Core Insights - On October 24, Xingsen Technology's stock rose by 5.3%, reaching a price of 20.05 CNY per share, with a trading volume of 620 million CNY and a turnover rate of 2.09%, resulting in a total market capitalization of 34.078 billion CNY [1] Company Overview - Shenzhen Xingsen Quick Circuit Technology Co., Ltd. is located in Nanshan District, Shenzhen, Guangdong Province, and was established on March 18, 1999, with its IPO on June 18, 2010 [1] - The company's main business includes PCB (Printed Circuit Board) and semiconductor operations, with revenue composition as follows: PCB business 71.45%, IC packaging substrate 21.09%, other 4.29%, and semiconductor testing board 3.17% [1] Shareholder Analysis - Among the top ten circulating shareholders of Xingsen Technology, a fund under Everbright Pramerica Asset Management holds a significant position. The Everbright Pramerica Credit Enhancing Bond A Class Fund (360013) reduced its holdings by 10.646 million shares in Q2, retaining 11.2931 million shares, which accounts for 0.75% of the circulating shares [2] - The fund has achieved a year-to-date return of 20.86%, ranking 57 out of 6231 in its category, and a one-year return of 28.41%, ranking 22 out of 6005 [2] Fund Management - The fund manager of Everbright Pramerica Credit Enhancing Bond A Class Fund is Huang Bo, who has been in the position for 6 years and 18 days. The fund's total asset size is 14.614 billion CNY, with the best return during his tenure being 89.13% and the worst being 10.02% [3]

Core Viewpoint - The company, Xingsen Technology, provides IC packaging substrates as raw materials for chip packaging, serving clients in various sectors including CPU, GPU, FPGA, ASIC, storage chips, and RF chips [1] Group 1: Product and Market Overview - The company's CSP packaging substrates primarily serve the storage chip and RF chip markets, with nearly two-thirds of the shipments directed towards the storage chip industry, focusing on major clients from South Korea and domestic storage chip manufacturers [1] - The FCBGA packaging substrates offered by the company are applicable for HBM product packaging [1]

证券日报网讯兴森科技10月22日在互动平台回答投资者提问时表示，截至2025年10月20日，公司股东总 户数为十一万八千余户。 （文章来源：证券日报） ...

Core Viewpoint - The stock of Xingsen Technology has shown significant volatility and growth, with a year-to-date increase of 79.33% and a recent rise of 2.00% on October 21, 2023, indicating strong market interest and trading activity [1][2]. Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province. The company primarily engages in PCB and semiconductor businesses, with revenue composition as follows: 71.45% from PCB printed circuit boards, 21.09% from IC packaging substrates, 4.29% from other sources, and 3.17% from semiconductor testing boards [2]. - The company operates within the electronics sector, specifically in the printed circuit board industry, and is associated with concepts such as PCB, 5G, optical communication, Huawei, and robotics [2]. Financial Performance - For the first half of 2025, Xingsen Technology reported a revenue of 3.426 billion yuan, reflecting a year-on-year growth of 18.91%. The net profit attributable to shareholders was 28.83 million yuan, marking a significant increase of 47.85% [2]. - The company has distributed a total of 1.129 billion yuan in dividends since its A-share listing, with 270 million yuan distributed over the past three years [3]. Shareholder Information - As of June 30, 2025, Xingsen Technology had 114,000 shareholders, a decrease of 0.87% from the previous period. The average number of tradable shares per shareholder increased by 0.88% to 13,249 shares [2]. - Notable institutional shareholders include Hong Kong Central Clearing Limited, which increased its holdings by 8.31 million shares, and Southern CSI 500 ETF, which added 3.52 million shares [3].

Core Insights - The stock price of Xingsen Technology increased by 2.05% on October 20, reaching 19.93 CNY per share, with a total market capitalization of 33.874 billion CNY [1] - Year-to-date, the stock has risen by 79.87%, but has seen a decline of 1.43% in the last five trading days and 11.30% over the past 20 days [1] - The company has been active in the stock market, appearing on the "Dragon and Tiger List" three times this year, with the latest appearance on October 15, where it recorded a net buy of 113 million CNY [1] Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province [2] - The company's main business includes PCB (Printed Circuit Board) and semiconductor-related activities, with revenue composition as follows: PCB business 71.45%, IC packaging substrate 21.09%, other 4.29%, and semiconductor testing board 3.17% [2] - The company operates within the electronics sector, specifically in the printed circuit board industry, and is associated with concepts such as 5G, optical communication, Huawei, and robotics [2] Financial Performance - For the first half of 2025, Xingsen Technology reported a revenue of 3.426 billion CNY, reflecting a year-on-year growth of 18.91%, and a net profit attributable to shareholders of 28.8329 million CNY, up 47.85% year-on-year [2] - The company has distributed a total of 1.129 billion CNY in dividends since its A-share listing, with 270 million CNY distributed over the past three years [3] Shareholder Structure - As of June 30, 2025, the number of shareholders decreased by 0.87% to 114,000, with an average of 13,249 shares held per shareholder, an increase of 0.88% [2] - Major shareholders include Hong Kong Central Clearing Limited, which increased its holdings by 8.3105 million shares, and Southern CSI 500 ETF, which added 3.5190 million shares [3]

