（来源：淘金ETF） 1. 先导智能（300450） 作为高端智能装备领域的重要企业，公司在精密制造与自动化方案上具备较强竞争力，业务覆盖新能源 装备与电子制造装备。公司为PCB行业提供高精度裁切、成型、检测等自动化生产设备，助力高多层 板、HDI板等高端产品提升生产效率与良率。随着AI服务器与数据中心建设加速，PCB行业对高端制程 装备需求持续提升，公司凭借在运动控制、精密集成方面的技术积累，不断优化适配通信板、汽车板的 装备方案。相关产品可满足头部PCB厂商扩产与技术改造需求，在电子制造装备国产化过程中保持稳定 迭代，与行业高端化、智能化发展方向高度契合，为PCB产业链提供可靠的制程装备支持，在高端制造 环节形成自身独特的行业价值。 2. 方正科技（600601） 公司背景具有国资属性，在电子信息领域拥有长期产业积淀。公司主营印制电路板的研发、生产与销 售，产品覆盖通信基站板、工业控制板、消费电子板等，广泛应用于网络设备、工业终端、智能家居等 场景。企业持续推进PCB产线工艺升级，重点提升高多层板与高频高速板占比，强化产品可靠性与信号 传输性能，以适配5G通信、工业互联网等领域的升级需求。在行业向集中化、 ...

（来源：淘金ETF） 1. 中际旭创（300308）作为全球高速光模块领域的绝对龙头企业，中际旭创深度绑定英伟达、微软、谷 歌等北美头部云厂商，是AI算力爆发周期内最具确定性的核心受益标的。800G与1.6T高速光模块出货 量稳居全球前列，产品结构持续向高端迭代，毛利率与盈利水平稳步抬升。随着英伟达GB300与Rubin 新一代算力平台规模化落地，单机光模块用量大幅提升，直接推动公司订单持续高增。在CPO共封装光 学领域，企业技术储备完善，与产业链上下游协同推进下一代互联方案，长期成长空间进一步打开。北 美四大云厂商资本开支同比增长超60%，叠加英伟达业绩超预期，公司未来两年业绩确定性极高，产能 持续满载，客户结构优质且壁垒深厚，是光模块板块中业绩弹性最强、成长逻辑最清晰的龙头企业。 2. 新易盛（300502） 专注于高速光模块研发、生产与销售的新易盛，是国内少数具备全球竞争力的核心企业，产品覆盖数据 中心、电信传输全场景，在400G、800G高端模块领域出货量位居行业第一梯队。企业海外收入占比 高，深度绑定全球主流云厂商与设备商，订单能见度高且交付能力突出。受益于AI数据中心建设提速 与高速互联需求爆发， ...

证券日报网讯2月26日，兴森科技（002436）在互动平台回答投资者提问时表示，总投资超18.5亿元并 非公司单一项目，是包含其他公司在内的所有签约项目。公司项目投资额未达到披露标准。公司严格按 照监管规定履行信息披露义务。 ...

格隆汇2月26日丨兴森科技(002436.SZ)涨1.79%，报26.770元，股价创历史新高，总市值455.00亿元。 ...

在AI算力（核心股）需求爆发、高带宽存储器（HBM）技术迭代加速的背景下，A股HBM（高带宽存 储器）产业链今日迎来集体爆发，从上游材料、设备到封装测试，各环节个股纷纷走强，资金关注度持 续提升。拓荆科技、宏昌电子、精智达、联瑞新材、芯碁微装领涨，板块产业链相关企业整理如下： 拓荆科技（688072.SH） 宏昌电子（603002.SZ） 最新股价：11.54元 日涨幅：+8.97% 核心看点：国内电子级环氧树脂龙头，电子级环氧树脂是HBM建设所需材料环氧塑封料的上游，为 HBM封装提供关键基材支撑。 精智达（688627.SH） 最新股价：313.00元 日涨幅：+7.28% 最新股价：360.00元 日涨幅：+9.98% 核心看点：拟减持；国内ALD设备主要供应商之一，ALD沉积在HBM工艺中不可或缺，设备广泛应用 于HBM制造的关键环节。 核心看点：根据新技术和新应用在半导体（核心股）存储器方面的新要求，配合客户业务稳步推进开发 针对如HBM等新一代半导体存储器测试需求的测试技术和设备，为客户提供可应用于HBM领域的完整 测试方案。 联瑞新材（688300.SH） 最新股价：68.50元 日涨幅：+6. ...

每经AI快讯，有投资者在投资者互动平台提问：董秘您好，请简要分析一下今年行业需求与贵司相关 业务可否延续去年供不应求状态；目前贵司FCBGA封装基板业务与相关客户的验测状况是否顺利，今 年可否扭亏为盈？最后一个问题，目前最新股东人数是多少？感谢董秘！ 兴森科技（002436.SZ）2月24日在投资者互动平台表示，尊敬的投资者，您好！2025年以来全球PCB行 业仍延续结构分化的复苏态势，AI产业仍为主要驱动力。根据Prismark报告，预计2025年全球PCB行业 的产值为848.91亿美元、同比增长15.4%。公司CSP封装基板业务行业整体需求较好，后期公司将根据 市场需求情况适时启动扩产。公司FCBGA封装基板业务市场拓展、客户认证均按计划稳步推进中，具 体业务情况请关注公司定期报告。截至2026年2月10日，公司股东总户数为十二万七千余户。感谢您的 关注。 （文章来源：每日经济新闻） ...

