证券代码：300054 证券简称：鼎龙股份 公告编号：2026-007 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 第六届董事会第八次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 一、董事会会议召开情况 湖北鼎龙控股股份有限公司（以下简称"公司"）第六届董事会第八次会 议于 2026 年 1 月 26 日在武汉市经济技术开发区东荆河路 1 号公司 907 会议室 以现场表决方式召开。会议应到董事 9 人，实到董事 9 人。符合公司章程规定 的法定人数。本次会议通知于 2026 年 1 月 20 日以电话或电子邮件形式送达， 公司部分高级管理人员列席了会议，会议的通知和召开符合《公司法》与《公 司章程》的规定，会议由董事长朱双全先生主持。 二、董事会会议审议情况 经与会董事认真审议，通过了以下决议： （一）审议通过了《关于对外投资购买股权的议案》 1、基本情况 为落实公司"创新材料平台型企业"战略发展目标，培育多领域产业增长 极，加强公司在新能源材料赛道的业务布局和竞争力，公司拟以自有或自筹资 金 6.30 亿元，通过 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign competitors [7][8]. - The investment landscape is categorized into different stages, from seed rounds to pre-IPO, with varying levels of risk and focus areas for investors [10]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulants market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the electronics sector [8]. Competitive Landscape - Domestic companies such as Dinglong Co., Guofeng New Materials, and SanYueKe are positioned to compete with international firms like Fujifilm and Toray in the advanced packaging materials market [8]. - The article emphasizes the importance of innovation and R&D investment for domestic firms to successfully penetrate and thrive in this competitive landscape [7][10].

证券日报网讯1月23日，鼎龙股份（300054）在互动平台回答投资者提问时表示，截至2026年1月9日， 公司股东总数(含合并)为4万6千余户。 ...

Group 1 - The company stated that its bank deposits are primarily held in demand deposits, with interest income calculated based on the bank's demand deposit rates [2] - While demand deposits allow for flexible access to funds and meet the company's liquidity needs, the interest rates on these deposits are relatively low, resulting in limited overall interest income [2]

（文章来源：证券日报） 证券日报网讯 1月23日，鼎龙股份在互动平台回答投资者提问时表示，公司作为国内半导体CMP抛光垫 领域的核心供应商，已凭借成熟的产品性能和稳定的供应能力，成功切入国内多家主流晶圆厂商的供应 链体系，且与诸多行业内核心厂商建立了长期稳定的合作关系，相关业务订单与营收均呈现稳步增长态 势。不过，基于商业保密及与客户的合作约定，对于具体单一客户的合作细节，公司不便单独予以确认 和披露。 ...

证券日报网讯1月23日，鼎龙股份（300054）在互动平台回答投资者提问时表示，目前半导体封装材料 产能可满足现阶段客户端的需求。未来，一方面公司将稳固现有封装材料的产能优势，保障现有需求的 供应稳定；另一方面将加强技术研发进度与客户验证结果，缩短从实验室到产线的转化周期。公司将持 续紧跟行业节奏，努力提升产能与技术的适配性。 ...

