记者同时以投资者身份致电传闻涉及的另一方兴森科技，接线工作人员表示，所有信息应以官方公告为 准，不会透露具体客户合作细节，公司会在必要时进行澄清。截至发稿，记者未在深交所信息披露平台 查询到，兴森科技有发布与英伟达订单相关的公告。查看原文：丢了英伟达的订单？胜宏科技回应：客 户订单暂无大变动刚刚 南方财经11月18日电，21财经《辟谣财知道》注意到，市场传出一篇彭博的文章称：英伟达 （NVDA.US）已与兴森科技（002436.SZ）达成合作，将此前由胜宏科技（300476.SZ）独家供应的 20%高阶高密度互连板(HDI)订单交由其承接。对此，21财经《辟谣财知道》以投资者身份致电胜宏科 技，接线工作人员表示，公司留意到相关谣言后，与彭博取得联系，其反馈称未发过相关新闻。公司在 彭博相关网站上亦未查询到有上述传闻信息，因此判定上述传闻不实。 对于市场最为关心的订单情况，上述接线工作人员表示，尽管出于商业保密原则无法披露具体客户信 息，但公司当前整体经营态势良好，订单情况保持乐观，核心客户订单未发生较大变动。 ...

Core Viewpoint - The company, as the leading domestic FCBGA packaging substrate provider, is actively working to break the Japanese monopoly on raw material supply by collaborating with various companies beyond Huazheng New Materials [2]. Group 1 - The company is engaged in verification work for domestic materials and equipment in collaboration with clients [2]. - Material suppliers are primarily designated by clients, indicating a client-driven approach to sourcing [2]. - Future plans for material introduction will depend on client schedules and the technical capabilities of suppliers [2].

Core Insights - On November 17, 2023, Xingsen Technology's stock rose by 4.01%, with a trading volume of 1.731 billion yuan [1] - The company reported a financing buy-in of 140 million yuan and a net financing outflow of approximately 90.56 million yuan on the same day [1] - As of November 17, the total margin balance for Xingsen Technology was 2.391 billion yuan, indicating a high level of financing activity [1] Financing Summary - On November 17, Xingsen Technology had a financing buy-in of 140 million yuan, with a current financing balance of 2.370 billion yuan, representing 6.64% of its market capitalization [1] - The financing balance is above the 90th percentile of the past year, indicating a high level of leverage [1] - In terms of securities lending, 195,700 shares were repaid, while 17,800 shares were sold short, with a total short balance of 20.968 million yuan, also above the 90th percentile of the past year [1] Shareholder and Financial Performance - As of November 10, 2023, Xingsen Technology had 124,000 shareholders, an increase of 4.20%, with an average of 12,181 shares per shareholder, a decrease of 4.03% [2] - For the period from January to September 2025, the company achieved a revenue of 5.373 billion yuan, a year-on-year increase of 23.48%, and a net profit attributable to shareholders of 131 million yuan, a significant increase of 516.08% [2] Dividend and Institutional Holdings - Since its A-share listing, Xingsen Technology has distributed a total of 1.129 billion yuan in dividends, with 270 million yuan distributed over the past three years [3] - As of September 30, 2025, the top ten circulating shareholders included Hong Kong Central Clearing Limited and Southern CSI 500 ETF, with notable changes in their holdings [3]

登录新浪财经APP 搜索【信披】查看更多考评等级 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记载、误导性陈述或重大遗 漏。 特别提示： 1、本次股东会没有出现否决议案的情形。 2、本次股东会不涉及变更前次股东会决议的情形。 一、会议召开和出席情况 1、深圳市兴森快捷电路科技股份有限公司（以下简称"公司"或"兴森科技"）2025年第三次临时股东会 以现场会议和网络投票相结合的方式召开，其中现场会议于2025年11月17日14:30在广州市黄埔区科学 城光谱中路33号子公司广州兴森快捷电路科技有限公司一楼会议室召开；通过深圳证券交易所交易系统 进行网络投票的时间为2025年11月17日的交易时间，即9:15一9:25，9:30一11:30和13:00一15:00；通过 深圳证券交易所互联网投票系统进行投票的时间为2025年11月17日9:15至2025年11月17日15:00的任意时 间。本次股东会由公司董事会召集，董事长邱醒亚先生主持。本次会议的召集和召开程序符合有关法 律、行政法规、部门规章、规范性文件和《公司章程》的规定。 证券代码：002436 证券简称： 兴森科技 公告编号：20 ...

