Core Viewpoint - Chongda Technology (002815.SZ) has demonstrated its capability in producing HDI samples of 5 layers and above, as well as PTFE substrate PCB technology, and can mass-produce 40-layer high multilayer boards [1] Group 1 - The company is committed to keeping pace with cutting-edge technology research and development to meet the demands of the high-end market [1] - Specific customers and projects are not disclosed due to commercial sensitivity [1]

Group 1 - The core point of the article is that Chongda Technology (002815.SZ) has confirmed that its subsidiary, Punowei, produces IC substrates that are indirectly used in Apple's TWS (True Wireless Stereo) headphones and other consumer electronics [1] Group 2 - The company has stated that specific customer and cooperation details cannot be disclosed due to confidentiality agreements [1]

Group 1 - The company, Chongda Technology, confirmed that its subsidiary, Puno Wei, provides IC substrate products that are indirectly used in Apple's TWS (True Wireless Stereo) headphones and other consumer electronics [2] - Due to confidentiality agreements, the company is unable to disclose specific customer details or cooperation specifics [2]

Core Viewpoint - The company, Chongda Technology, has confirmed that its PCB products are applicable in various sectors including commercial aerospace, data centers, servers, and robotics [2]. Group 1: Product Applications - The company's PCB products can be utilized in commercial aerospace for components such as wing control devices [2]. - In the data center and server sector, the company supplies products to major clients like H3C [2]. - The robotics field is also a target market, with applications in robots from companies like Midea KUKA and ABB [2].

Core Viewpoint - The company has advanced capabilities in producing high-layer count PCBs, specifically mentioning the GB300 model which features a 40-layer backplane architecture and a Compute Tray with 22-layer HDI technology [1] Group 1 - The GB300 model utilizes a three-piece PCB design, evolving the layer count from 24 to 40 layers, with 38 layers employing PTFE hybrid technology [1] - The company confirms its ability to mass-produce 40-layer high multilayer boards and has capabilities for 5th generation and above HDI sample production [1] - The company is committed to keeping pace with cutting-edge technology development to meet high-end market demands [1]

Key Points - The company announced that the cumulative number of shares converted from the convertible bonds "崇达转 2" has reached 88,559,687 shares, accounting for 10.03% of the total shares issued before the conversion began, which was 882,546,777 shares [1][5] - The total amount of convertible bonds issued was 14,000,000 bonds, with 35.15% of these bonds converted into shares [1] - The convertible bonds were publicly issued on September 7, 2020, with a total issuance amount of 1,400 million yuan, and each bond has a face value of 100 yuan [2] - The conversion period for the bonds started on March 11, 2021, and will end on September 4, 2026 [2] - The conversion price has been adjusted multiple times, with the latest adjustment setting the price at 10.25 yuan per share effective from May 22, 2025 [5] - The conversion of bonds has led to a dilution of the shareholding percentages of the controlling shareholders, with the combined shareholding of the major shareholders decreasing from 52.64% to 49.13% due to the increase in total share capital [5][6]

Core Viewpoint - The company has decided to exercise its right for early redemption of the convertible bond "崇达转 2" due to market conditions and internal considerations, with a redemption date set for September 17, 2025 [2][5]. Group 1: Convertible Bond Basic Information - The company issued 14 million convertible bonds on September 7, 2020, with a total amount of 1.4 billion RMB [2]. - The bond's conversion period is from March 11, 2021, to September 4, 2026 [2]. - The bond's conversion price has been adjusted multiple times, currently set at 10.25 RMB per share [4][5]. Group 2: Redemption Conditions and Procedures - The early redemption was triggered as the stock price exceeded 130% of the conversion price for 15 trading days [5]. - The redemption price is set at 100.049 RMB per bond, including accrued interest [7]. - The redemption will be executed for all unconverted bonds as of the close of trading on September 16, 2025 [7][8]. Group 3: Shareholder Transactions - The actual controller and major shareholders have not engaged in transactions involving "崇达转 2" in the six months prior to the redemption conditions being met [8]. - There are no plans for these stakeholders to reduce their holdings in "崇达转 2" in the near future [8]. Group 4: Additional Information - Bondholders must process conversion requests through their respective securities companies [9]. - The minimum conversion unit is one bond, and any fractional amounts will be settled in cash [10].

