证券代码：300054 证券简称：鼎龙股份 公告编号：2025-055 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 关于受让控股子公司少数股权的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 一、交易概述 （一）基本情况 为优化湖北鼎龙控股股份有限公司（以下简称"公司"、"鼎龙股份"）控 股子公司湖北鼎汇微电子材料有限公司（以下简称"鼎汇微电子"或"标的公司"） 治理结构、提高经营与管理决策效率以及增强盈利能力，公司拟按照鼎汇微电子 整体估值 30 亿元的价格，以支付现金方式受让建信信托有限责任公司（以下简 称"建信信托"）持有的鼎汇微电子 8%股权（建信信托于 2021 年 11 月按投前整 体估值 25 亿元投资入股鼎汇微电子持有少数股权，其入股时总投资成本为 21,052.6447 万元），本次交易的受让价格为 24,000 万元。 本次购买鼎汇微电子 8%股权交易完成后，公司持有鼎汇微电子的股权比例 由 91.35%提升至 99.35%，鼎汇微电子仍为公司并表范围内的控股子公司。 （二）本次交易目的 1、增厚上市公司归 ...

证券代码：300054 证券简称：鼎龙股份 公告编号：2025-054 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 第六届董事会第二次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 湖北鼎龙控股股份有限公司董事会 经与会董事认真审议，通过了以下决议： （一）审议通过了《关于受让控股子公司少数股权的议案》 为优化公司控股子公司湖北鼎汇微电子材料有限公司（以下简称"鼎汇微 电子"或"标的公司"）治理结构、提高经营与管理决策效率以及增强盈利能 力，公司拟按照鼎汇微电子整体估值30亿元的价格，以支付现金方式受让建信 信托有限责任公司（以下简称"建信信托"）持有的鼎汇微电子8%股权（建信 信托于2021年11月按投前整体估值25亿元投资入股鼎汇微电子持有少数股权， 其入股时总投资成本为21,052.6447 万元），本次交易的受让价格为24,000万元。 本次购买鼎汇微电子8%股权交易完成后，公司持有鼎汇微电子的股权比例 由91.35%提升至99.35%，鼎汇微电子仍为公司并表范围内的控股子公司。 具体内容详见公司同日披露于巨潮 ...

Core Viewpoint - Dinglong Co., Ltd. plans to acquire an 8% stake in its subsidiary Dinghui Microelectronics from Jianxin Trust for 240 million yuan, increasing its ownership from 91.35% to 99.35% [1] Group 1 - The transaction aims to optimize the governance structure of Dinghui Microelectronics [1] - The acquisition is expected to enhance operational decision-making efficiency and strategic execution capabilities [1] - The deal is anticipated to increase the net profit attributable to the parent company [1]

Group 1 - Hubei Dinglong Huisheng New Materials Co., Ltd. and Hubei Dinghui Microelectronics Materials Co., Ltd. have obtained a patent for "a grinding cloth and its preparation method" with the announcement number CN118721015B, applied on July 2024 [1] - Hubei Dinglong Huisheng New Materials Co., Ltd. was established in 2019, primarily engaged in the manufacturing of electrical machinery and equipment, with a registered capital of 200 million RMB [1] - Hubei Dinglong Huisheng New Materials Co., Ltd. has participated in 9 bidding projects and holds 25 patents, along with 65 administrative licenses [1] Group 2 - Hubei Dinghui Microelectronics Materials Co., Ltd. was established in 2015, primarily engaged in the manufacturing of chemical raw materials and products, with a registered capital of approximately 109.47 million RMB [1] - Hubei Dinghui Microelectronics Materials Co., Ltd. has invested in 3 companies, participated in 14 bidding projects, and holds 5 trademarks and 74 patents, along with 23 administrative licenses [1] Group 3 - Hubei Dinglong Holdings Co., Ltd. was established in 2000, primarily engaged in capital market services, with a registered capital of approximately 938.28 million RMB [2] - Hubei Dinglong Holdings Co., Ltd. has invested in 27 companies, participated in 36 bidding projects, and holds 34 trademarks and 234 patents, along with 58 administrative licenses [2]

证券代码：300054 证券简称：鼎龙股份 公告编号：2025-053 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 关于员工持股平台所持股份锁定期届满的提示性公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 湖北鼎龙控股股份有限公司（以下简称"公司"或"鼎龙股份"）于 2024 年 4 月 8 日召开第五届董事会第十八次会议、2024 年 5 月 14 日召开 2023 年度股 东大会审议通过了《关于收购控股子公司少数股权暨关联交易的议案》。在本次 交易事项中，控股子公司湖北鼎汇微电子材料有限公司原少数股东即五家员工持 股平台自愿承诺以其在本次交易中取得的全部交易对价款（税前）的 15%（即 7,125 万元）通过集中竞价交易方式用于在二级市场择机增持购买公司股票，同 时自足额买入鼎龙股份股票之日起自愿承诺锁定 12 个月。具体内容详见《关于 收购控股子公司少数股权暨关联交易的公告》等相关公告（公告编号：2024-033、 047）。 | 股东名称 | 股东身份 | 持股数量 | 持股比例 | 股份来源 | | --- | -- ...