证券日报网讯 2月24日，兴森科技在互动平台回答投资者提问时表示，截至2026年2月10日，公司股东 总户数为十二万七千余户。 （文章来源：证券日报） ...

Core Insights - The report highlights the expected recovery in the semiconductor industry, with specific companies poised to benefit from this trend, particularly in the IC substrate market driven by AI demand [7][9][10]. Company Summaries - **兴森科技 (Xingsen Technology)**: The company is projected to achieve a net profit of between 132 million to 140 million yuan in 2025, marking a significant turnaround from previous losses. This improvement is attributed to stable revenue growth and the recovery of its main business segments [8]. - **江丰电子 (Jiangfeng Electronics)**: The company is noted for its strategic positioning in both BT and ABF substrates, which are critical for AI applications. The demand for IC substrates is expected to surge, with the global market projected to grow from 16.69 billion USD in 2025 to 18.44 billion USD in 2026, and further to 45.34 billion USD by 2035, indicating a robust CAGR of 10.51% from 2026 to 2035 [10][11]. Industry Insights - The IC substrate market is experiencing a significant demand increase due to the rise of AI applications, with supply constraints leading to price increases. The supply-demand gap for ABF substrates is particularly pronounced, with a reported shortfall of 21% and prices rising by 38% over the past year [9][10]. - The report emphasizes the critical role of IC substrates in supporting AI computing power upgrades, with the technology's evolution being driven by the increasing density and performance requirements of AI chips [10].

Investment Rating - The report does not explicitly provide an investment rating for the semiconductor materials industry Core Insights - The global semiconductor materials market is characterized by "long-term growth and cyclical fluctuations," with the market size expected to grow from $27.5 billion in 2000 to $67.47 billion by 2024, driven by the demand for advanced semiconductor materials in various high-tech applications [3][5] - China's semiconductor materials industry has made significant progress in mid-to-low-end products but still relies heavily on imports for high-end materials, indicating a substantial opportunity for domestic production and technological breakthroughs [1][10] - The report emphasizes the need for a dual approach of technological breakthroughs and ecosystem building to drive the development of the semiconductor materials industry, supported by government policies and strategic collaborations [1][23] Industry Overview - Semiconductor materials are critical strategic materials for the semiconductor industry, with the market experiencing long-term growth and cyclical fluctuations due to factors such as industry cycles and end-user demand [2][3] - The market structure is shifting as the industry chain relocates and domestic production increases, with China rapidly expanding its market share driven by local demand and government policies [5][10] - The report highlights the significant market concentration in the semiconductor materials sector, with a few leading companies dominating the market [10] Industry Bottlenecks - Despite achieving local supply capabilities in mid-to-low-end products, China still faces challenges in high-end semiconductor materials, which remain heavily reliant on imports [10][13] - Key areas such as silicon wafers, electronic specialty gases, and photoresists are identified as critical segments where domestic production is lagging behind, with high-end products still largely imported [13][18][21] - The report notes that the domestic supply of electronic specialty gases is weak, with an overall localization rate of about 15% expected in 2024, indicating a significant gap in high-end product capabilities [16] Path to Breakthrough - The semiconductor materials industry must focus on technological advancements and ecosystem development, emphasizing collaboration between academia, research institutions, and leading enterprises to address core technological challenges [23][24] - Establishing a robust and efficient results transformation chain is crucial, with a focus on concept validation, pilot testing, and mass production to enhance the commercialization of technological innovations [24][25] - The report advocates for a self-sufficient and sustainable industry ecosystem, extending upstream to secure high-purity raw materials and key equipment while deepening collaboration with downstream chip design and manufacturing companies [25] Policy Empowerment - National policies are increasingly directing the industry towards key areas, with a focus on advanced semiconductor materials as a strategic priority [26][27] - The establishment of pilot platforms for new materials is highlighted as a key initiative to support the industry's development, with plans to create approximately 300 local pilot platforms by 2027 [28] - Financial policies are also being implemented to support innovation and market transformation in the new materials sector, including insurance compensation for high-risk areas [29] Future Outlook - The semiconductor materials industry is expected to evolve towards a high-quality development phase, balancing quality and safety while fostering collaboration between domestic and international players [34] - The focus will shift from isolated breakthroughs to collaborative ecosystems, with an emphasis on meeting the increasing demands for material purity, performance, and stability from downstream applications [34]

（文章来源：证券日报） 证券日报网讯 2月12日，兴森科技在互动平台回答投资者提问时表示，FCBGA封装基板业务进度主要 取决于行业需求恢复状况、客户自身的量产进展及其供应商管理策略，公司层面主要在于提升技术能 力、良率水准，并加强市场拓展，为未来的大批量量产打下坚实的基础，具体业务情况请关注公司定期 报告。 ...