| 证券代码：002815 | 证券简称：崇达技术 | 公告编号：2025-051 | | --- | --- | --- | | 债券代码：128131 | 债券简称：崇达转2 | | 崇达技术股份有限公司 关于提前赎回"崇达转 2"的第五次提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 重要内容提示： 证券代码：002815 证券简称：崇达技术 债券代码：128131 债券简称：崇达转 2 转股价格：人民币 10.25 元/股 1、"崇达转 2"赎回价格：100.049 元/张（含当期应计利息，当期年利率为 2%，且当期利息含税），扣税后的赎回价格以中国证券登记结算有限责任公司深 圳分公司（以下简称"中登公司"）核准的价格为准。 2、赎回条件满足日：2025 年 8 月 22 日 3、"崇达转 2"停止交易日：2025 年 9 月 12 日 4、"崇达转 2"赎回登记日：2025 年 9 月 16 日 5、"崇达转 2"停止转股日：2025 年 9 月 17 日 6、"崇达转 2"赎回日：2025 年 9 月 17 日 7、赎回资金到账日（到达 ...

Core Viewpoint - The PCB industry is experiencing significant growth driven by demand from AI computing, automotive electronics, and data centers, with many companies reporting substantial profit increases in the first half of the year [1][2][4]. Group 1: Industry Performance - Nearly 70% of PCB listed companies reported growth in net profit, with notable increases from companies like Shenghong Technology (up 367%), Junya Technology (up 333%), and Huazheng New Materials (up 328%) [2]. - The PCB market is projected to grow from $73.57 billion in 2024 to $94.66 billion by 2029, with a compound annual growth rate (CAGR) of 5.2% [4]. Group 2: Product Upgrades - The industry is shifting towards high-end products, particularly in AI servers and automotive electronics, with high-frequency and high-speed copper-clad laminates seeing increased demand [2][3]. - Companies like Shenghong Technology are focusing on high-density interconnect (HDI) boards, which require advanced manufacturing processes and have seen supply tightness due to increased demand [3]. Group 3: Cost Pressures - Rising copper prices have led to increased operating costs for PCB manufacturers, with over half of the companies experiencing cost growth outpacing revenue growth [5][6]. - The copper price is expected to remain high, with analysts predicting further increases in the second half of the year, adding pressure on PCB companies to manage costs effectively [6]. Group 4: Capacity Expansion - Companies are actively expanding production capacities, particularly in Southeast Asia, to meet the growing demand for high-end multi-layer PCBs [7][9]. - Significant investments are being made by companies like Jingwang Electronics and Shenghong Technology in new facilities and technology upgrades to enhance their market share in high-end PCB products [7][9]. Group 5: Regional Developments - Southeast Asia is becoming a key region for PCB production, with countries like Thailand and Vietnam attracting investments from major PCB manufacturers [7][8]. - The region is expected to have the highest CAGR of 7.8% from 2024 to 2029, driven by the shift of production from China [7].

Summary of Key Points Core Viewpoint - A total of 657 stocks reported their latest shareholder numbers as of August 20, with 337 stocks showing a decline compared to the previous period, indicating a trend of decreasing shareholder engagement in certain companies [1][3]. Group 1: Shareholder Changes - Among the 657 stocks, 35 stocks experienced a decline in shareholder numbers exceeding 10% [3]. - The stock with the largest decline in shareholder numbers was Huakang Clean, which saw a decrease of 27.60% to 10,900 shareholders, while its stock price increased by 6.11% during the same period [3][5]. - Sheyan Institute reported a 24.78% decrease in shareholder numbers to 32,795, with a cumulative decline of 23.32% in stock price [3][5]. Group 2: Stock Performance - The average increase for concentrated stocks from August 1 to August 10 was 7.13%, slightly underperforming the Shanghai Composite Index, which rose by 7.57% [2]. - Among the stocks with a decline in shareholder numbers, Dongtian Micro had the highest increase of 57.58% since August 1 [2]. Group 3: Industry Insights - The concentrated stocks are primarily found in the machinery, basic chemicals, and pharmaceutical industries, with 45, 37, and 28 stocks respectively [3]. - The performance of concentrated stocks from August 11 onwards averaged an increase of 2.39%, with notable gains from Boyuan Co., Yidong Electronics, and Northern Rare Earth, which rose by 58.87%, 46.30%, and 45.10% respectively [3]. Group 4: Financial Performance - Among the concentrated stocks, 254 have released their semi-annual reports, with Fuji Lai showing the highest net profit growth of 12,430.96% year-on-year [4]. - Nanshan Holdings is expected to report a median net profit of 92 million, reflecting a year-on-year increase of 177.84% [4].