCBGA封装基板项目样品持续交付认证 中,数量稳速增加,截至目前,FCBGA封装基板已反馈封测结果均为未发现基板异常。具体客户信息 因保密协议约定不便披露。 (文章来源:每日经济新闻) 每经AI快讯,有投资者在投资者互动平台提问:截止2028年12月1日,公司样品订单数量较上半年数量 有何增长?已交付样品中有没有被哪些公司认证通过的? ...
兴森科技:截至11月28日公司股东总户数为十一万一千余户
Zheng Quan Ri Bao Wang· 2025-12-01 13:40
证券日报网讯12月1日,兴森科技(002436)在互动平台回答投资者提问时表示,截至2025年11月28 日,公司股东总户数为十一万一千余户。 ...
元件板块11月28日涨0.36%,兴森科技领涨,主力资金净流出4982.16万元
Market Overview - The component sector increased by 0.36% on November 28, with Xingsen Technology leading the gains [1] - The Shanghai Composite Index closed at 3888.6, up 0.34%, while the Shenzhen Component Index closed at 12984.08, up 0.85% [1] Top Gainers in the Component Sector - Xingsen Technology (002436) closed at 21.52, up 6.59% with a trading volume of 1.1887 million shares [1] - Gaohua Technology (688539) closed at 37.95, up 5.12% with a trading volume of 82,900 shares [1] - Fenghua Advanced Technology (000636) closed at 16.44, up 5.05% with a trading volume of 467,600 shares [1] - Shunluo Electronics (002138) closed at 36.33, up 4.34% with a trading volume of 125,120 shares [1] - Tianjin Yinlin (002134) closed at 22.52, up 4.11% with a trading volume of 76,500 shares [1] Top Losers in the Component Sector - Jin'an Guoji (002636) closed at 15.67, down 3.87% with a trading volume of 581,300 shares [2] - Zhongfu Circuit (300814) closed at 82.41, down 3.35% with a trading volume of 195,200 shares [2] - Zeceng Electronics (920821) closed at 26.57, down 2.71% with a trading volume of 46,300 shares [2] - Shenghong Technology (300476) closed at 270.70, down 2.33% with a trading volume of 275,800 shares [2] Capital Flow Analysis - The component sector experienced a net outflow of 49.82 million yuan from institutional investors, while retail investors saw a net inflow of 420 million yuan [2][3] - The main stocks with significant net inflows from retail investors include Xingsen Technology and Fenghua Advanced Technology [3] Individual Stock Capital Flow - Fangzheng Technology (600601) had a net inflow of 337.82 million yuan from institutional investors, while it faced a net outflow of 197 million yuan from speculative funds [3] - Xingsen Technology (002436) saw a net inflow of 12.8 million yuan from institutional investors, with a net outflow of 138 million yuan from speculative funds [3] - Jingwang Electronics (603228) had a net inflow of 111.1 million yuan from institutional investors, with a net inflow of 36.74 million yuan from speculative funds [3]
兴森科技股价涨5%,南方基金旗下1只基金位居十大流通股东,持有2461.12万股浮盈赚取2485.73万元
Xin Lang Cai Jing· 2025-11-28 02:31
Core Viewpoint - The stock of Xingsen Technology increased by 5% on November 28, reaching a price of 21.20 CNY per share, with a trading volume of 869 million CNY and a turnover rate of 2.77%, resulting in a total market capitalization of 36.033 billion CNY [1] Group 1: Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province. The company primarily engages in PCB and semiconductor businesses [1] - The revenue composition of Xingsen Technology includes: 71.45% from PCB printed circuit boards, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [1] Group 2: Shareholder Information - Southern Fund's Southern CSI 500 ETF (510500) is among the top ten circulating shareholders of Xingsen Technology, having reduced its holdings by 435,600 shares in the third quarter, now holding 24.6112 million shares, which accounts for 1.63% of circulating shares [2] - The estimated floating profit from this position is approximately 24.8573 million CNY [2] Group 3: Fund Performance - The Southern CSI 500 ETF (510500) has a total asset size of 140.098 billion CNY, with a year-to-date return of 23.3%, ranking 1975 out of 4206 in its category, and a one-year return of 21.6%, ranking 1987 out of 4008 [2] - The fund manager, Luo Wenjie, has been in position for 12 years and 224 days, achieving a best fund return of 145.85% and a worst return of -47.6% during his tenure [3] Group 4: Additional Fund Holdings - The Southern CSI 500 Enhanced Strategy ETF (560100) also holds Xingsen Technology as a significant position, with 38,500 shares, representing 1.18% of the fund's net value [4] - The estimated floating profit from this position is about 38,900 CNY [4] Group 5: Enhanced Strategy ETF Performance - The Southern CSI 500 Enhanced Strategy ETF (560100) has a total asset size of 72.2298 million CNY, with a year-to-date return of 22.17%, ranking 2130 out of 4206, and a one-year return of 22.88%, ranking 1820 out of 4008 [4] - The fund manager, Cui Lei, has been in position for 7 years and 23 days, achieving a best fund return of 167.8% and a worst return of -15.93% during her tenure [5]
兴森科技:CSP封装基板业务和北京兴斐HDI板、类载板业务与原有重要客户的合作均正常推进
Zheng Quan Ri Bao· 2025-11-27 08:44
证券日报网讯 11月27日,兴森科技在互动平台回答投资者提问时表示,公司CSP封装基板业务和北京兴 斐HDI板、类载板业务与原有重要客户的合作均正常推进,具体客户信息因保密协议约定不便披露。 (文章来源:证券日报) ...