Core Viewpoint - The company aims to enhance its technical capabilities, process capabilities, yield levels, and delivery performance to deepen customer cooperation and increase customer stickiness [2] Group 1 - The company is focused on continuous improvement in technology and processes to strengthen customer relationships [2] - The strategy includes enhancing yield levels and delivery performance to improve overall service quality [2] - The goal is to increase the depth and breadth of customer cooperation, thereby boosting customer loyalty [2]

Core Viewpoint - The company Xingsen Technology (002436) has confirmed that its CSP packaging substrates are primarily used in storage chips, and its technology and production capacity can meet the demands of downstream customers [1] Group 1 - The main application area for the company's CSP packaging substrates is in storage chips [1] - The company has the technological capabilities to satisfy the needs of its downstream clients [1]

Core Viewpoint - The company, Xingsen Technology, indicated that its operational status will be detailed in upcoming periodic reports [1] Group 1 - The company responded to investor inquiries on November 21 regarding its business operations [1]

Core Viewpoint - The company, Xingsen Technology, is experiencing a recovery in the downstream storage chip sector, leading to a full order book for its CSP packaging substrates, indicating a positive market outlook [1] Group 1: Company Operations - The application fields of the company's chip products are determined by customer needs, with specific customer information kept confidential due to non-disclosure agreements [1] - The FCBGA packaging substrate project is currently in small-batch production, with market expansion and customer certification progressing as planned [1] - The timeline for mass production largely depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company indicates that the application fields of its chip products are determined by customer needs, with specific customer information being confidential due to non-disclosure agreements [1] Group 1: Company Performance - The company reports a full order book for CSP packaging substrates due to the recovery in the downstream storage chip sector, suggesting that overall market conditions are expected to remain favorable [1] - The FCBGA packaging substrate project is currently in the small-batch production stage, with market expansion and customer certification progressing as planned [1] Group 2: Market Dynamics - The timeline for mass production of the FCBGA project primarily depends on the recovery of industry demand, the production progress of customers, and their supplier management strategies [1]

Core Viewpoint - The company, Xingsen Technology, has confirmed that one of the main application areas for its CSP packaging substrates is storage chips, indicating that its technology and production capacity can meet downstream customer demands [1]. Group 1 - The company specializes in CSP packaging substrates [1] - The primary application area for the company's products is in storage chips [1] - The company's technology and production capacity are aligned with the needs of downstream customers [1]

Core Viewpoint - Recent rumors suggested that Nvidia (NVDA.US) has partnered with Xingsen Technology (002436.SZ) to take over 20% of high-end high-density interconnect (HDI) board orders previously supplied exclusively by Shenghong Technology (300476.SZ). However, both Shenghong Technology and Xingsen Technology have denied these rumors, stating that no such agreements have been made and that their order situations remain stable and optimistic [1][3]. Company Insights - Shenghong Technology has confirmed that it has not received any official communication from Bloomberg regarding the rumored partnership and has not found any related information on Bloomberg's website. The company maintains that its overall business performance is good, and core customer orders have not significantly changed [1][3]. - Xingsen Technology has stated that all information should be based on official announcements and will not disclose specific customer cooperation details. As of the report's publication, no announcements related to Nvidia orders have been found on the Shenzhen Stock Exchange information disclosure platform [3]. Industry Context - HDI (High-Density Interconnect) boards are advanced PCB technologies developed to meet the demands of miniaturization, high integration, and high performance in electronic devices. This segment is characterized by high added value and significant technical barriers compared to traditional PCBs [3]. - Shenghong Technology is one of the first companies globally to achieve large-scale production of 6-layer 24-layer HDI boards and possesses capabilities for 8-layer 28-layer HDI and 16-layer arbitrary interconnection HDI technology. High-layer and high-end HDI PCBs are essential for high-density wiring and high-speed signal transmission in AI servers and other high-performance computing devices [3]. - Xingsen Technology's main business includes the research, production, and sales of circuit boards, with applications in consumer electronics, communication devices, and automotive electronics. The company has disclosed its capabilities in high-end HDI and high-frequency high-speed PCBs, with technology for multilayer boards exceeding 18 layers [3].

Core Viewpoint - Recent rumors suggested that Nvidia (NVDA.US) has partnered with Xingsen Technology (002436.SZ) to take over 20% of high-end HDI board orders previously supplied exclusively by Shenghong Technology (300476.SZ). However, both Shenghong and Xingsen have denied these claims, stating that no such announcements have been made [1][2]. Group 1: Company Responses - Shenghong Technology confirmed that they have not received any official communication regarding the rumored partnership and stated that their overall business situation remains positive with no significant changes in core customer orders [1]. - Xingsen Technology emphasized that all information should be based on official announcements and has not disclosed any specific details about customer collaborations [2]. Group 2: Industry Context - HDI (High-Density Interconnect) boards are advanced PCB technologies developed to meet the demands for miniaturization, high integration, and high performance in electronic devices, representing a high-value segment within the industry [2]. - Shenghong Technology is one of the first companies globally to achieve large-scale production of 6-layer 24-layer HDI boards and possesses advanced capabilities in 8-layer 28-layer HDI and 16-layer arbitrary interconnect HDI technologies, which are essential for high-density wiring and high-speed signal transmission in AI servers and other high-performance devices [2][3]. - Xingsen Technology's main business includes the R&D, production, and sales of circuit boards, with applications in consumer electronics, communication devices, and automotive electronics. They have disclosed capabilities for multilayer boards with over 18 layers in AI servers and optical modules [3].

Group 1 - The company, Xingsen Technology, stated on November 18 that its products have a wide range of applications [2]

（文章来源：证券日报） 证券日报网讯兴森科技11月18日在互动平台回答投资者提问时表示，公司有配合客户进行国产化材料和 设备的验证工作，材料供应商主要由客户指定，后续将根据客户的计划以及供应商的技术能力确定导入 计划。 ...