Core Viewpoint - The new controlling shareholder of Dinglong Co., Ltd. (300054) operates in the semiconductor industry, while Zhongyuan Co., Ltd. (SZ300018) focuses on smart grid equipment, and both companies will maintain independent operations without specific collaboration plans [1] Group 1: Company Operations - Zhongyuan Co., Ltd. will continue to focus on its core area of smart grid, emphasizing data collection, intelligent monitoring and operation of power transmission and transformation, and comprehensive energy management [1] - The company aims to enhance its internal governance and market operation capabilities by leveraging the mature experiences of Dinglong Co., Ltd. in management system construction, incentive mechanism design, and investment financing operations [1] Group 2: Financial Strategy - The funds raised from the issuance of shares to specific targets will be used entirely to supplement the company's working capital, supporting the implementation of its development strategy [1] - This financial strategy is expected to strengthen the company's capital strength, optimize its capital structure, and enhance its risk resistance and profitability [1]

证券代码：300054 证券简称：鼎龙股份 公告编号：2025-091 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 关于鼎龙转债预计满足赎回条件的提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 特别提示： 自 2025 年 12 月 12 日至 2025 年 12 月 29 日，湖北鼎龙控股股份有限公司 （以下简称"公司"）股票连续十二个交易日中已有十个交易日的收盘价格不 低于"鼎龙转债"当期转股价格 28.58 元/股的 130%（含 130%，即 37.15 元/ 股），若未来连续十八个交易日内，公司股票有五个交易日的收盘价格不低于 当期转股价格的 130%（含 130%），将触发《湖北鼎龙控股股份有限公司向不 特定对象发行可转换公司债券募集说明书》（以下简称"《募集说明书》"） 中规定的有条件赎回条款。届时，公司有权决定是否按照本次可转债面值加当 期应计利息的价格赎回全部或部分未转股的"鼎龙转债"。 一、可转换公司债券基本情况 （一）可转换公司债券发行上市情况 经中国证券监督管理委员会《关于同意湖北鼎龙控股股份有限 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign imports in this sector [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market size and growth forecasts [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: estimated at $485 million in 2023, with a forecast of $684 million by 2029 [8]. - Domestic companies like Dinglong Co., Guofeng New Materials, and others are positioned to capitalize on these growth opportunities [8]. Competitive Landscape - The article compares domestic and foreign companies in the advanced packaging materials sector, noting that while foreign firms like Fujifilm and Toray dominate, domestic players are emerging rapidly [8]. - The competitive dynamics suggest a potential shift towards domestic production as companies seek to reduce reliance on imports [7][8]. Investment Strategies - Different investment stages in the new materials industry are discussed, emphasizing the importance of assessing team capabilities, market potential, and product maturity at each stage [10]. - The article suggests that investments in more mature companies with established sales channels present lower risks and higher returns [10].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI, epoxy resin, and conductive adhesives are identified as key growth areas, with significant market sizes and growth rates anticipated [8]. Investment Opportunities - The article outlines various advanced packaging materials and their respective market sizes, including: - PSPI: $528 million in 2023, expected to grow significantly [8]. - Conductive adhesives: projected to reach $3 billion by 2026 [8]. - Chip bonding materials: expected to grow from approximately $485 million in 2023 to $684 million by 2029 [8]. - The investment landscape is characterized by a shift towards domestic production, with numerous Chinese companies emerging as competitors to established foreign firms [7][8]. Industry Trends - The article emphasizes the trend of domestic substitution in advanced materials, particularly in sectors heavily reliant on imports from countries like Japan [7][8]. - It highlights the importance of innovation and collaboration among domestic companies to enhance competitiveness in the global market [21]. Strategic Insights - Investment strategies vary across different stages of company development, from seed rounds to pre-IPO phases, with a focus on team capabilities, market potential, and product maturity [10]. - The article suggests that companies in the growth phase with established sales channels and increasing revenue present lower investment risks and higher potential returns [10].