证券代码：002436 证券简称：兴森科技 公告编号：2025-10-057 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 深圳市兴森快捷电路科技股份有限公司（以下简称"公司"）董事会于近日收到 独立董事丁亭亭先生及副总经理、财务负责人王凯先生递交的辞职报告。具体如下： 深圳市兴森快捷电路科技股份有限公司 关于独立董事、高级管理人员辞职的公告 根据《公司法》《深圳证券交易所上市公司自律监管指引第 1 号——主板上市公 司规范运作》《公司章程》等相关规定，王凯先生的书面辞职报告自送达公司董事会 时生效，王凯先生所负责的工作已全部完成交接，其辞职不会对公司生产经营产生影 响。公司将在最近一次董事会完成财务负责人的选聘工作，在聘任新的财务负责人之 前，暂由公司董事、董事会秘书、副总经理蒋威先生代行财务负责人职责。 三、其他相关 截至本公告披露日，丁亭亭先生、王凯先生均未持有公司股份，也均不存在按照 相关监管规定应履行而未履行的任何承诺。 丁亭亭先生在担任公司独立董事期间，王凯先生在担任公司副总经理、财务负责 人期间均勤勉尽责、恪尽职守，为公司规范运作及经营发展发挥 ...

Core Viewpoint - The company announced the resignation of independent director Ding Tingting and vice general manager and financial officer Wang Kai due to personal reasons, with plans to expedite the election of a new independent director and appoint a new financial officer [1] Group 1 - Ding Tingting's resignation will take effect after the election of a new independent director [1] - Wang Kai's resignation will be effective immediately upon delivery to the board [1] - The company will review the proposal for the election of a new independent director at the next board meeting and aims to complete the process promptly [1] Group 2 - In the interim, the responsibilities of the financial officer will be assumed by Jiang Wei, who is a director, board secretary, and vice general manager [1]

Core Viewpoint - The company, Xingsen Technology (002436.SZ), clarified on an interactive platform that it does not engage in packaging business, but its FCBGA packaging substrate can be used for HBM3E packaging [1] Group 1 - The company does not involve itself in the packaging business [1] - FCBGA packaging substrate is applicable for HBM3E packaging [1]

Group 1 - The optical communication module sector is leading the market with a rise of 2.5% [2] - Among the companies, Zhongji Xuchuang increased by 6.96%, Xinyi Sheng by 4.07%, and Changxin Bochuang by 3.89% [2] - Other companies such as Dongtianwei, Zhishang Technology, and Xingsen Technology also saw gains exceeding 3% [2]

Core Insights - The stock price of Xingsen Technology increased by 2.08% on October 16, reaching 21.07 CNY per share, with a total market capitalization of 35.812 billion CNY [1] - Year-to-date, the stock has risen by 90.16%, but has seen a decline of 6.36% over the last five trading days [1] - The company has reported a revenue of 3.426 billion CNY for the first half of 2025, reflecting a year-on-year growth of 18.91% [2] Company Overview - Xingsen Technology, established on March 18, 1999, and listed on June 18, 2010, is located in Shenzhen, Guangdong Province [2] - The company's main business includes PCB (Printed Circuit Board) and semiconductor-related activities, with PCB accounting for 71.45% of revenue [2] - As of October 10, 2023, the number of shareholders is 114,000, a decrease of 0.87% from the previous period [2] Financial Performance - The net profit attributable to the parent company for the first half of 2025 was 28.8329 million CNY, a year-on-year increase of 47.85% [2] - Cumulatively, the company has distributed 1.129 billion CNY in dividends since its A-share listing, with 270 million CNY distributed over the last three years [3] Shareholding Structure - As of June 30, 2025, the top ten circulating shareholders include Hong Kong Central Clearing Limited and Southern CSI 500 ETF, with respective holdings of 33.6164 million shares and 25.0468 million shares [3] - The shareholding of Hong Kong Central Clearing Limited increased by 8.3105 million shares compared to the previous period [3]