Core Viewpoint - The article discusses the rapid growth and investment opportunities in advanced packaging materials, highlighting the potential for domestic companies to replace foreign suppliers in critical sectors [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific segments such as conductive adhesives are forecasted to reach $3 billion by 2026, while chip bonding materials are estimated to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. Key Players - Domestic companies like Dinglong Co., Guofeng New Materials, and SanYue Technology are positioned to compete with international firms such as Fujifilm and Toray in the advanced packaging materials sector [8]. - The article lists various domestic and foreign companies involved in different segments of the advanced packaging materials market, indicating a competitive landscape [8]. Investment Strategies - The article outlines investment strategies across different stages of the new materials industry, emphasizing the importance of team assessment, industry analysis, and market entry barriers [10]. - It suggests that investments in mature products with established sales channels present lower risks and higher returns, while seed and early-stage investments carry higher risks [10]. Future Trends - The article anticipates significant growth in various new materials sectors, including epoxy resin and thermal interface materials, with projections indicating substantial increases in market size by 2027 and beyond [8]. - The focus on domestic substitution for critical materials is highlighted as a key trend, with potential for significant market disruption and opportunities for local companies [7][8].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are identified as key growth areas, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article outlines various advanced packaging materials and their projected market sizes, indicating significant growth potential in sectors like conductive adhesives, chip bonding materials, and epoxy encapsulants [8]. - For instance, the conductive adhesive market is expected to reach 3 billion yuan by 2026, while the epoxy encapsulant market is projected to grow to 99 million USD by 2027 [8]. Competitive Landscape - The article lists both domestic and international players in the advanced packaging materials market, emphasizing the competitive dynamics and the potential for domestic companies to capture market share from established foreign firms [8]. - Companies such as 鼎龙股份, 国风新材, and 三月科 are highlighted as key domestic players in the PSPI segment, while international competitors include Fujifilm and Toray [8]. Investment Strategies - Different investment stages in the new materials industry are discussed, with a focus on the varying risk levels and investment strategies appropriate for each stage, from seed funding to pre-IPO [10]. - The article emphasizes the importance of thorough industry and team assessments at each investment stage to mitigate risks and maximize returns [10].

Core Viewpoint - Dinglong Co., Ltd. holds a leading position in the domestic OLED new display materials sector, with strong customer repurchase attributes and successful scale sales of TFE-INK products [1] Group 1: Market Position and Product Development - The company has a solid market position for YPI and PSPI products, with a strong customer repurchase rate [1] - The Xiantao industrial park has commenced production with an annual output of 1,000 tons of PSPI, which is now in bulk supply [1] - The second phase project for YPI, with an annual output of 800 tons, is set to supplement new capacity to meet existing and potential order demands [1] Group 2: New Product Validation and Development - New products such as PFAS Free PSPI, Black Pixel Definition Layer Material (BPDL), and Low Dielectric Constant Ink (Low Dk INK) are progressing in validation as expected [1] - Development of PI-oriented liquid and client-side introduction is fully underway [1]

Group 1: Company Overview - Hubei Dinglong Holdings is a leading platform company in core innovative materials, focusing on two main business segments: semiconductor materials and general printing consumables [2] - The company is a domestic leader in CMP polishing pads, covering various semiconductor manufacturing materials, including CMP process materials and photoresists [2][3] Group 2: Core Competencies - The company possesses comprehensive R&D capabilities in polishing pads, with advantages in product variety, raw material self-sufficiency, rapid technology iteration, and systematic service capabilities [3] - In the OLED display materials sector, the company maintains a leading position with strong customer relationships and stable cash flow from repeat purchases [4] Group 3: R&D Investment and Focus - R&D investment is increasing due to the high demands of CMP polishing liquids and advanced packaging materials, with a focus on three main areas for 2026: CMP materials, high-end photoresists, and new semiconductor display materials [5] Group 4: Market Opportunities - The rapid development of the AI industry is driving demand for semiconductor chips and high-end display panels, benefiting the company's core products [6] - The restructuring of the global semiconductor supply chain enhances the company's advantages in raw material self-sufficiency, allowing for better alignment with customer needs [6] - Emerging fields like large wafers and advanced packaging are opening new market opportunities for semiconductor materials [6][7] Group 5: Production Capacity and Planning - Current production capacity meets existing order demands, with no significant bottlenecks reported; plans are in place to optimize capacity based on market needs [8] - The company has established production lines with specific annual capacities: 1000 tons for PSPI and 800 tons for YPI, ensuring the ability to meet current and future customer orders [8] Group 6: Photoresist Business Advantages - The company has developed a comprehensive range of photoresists, with strong technical capabilities and a well-established product matrix to meet diverse customer applications [9] - Future market demand for photoresists is expected to grow steadily, with plans to accelerate customer validation and market expansion [9]