2025 年度持续督导培训情况的报告 深圳证券交易所： 招商证券股份有限公司（以下简称"招商证券"、"保荐机构"）作为湖北鼎 龙控股股份有限公司（以下简称"鼎龙股份"、"公司"）向不特定对象发行可转 换公司债券的持续督导的保荐机构，根据《证券发行上市保荐业务管理办法》《深 圳证券交易所上市公司自律监管指引第 13 号——保荐业务》等相关规定，对鼎 龙股份相关人员进行了 2025 年度持续督导培训，现将相关情况报告如下： 一、培训时间 鼎龙股份持续督导文件 培训情况的报告 招商证券股份有限公司 关于湖北鼎龙控股股份有限公司 鼎龙股份持续督导文件 培训情况的报告 创业板股票上市规则》《深圳证券交易所上市公司自律监管指引第 2 号——创业 板上市公司规范运作》和《深圳证券交易所上市公司自律监管指引第 13 号—— 保荐业务》等规则要求，保荐机构对上市公司相关人员进行了上市公司募集资金 使用管理等方面的培训。 2025 年 12 月 15 日。 二、培训地点 湖北鼎龙控股股份有限公司（湖北省武汉经济开发区东荆河路 1 号公司会议 室），现场及线上视频培训结合。 三、参加培训人员 鼎龙股份控股股东、实际控制人及董事、高 ...

鼎龙股份持续督导文件 定期现场检查报告 招商证券股份有限公司关于湖北鼎龙控股股份有限公司 2025 年度持续督导定期现场检查报告 | 保荐机构名称：招商证券股份有限公司 被保荐公司简称：鼎龙股份 | | --- | | 保荐代表人姓名：李莎 联系电话：0755-8294 3666 | | 保荐代表人姓名：刘智 联系电话：0755-8294 3666 | | 现场检查人员姓名：刘智 | | 现场检查对应期间：2025 年 月（鼎龙转债上市之日）-2025 年 月 4 12 | | 现场检查时间：2025 年 12 月 15 日-2025 年 12 月 17 日 | | 一、现场检查事项 现场检查意见 | | （一）公司治理 是 否 不适用 | | 现场检查手段（查阅公司章程和各项规章制度的具体内容及执行情况；查阅公司三会文件，包 | | 括会议通知、签到表、表决票、会议记录、会议决议等；查阅公司公开信息披露文件；对上市 | | 公司有关人员进行访谈等。） | | 1.公司章程和公司治理制度是否完备、合规 √ | | 2.公司章程和股东会、董事会规则是否得到有效执行 √ | | 3.股东会、董事会会议记录是否完整 ...

Core Viewpoint - The company is actively progressing with the verification and testing of its high-end wafer photoresist products, indicating a commitment to meeting market demands and customer needs [1] Group 1: Product Development - The company has laid out nearly 30 high-end wafer photoresist products, with over 15 undergoing sample verification and more than 10 in gallon sample testing [1] - The verification process is being accelerated through dedicated personnel, quick responses to customer technical needs, and optimization of product formulations [1] Group 2: Communication and Disclosure - The company emphasizes that it will strictly adhere to legal and regulatory obligations regarding information disclosure upon achieving key milestones such as product verification and order acquisition [1]

Core Viewpoint - The company is progressing well with its second phase project of producing 300 tons of high-end wafer photoresist, expected to enter trial operation by Q4 2025, with current orders and production capacity meeting client demands [1] Group 1: Project Development - The second phase project for producing 300 tons of KrF/ArF high-end wafer photoresist is on track to begin trial operations as planned [1] - The overall progress of the project is reported to be good, indicating effective project management and execution [1] Group 2: Production and Orders - The company has secured orders for two types of high-end wafer photoresist that have passed verification from major domestic wafer manufacturers [1] - The first phase production line, capable of producing 30 tons of KrF/ArF high-end wafer photoresist, is ready for mass production and can meet current client order demands [1] Group 3: Product Validation - By the third quarter of 2025, the company plans to have nearly 30 types of high-end wafer photoresist, with over 15 types undergoing sample verification and more than 10 types entering gallon sample testing, aligning with expected timelines [1]

Core Viewpoint - Dinglong Co., Ltd. has developed a comprehensive self-supply system for high-end wafer photoresists, achieving validation and orders from major domestic wafer manufacturers [1] Group 1: Company Development - The company has been deeply engaged in the semiconductor materials sector for many years, focusing on KrF and ArF high-end wafer photoresists [1] - Dinglong has established a full-process self-manufacturing system from core raw materials to finished products [1] Group 2: Product Validation and Orders - Two high-end wafer photoresists have passed validation from major domestic wafer manufacturers and have received orders [1] - Over 15 products are undergoing sample validation, and more than 10 products are in gallon sample testing [1] Group 3: Competitive Advantage - The company aims to leverage its advantages in "independent research and development, production capacity, and customer recognition" to contribute significantly to the domestic semiconductor industry [1]

Group 1 - The photoresist sector is experiencing a significant upward movement, with Andar Intelligent rising over 10% [1] - Other companies such as Chipbond Microelectronics, Dinglong Co., Matsui Chemical, Huarong Chemical, and Hengkun New Materials are also seeing gains [1]