兴森科技所属申万行业为：电子-元件-印制电路板。所属概念板块包括：PCB概念、5G、光通信、华为 概念、毫米波雷达等。 截至9月19日，兴森科技股东户数13.30万，较上期增加13.68%；人均流通股11357股，较上期减少 12.03%。2025年1月-6月，兴森科技实现营业收入34.26亿元，同比增长18.91%；归母净利润2883.29万 元，同比增长47.85%。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止2025年6月30日，兴森科技十大流通股东中，香港中央结算有限公司位居第五大流 通股东，持股3361.64万股，相比上期增加831.05万股。南方中证500ETF（510500）位居第六大流通股 东，持股2504.68万股，相比上期增加351.90万股。光大保德信信用添益债券A类（360013）位居第九大 流通股东，持股1129.31万股，相比上期减少1064.60万股。易方达供给改革混合（002910）退出十大流 通股东之列。 9月25日，兴森科技盘中下跌2.05%，截至09:39，报22.48元/股，成交2.44亿元，换手率0.71%， ...

融资方面，兴森科技当日融资买入4.43亿元。当前融资余额28.91亿元，占流通市值的7.41%，融资余额 超过近一年90%分位水平，处于高位。 融券方面，兴森科技9月24日融券偿还15.78万股，融券卖出2300.00股，按当日收盘价计算，卖出金额 5.28万元；融券余量81.93万股，融券余额1880.29万元，超过近一年90%分位水平，处于高位。 资料显示，深圳市兴森快捷电路科技股份有限公司位于广东省深圳市南山区粤海街道沙河西路与白石路 交汇处深圳湾科技生态园一区2栋A座8层，成立日期1999年3月18日，上市日期2010年6月18日，公司主 营业务涉及PCB业务、半导体业务。主营业务收入构成为：PCB印制电路板71.45%，IC封装基板 21.09%，其他4.29%，半导体测试板3.17%。 9月24日，兴森科技跌1.33%，成交额31.71亿元。两融数据显示，当日兴森科技获融资买入额4.43亿 元，融资偿还2.30亿元，融资净买入2.12亿元。截至9月24日，兴森科技融资融券余额合计29.10亿元。 分红方面，兴森科技A股上市后累计派现11.29亿元。近三年，累计派现2.70亿元。 机构持仓方面，截止 ...

Group 1 - The A-share market saw a collective decline in PCB concept stocks, with notable drops including Dazhu CNC down 9%, Helitai down over 8%, and Aikou Optoelectronics and Chongda Technology down over 7% [1][2] - Specific stock performances included Dazhu CNC with a market cap of 44.3 billion and a year-to-date increase of 190.60%, while Helitai had a market cap of 24.9 billion and a year-to-date increase of 39.33% [2] - Other companies such as Huaguan Technology, Zhixin Precision, and Honghe Technology experienced declines of over 6%, with market caps ranging from 25.84 billion to 331 billion [2]

Group 1 - The A-share market saw a collective decline in PCB concept stocks, with notable drops in several companies [1] - Dazhu CNC experienced a decline of 9.09%, while Helitai fell by 8.77% [2] - Other companies such as Aikemi, Chongda Technology, and Guanghua Technology also reported significant decreases, with drops exceeding 7% [1][2] Group 2 - The total market capitalization of Dazhu CNC is 44.3 billion, and it has increased by 190.60% year-to-date [2] - Helitai's market capitalization stands at 24.9 billion, with a year-to-date increase of 39.33% [2] - Aikemi's market capitalization is approximately 48.13 billion, showing a year-to-date increase of 103.98% [2]

Core Viewpoint - The demand for substrates has increased due to the development of AI, and the company reports a stable upward trend in overall utilization rates [1] Company Summary - The company, Xingsen Technology (002436.SZ), responded to an investor inquiry on September 23, indicating that its overall utilization rate remains stable and is trending upwards [1]

Core Viewpoint - The company, Xingsen Technology, reported that as of September 19, 2025, the total number of shareholders is over 133,000 [1] Summary by Relevant Sections - Shareholder Information - As of September 19, 2025, the total number of shareholders for Xingsen Technology is over 133,000 [1]

Group 1 - The Co-Packaged Optics (CPO) concept has seen a rise of 1.35%, ranking second among concept sectors, with 66 stocks increasing in value [1][2] - Notable stocks that hit the 20% limit up include DeKeLi and HuaFeng Technology, while FengHuo Communication, GuangHe Technology, and ChangFei Optical Fiber also reached their limit up [1] - The top gainers in the CPO sector include GuangKe Technology, LingYun Optical, and ZhongTian Technology, with increases of 15.00%, 12.46%, and 6.97% respectively [1] Group 2 - The CPO sector attracted a net inflow of 1.972 billion yuan, with 57 stocks receiving net inflows, and 24 stocks exceeding 100 million yuan in net inflows [2] - The leading stock in terms of net inflow is Hengtong Optics, which saw a net inflow of 1.172 billion yuan, followed by FengHuo Communication, Industrial Fulian, and ZhongTian Technology with net inflows of 1.012 billion yuan, 867 million yuan, and 786 million yuan respectively [2][3] - The net inflow ratios for Hengtong Optics, FengHuo Communication, and ZhongBei Communication are 28.24%, 23.63%, and 13.96% respectively [3]

Core Viewpoint - The advanced packaging concept sector experienced a slight increase of 0.69% as of the market close on September 18, ranking 9th among concept sectors, with 65 stocks rising, including notable gains from companies like Shanzi Gaoke and Huazheng New Materials, which hit the daily limit up [1][2]. Group 1: Market Performance - The advanced packaging concept sector saw a net outflow of 5.23 billion yuan in main funds, with 49 stocks receiving net inflows, and 11 stocks attracting over 100 million yuan in net inflows [2][3]. - The top net inflow was from Xingsen Technology, which received 565 million yuan, followed by Wentai Technology, Tongfu Microelectronics, and Shengyi Technology with net inflows of 361 million yuan, 313 million yuan, and 253 million yuan respectively [2][3]. Group 2: Stock Performance - The stocks with the highest net inflow ratios included Huazheng New Materials at 19.60%, Landi Group at 14.02%, and Xingsen Technology at 11.16% [3][4]. - Notable stock performances included Huicheng Co., which rose by 14.16%, and Wentai Technology, which increased by 9.60% [1][4]. Group 3: Sector Comparison - Among the concept sectors, F5G concept led with a 1.45% increase, while metals such as lead and zinc saw declines of 3.94% and 3.88% respectively [2]. - The advanced packaging sector's performance was relatively stable compared to other sectors, with a modest increase amidst broader market fluctuations [2].

Group 1 - The HBM concept sector is showing strong performance, with stocks like Xingsen Technology leading the gains [1]

Group 1 - The company, Xingsen Technology (002436.SZ), has indicated that its relevant technologies and products can be applied in CPC technology [1]