（文章来源：证券日报） 证券日报网讯兴森科技11月25日在互动平台回答投资者提问时表示，公司将专注于自身能力提升，加强 市场拓展，争取实现业务突破、规模增长和盈利提升，努力回馈股东的支持和信任。 ...

Core Viewpoint - The company, Xingsen Technology, specializes in IC packaging substrates, which are essential raw materials for chip packaging, targeting chip design companies and packaging manufacturers as its primary customers [1] Group 1 - The company confirmed on November 24 that its IC packaging substrates serve as raw materials for chip packaging [1] - The specific clients and business cooperation details are not disclosed due to confidentiality agreements [1]

Group 1 - The company, Xingsen Technology, confirmed that cooperation with major clients is progressing normally [2] - The expansion of production capacity is expected to enhance the scale of CSP packaging substrate business [2]

（文章来源：证券日报） 证券日报网讯兴森科技11月24日在互动平台回答投资者提问时表示，截至2025年11月20日，公司股东总 户数为十一万九千余户。 ...

Core Viewpoint - The company, Xingsen Technology, has indicated that its CSP packaging substrate customer base includes major Korean and domestic memory chip clients, with product pricing and gross margins being dependent on specific product structure, size, and processes, making it difficult to generalize [1] Group 1 - The customer base for Xingsen Technology's CSP packaging substrates includes both Korean and domestic major memory chip clients [1] - Product pricing and gross margins are influenced by specific factors such as product structure, size, and manufacturing processes [1] - The company emphasizes that it is not feasible to generalize pricing and gross margin information across all products [1]

Core Viewpoint - The company, Xingsen Technology, has confirmed its position in the FCBGA packaging substrate market, highlighting the competitive landscape among domestic manufacturers [1] Group 1: Company Insights - Xingsen Technology is one of the domestic manufacturers capable of mass production of FCBGA packaging substrates [1] - Other companies with similar capabilities include Shenzhen South Circuit, Zhuhai Yuya, and Anjieli Meiwai, each with varying production capacities, technical capabilities, and mass production progress [1]

Core Viewpoint - The company aims to enhance its technical capabilities, process capabilities, yield levels, and delivery performance to deepen customer cooperation and increase customer stickiness [2] Group 1 - The company is focused on continuous improvement in technology and processes to strengthen customer relationships [2] - The strategy includes enhancing yield levels and delivery performance to improve overall service quality [2] - The goal is to increase the depth and breadth of customer cooperation, thereby boosting customer loyalty [2]

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]

Core Viewpoint - The company, Xingsen Technology, indicated that its operational status will be detailed in upcoming periodic reports [1] Group 1 - The company responded to investor inquiries on November 21 regarding its business operations [1]

Core Viewpoint - The company, Xingsen Technology, is experiencing a recovery in the downstream storage chip sector, leading to a full order book for its CSP packaging substrates, indicating a positive market outlook [1] Group 1: Company Operations - The application fields of the company's chip products are determined by customer needs, with specific customer information kept confidential due to non-disclosure agreements [1] - The FCBGA packaging substrate project is currently in small-batch production, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]