Group 1 - The article emphasizes that the advanced packaging equipment industry is entering a golden era driven by the AI wave and domestic substitution, with significant growth opportunities arising from the demand for advanced packaging technologies [1][8]. - The global advanced packaging market is projected to grow from $46 billion in 2024 to $79.4 billion by 2030, with a compound annual growth rate (CAGR) of 37% for 2.5D/3D packaging technologies from 2023 to 2029 [7][8]. - The Chinese semiconductor packaging equipment market is expected to reach a sales revenue of 28.27 billion yuan in 2024, reflecting an 18.93% year-on-year growth [12]. Group 2 - The article discusses the rapid development of domestic semiconductor packaging equipment manufacturers in China, such as North Huachuang and Shengmei Shanghai, amidst a competitive landscape dominated by international giants [8][9]. - The demand for advanced packaging technologies is driven by the need for high-density integration and improved chip performance, particularly in AI models, data centers, and high-end consumer electronics [7][8]. - The article highlights the evolution of bonding technologies, with a significant shift towards advanced techniques that enhance integration density and performance, such as hybrid bonding and laser debonding [13][16]. Group 3 - The article outlines the critical role of various semiconductor equipment types, including thinning machines, dicing machines, and die bonders, in the advanced packaging process, emphasizing the need for precision and efficiency [27][28]. - It notes that the laser cutting technology is gaining traction due to its advantages in energy efficiency and adaptability to complex packaging requirements, with the global wafer cutting equipment market expected to grow significantly [26]. - The article also mentions the importance of surface functionalization technologies in enhancing the performance of advanced packaging, particularly in applications like chip-on-wafer and fan-out packaging [35][39].

Core Viewpoint - The company, Xingsen Technology, is focusing on the development of IC packaging substrates, which are essential materials for chip packaging, targeting various sectors including CPU, GPU, FPGA, ASIC, and storage chips [2] Group 1: Business Focus - The company is strategically advancing its FCBGA packaging substrate business, with customer expansion proceeding as planned [2] - The CSP packaging substrate business is concentrating on storage and RF markets, while also expanding into the automotive sector [2] Group 2: Product Development - The product structure is gradually shifting towards high value-added and high-priced offerings, particularly in multilayer boards [2]

深圳市兴森快捷电路科技股份有限公司 2025 年第三次临时股东会决议公告 证券代码：002436 证券简称： 兴森科技 公告编号：2025-11-063 本公司及董事会全体成员保证信息披露内容的真实、准确和完整， 没有虚假记载、误导性陈述或重大遗漏。 特别提示： 1、本次股东会没有出现否决议案的情形。 2、本次股东会不涉及变更前次股东会决议的情形。 一、会议召开和出席情况 1、深圳市兴森快捷电路科技股份有限公司（以下简称"公司"或"兴森科 技"）2025年第三次临时股东会以现场会议和网络投票相结合的方式召开，其中 现场会议于2025年11月17日14:30在广州市黄埔区科学城光谱中路33号子公司广 州兴森快捷电路科技有限公司一楼会议室召开；通过深圳证券交易所交易系统进 行网络投票的时间为2025年11月17日的交易时间，即9:15—9:25，9:30—11:30 和13:00—15:00；通过深圳证券交易所互联网投票系统进行投票的时间为2025 年11月17日9:15至2025年11月17日15:00的任意时间。本次股东会由公司董事会 召集，董事长邱醒亚先生主持。本次会议的召集和召开程序符合有关法律、行政 法 ...

北京观韬（深圳）律师事务所 本所及经办律师依据《公司法》《证券法》《律师事务所从事证券法律业务 管理办法》和《律师事务所证券法律业务执业规则（试行）》等规定及本法律意 见书出具日以前已经发生或者存在的事实，严格履行了法定职责，遵循了勤勉尽 责和诚实信用原则，进行了充分的核查验证，保证本法律意见所认定的事实真实、 准确、完整，所发表的结论性意见合法、准确，不存在虚假记载、误导性陈述或 者重大遗漏，并承担相应法律责任。 关于深圳市兴森快捷电路科技股份有限公司 2025年第三次临时股东会的法律意见书 观意字2025SZ000085号 致：深圳市兴森快捷电路科技股份有限公司 北京观韬（深圳）律师事务所（以下简称"本所"）接受深圳市兴森快捷电 路科技股份有限公司（以下简称"兴森科技"或"公司"）的委托，指派律师列 席兴森科技于2025年11月17日召开的2025年第三次临时股东会（以下简称"本次 股东会"），并依据《中华人民共和国公司法》（以下简称"《公司法》"）、 《中华人民共和国证券法》(以下简称"《证券法》")、中国证券监督管理委员 会《上市公司股东会规则》(以下简称"《股东会规则》")等中国现行法律、法 规和规 ...

| 交易日期 | 证券代码 | 证券简称 | 成交价格 | 成交量 | 成交金额 | 买方营业部 | 卖方营业部 | | --- | --- | --- | --- | --- | --- | --- | --- | | | | | (元) | (万股/万份) | (万元) | | | | 2025-11-17 | 002436 | 兴森科技 | 19.50 | 13.50 | | 263.25 中国中金财富证券 | 国信证券股份有限 | | | | | | | | 有限公司杭州教工 | 公司杭州体育场路 | | | | | | | | 路班券营业部 | 证券营业部 | 11月17日，兴森科技大宗交易成交13.5万股，成交额263.25万元，占当日总成交额的0.15%，成交价19.5 元，较市场收盘价21.01元折价7.19%。 ...

每经AI快讯，光通信模块板块领涨，上涨2.69%，其中腾景科技上涨14.55%，长芯博创上涨7.23%，光 库科技上涨5.58%，兴森科技、中际旭创、星帅尔涨超4%。 （文章来源：每日经济新闻） ...