Core Viewpoint - The company aims to enhance market expansion and achieve breakthroughs in core business and key customers, leading to revenue growth and profit improvement while rewarding shareholder support and trust [1] Group 1 - The company will strengthen market development efforts [1] - The focus is on achieving breakthroughs in core business and key customers [1] - The company is committed to revenue growth and profit enhancement [1]

证券日报网讯12月16日，兴森科技（002436）在互动平台回答投资者提问时表示，公司持续关注原材料 市场变化，加强供应链管理，与客户保持密切沟通，根据市场情况和具体订单要求等与客户协商产品价 格。 ...

Group 1 - The core viewpoint of the article is that despite the sanctions imposed on ZTE Corporation, the business of Xingsen Technology is not expected to be significantly affected due to its diversified customer base and low customer concentration [1]. Group 2 - Xingsen Technology stated that its customer base includes leading enterprises across multiple industries, which reduces reliance on any single industry or customer [1]. - The company emphasized that it is less impacted by the economic cycles or downturns of major clients or specific industries [1].

Core Viewpoint - The company is making steady progress in the market expansion and customer certification of its FCBGA packaging substrate business, with no abnormalities found in the substrate based on feedback from testing [2]. Group 1: Market and Customer Progress - The company has confirmed that the market expansion and customer certification for its FCBGA packaging substrate business are proceeding as planned [2]. - Feedback from testing has indicated that no abnormalities were found in the substrates, which is a positive sign for product quality [2]. Group 2: Certification and Production Timeline - Product certification typically requires around six months to complete [2]. - The timeline for mass production largely depends on the recovery of industry demand, the customer's own production progress, and their supplier management strategies [2].

Core Viewpoint - The company, Xingsen Technology, confirmed that its PCB, semiconductor test boards, and IC packaging substrate businesses are operating normally, with readiness for mass production in the FCBGA packaging substrate segment depending on industry demand recovery and client progress [2] Group 1 - The company is actively engaged in the production of PCB, semiconductor test boards, and IC packaging substrates [2] - The FCBGA packaging substrate business has achieved sufficient production capacity and product yield for mass production [2] - The timeline for large-scale mass production is primarily influenced by the recovery of industry demand, the production progress of clients, and their supplier management strategies [2]

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，截至2025年12月10 日，公司股东总户数为十一万一千余户。 ...

Group 1 - The core viewpoint of the article is that the company, Xingsen Technology, is focusing on digital transformation and high-end packaging substrate strategies, particularly in the FCBGA packaging substrate market [1] - The company identifies chip design firms and packaging manufacturers as target customers for its packaging substrate business, although specific customer collaborations cannot be disclosed due to confidentiality agreements [1] - The company is accelerating the market expansion of its FCBGA packaging substrate project to enhance its core competitiveness [1]

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，公司海外业务主要分 布在韩国和欧洲，目前美国业务收入占比较小。 ...

证券日报网讯12月15日，兴森科技（002436）在互动平台回答投资者提问时表示，公司不涉及封装业 务，CPO封装主要是用MSAP工艺，公司的产品可用于CPO产品的封装。 ...

格隆汇12月15日丨兴森科技(002436.SZ)在投资者互动平台表示，公司不涉及封装业务，CPO封装主要 是用MSAP工艺，公司的产品可用于CPO产品的封装。 ...