从资金流向上来看，当日元件板块主力资金净流出5.81亿元，游资资金净流入1.5亿元，散户资金净流入 4.31亿元。元件板块个股资金流向见下表： 以上内容为证券之星据公开信息整理，由AI算法生成（网信算备310104345710301240019号），不构成投资建议。 | 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 688183 | 生益电子 | 53.17 | 6.11% | 40.31万 | 22.13 乙 | | 600183 | 生益科技 | 42.92 | 3.80% | 45.23万 | 19.44 Z | | 300657 | 弘信电子 | 29.61 | 3.42% | 47.86万 | 14.18亿 | | 002463 | 沪电股份 | 56.27 | 3.29% | 83.61万 | 47.46亿 | | 300319 | 麦捷科技 | 11.45 | 3.15% | 51.43万 | 5.78亿 | | 002384 | 东山精密 | 58.49 | 3.14% | 95. ...

格隆汇7月31日｜A股PCB概念持续拉升，东山精密、兴森科技、芯碁微装、生益科技、东材科技、生 益电子、胜宏科技、沪电股份盘中创历史新高，宏和科技涨停，德龙激光、中一科技、正业科技、方邦 股份、德福科技跟涨。 消息上，人工智能浪潮下，被誉为"电子产品之母"的PCB(印制电路板)产业链迎 来高景气。从已经披露的中报业绩预告来看，沪电股份、广合科技、鹏鼎控股、南亚新材、满坤科技等 A股上市公司均预计2025年上半年归属于上市公司股东的净利润下限同比增长超40%。 ...

Summary of Key Points Core Viewpoint - As of July 30, the margin financing and securities lending balance in the Shanghai and Shenzhen markets reached 1,978.407 billion yuan, reflecting an increase of 2.099 billion yuan from the previous trading day [1]. Market Overview - The financing balance was 1,964.255 billion yuan, up by 2.167 billion yuan compared to the previous day [1]. - The Shanghai market's margin balance was 1,011.196 billion yuan, increasing by 0.391 billion yuan, while the Shenzhen market's balance was 967.21 billion yuan, rising by 1.708 billion yuan [1]. Stock Performance - A total of 1,713 stocks experienced net inflows of financing funds [3]. - 43 stocks had net financing inflows exceeding 10% of their total trading volume, with the top three being Songji Co., Ltd. (23.02%), Conglin Technology (22.58%), and Ruilian New Materials (21.57%) [3][4]. Significant Net Inflows - 17 stocks had net inflows exceeding 100 million yuan, with WuXi AppTec, CATL, and Baosteel ranking first, second, and third, with net inflows of 447 million yuan, 437 million yuan, and 419 million yuan, respectively [7].

（文章来源：证券日报） 证券日报网讯兴森科技7月30日在互动平台回答投资者提问时表示，公司具备COWOP封装相关的技术 和产品，主要应用领域包括高速服务器架构等。 ...

Core Viewpoint - The company has advanced technologies and products applicable in the COWOP packaging field, including Tenting reduction method, Msap improved semi-additive method, and SAP semi-additive method [1] Group 1 - The company responded to investor inquiries on July 30, indicating its capabilities in specific packaging technologies [1]

Group 1 - The company has the capability to utilize Tenting reduction method, Msap improved semi-additive method, and SAP semi-additive method in its processes [2] - The relevant technologies and products can be applied in the COWOP packaging field [2]

Group 1 - The company, Xingsen Technology, has announced its capabilities in Tenting reduction method, Msap improved semi-additive method, and SAP semi-additive method processes [1] - The related technologies and products are applicable in the COWOP packaging field [1]

Core Viewpoint - On July 30, 2023, Xingsen Technology's stock price increased by 5.2%, reaching 19.22 CNY per share, with a trading volume of 1.38 billion CNY and a turnover rate of 4.93%, resulting in a total market capitalization of 32.668 billion CNY [1] Company Overview - Shenzhen Xingsen Quick Circuit Technology Co., Ltd. is located in the Shenzhen Bay Technology Eco-Park and specializes in providing advanced electronic circuit solutions, covering the entire process from design to testing and delivery [1] - The company possesses core technologies and mass production capabilities in the integrated circuit manufacturing sector, with products spanning the electronic hardware packaging field [1] - Xingsen Technology has achieved significant performance in various sectors, including communications, data centers, industrial control, medical, and consumer electronics, earning the trust of global benchmark clients [1] Financial Performance - For the period from January to March 2025, Xingsen Technology reported operating revenue of 1.58 billion CNY, reflecting a year-on-year growth of 13.77% [1] - The net profit attributable to shareholders was 9.3724 million CNY, which represents a year-on-year decrease of 62.24% [1] Shareholder Information - As of July 18, 2023, Xingsen Technology had 86,000 shareholders, with an average of 17,400 circulating shares per person [1]

-今日A股共有15只个股振幅超过20%； -三元基因、基康技术、上纬新材等个股振幅居前； 【主力资金】 -主力资金今日净流入医药生物、银行、交通运输、通信、煤炭等板块，净流出计算机、电子、机械设 备、电力设备、有色金属等板块； -新易盛、云南锗业、紫光国微、祥鑫科技、天孚通信主力资金净流入规模居前，分别净流入12.77亿 元、5.65亿元、5.26亿元、4.56亿元、4.42亿元； -孩子王、兴森科技、东方财富、光迅科技、硕贝德主力资金净流出规模居前，分别净流出9.42亿元、 7.79亿元、6.18亿元、5.51亿元、5.16亿元。 【换手率高】 -今日A股共有22只个股换手率超过30%，5股换手率超40%； -北方长龙、贝因美、南方路机等个股换手率居前； ...

证券代码：002436 证券简称：兴森科技 公告编号：2025-07-043 深圳市兴森快捷电路科技股份有限公司 关于购买子公司广州兴科半导体有限公司 24%股权完成过户的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有 虚假记载、误导性陈述或重大遗漏。 深圳市兴森快捷电路科技股份有限公司（以下简称"公司"）于 2025 年 6 月 11 日召 开第七届董事会第八次会议，审议通过了《关于拟参与购买子公司广州兴科半导体有限公 司 24%股权的议案》，同意公司以挂牌底价 31,998.7727 万元进场参与购买子公司广州兴 科半导体有限公司（以下简称"广州兴科"）少数股东国家集成电路产业投资基金股份有 限公司（以下简称"大基金"）所持有的广州兴科 24%股权（以下简称"标的股权"）。 详见公司披露的《关于拟参与购买子公司广州兴科半导体有限公司 24%股权的公告》 （2025-06-033）、《关于购买子公司广州兴科半导体有限公司 24%股权的进展公告》 （2025-07-039）。 截至本公告日，广州兴科已完成了股东变更相关的工商登记手续及公司章程备案。具 体登记信息如下： 名称：广州兴科半导 ...