证券代码：300054 证券简称：鼎龙股份 公告编号：2025-052 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司 关于控股股东部分股份质押的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 注：1、截至 2025 年6 月 5日，公司 2024年股票期权激励计划第一个行权期可行权的 9,775,200 股已行权 4,218,170 股，公司总股本由 938,282,591 股变更为 942,500,761 股。（同下表） 2、本次质押股份不存在被用作重大资产重组业绩补偿等事项的担保或其他保障用途的 情形。 股东 名称 是否 为控 股股 东或 第一 大股 东及 其一 致行 动人 本次 质押 数量 （股） 占其 所持 股份 比例 占公 司总 股本 比例 是否为限 售股（如 是，注明 限售类 型） 是否 为补 充质 押 质押 起始 日 质押 到期 日 质权人 质押 用途 朱双全 是 5,300, 000 3.81% 0.56% 否 否 2025- 6-5 2026- 6-5 华泰证 券股份 有限公 司 个人 融资 一、控股股东本次股份质押的基本情况 二、控股股东股份累计质押的 ...

Group 1 - The company announced the cancellation of 501,000 stock options from the 2024 stock option incentive plan due to 11 employees leaving for personal reasons and 2 employees failing to meet performance assessments [1][2] - The cancellation of the stock options will not affect the company's share capital as the options had not been exercised yet [2]

湖北鼎龙控股股份有限公司 关于2024年股票期权激励计划部分股票期权注销完成的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完 整，没有虚假记载、误导性陈述或者重大遗漏。 证券代码：300054 证券简称：鼎龙股份 公告编号：2025-051 债券代码：123255 债券简称：鼎龙转债 湖北鼎龙控股股份有限公司（以下简称"公司"）于 2025 年 4 月 25 日召开 第五届董事会第二十七次会议、第五届监事会第二十六次会议审议通过了《关于 注销 2024 年股票期权激励计划部分股票期权的议案》。鉴于 2024 年股票期权激 励计划中：①11 名激励对象因个人原因离职，其已获授但尚未行权的股票期权 合计 46.10 万份需要注销；②2 名激励对象因 2024 年度个人绩效考核结果低于 70 分，取消该激励对象第一期行权额度，其已获授但不符合行权条件的股票期 权 4 万份需要注销。综上所述，公司将合计注销的股票期权数量为 50.1 万份。 具体内容详见公司于 2025 年 4 月 29 日披露于巨潮资讯网上的《关于注销 2024 年股票期权激励计划部分股票期权的公告》（公告编号：2025-037）。 ...

Investment Rating - The report initiates coverage with a "Buy" rating for the company [11] Core Insights - The semiconductor business is driving revenue growth, with innovative materials achieving multiple breakthroughs. In 2024, the company is expected to achieve revenue of 3.338 billion yuan, a year-on-year increase of 25.14%, and a net profit attributable to shareholders of 521 million yuan, a year-on-year increase of 134.54% [3][10] - The CMP polishing pad business continues to solidify its leading position in domestic supply, with sales revenue of 716 million yuan in 2024, representing a year-on-year growth of 71.51% [4] - The company has diversified its semiconductor business layout, which is expected to enhance future performance after the conversion of R&D results [3] Company Overview - Latest closing price: 27.91 yuan - Total shares: 938 million, circulating shares: 728 million - Total market capitalization: 26.2 billion yuan, circulating market capitalization: 20.3 billion yuan - 52-week high/low: 31.55/18.38 - Debt-to-asset ratio: 34.1% - Price-to-earnings ratio: 49.84 - Largest shareholder: Zhu Shuangquan [2] Financial Projections - Revenue projections for 2025, 2026, and 2027 are 4.053 billion yuan, 4.901 billion yuan, and 5.900 billion yuan respectively, with net profits of 701 million yuan, 959 million yuan, and 1.290 billion yuan [10][13] - The company’s earnings per share (EPS) are projected to be 0.75 yuan, 1.02 yuan, and 1.37 yuan for 2025, 2026, and 2027 respectively [13] Business Segments - CMP polishing liquid and cleaning liquid sales reached 215 million yuan in 2024, a year-on-year increase of 178.89% [5] - The semiconductor display materials segment achieved sales of 402 million yuan in 2024, a year-on-year increase of 131.12% [7] - The high-end wafer photoresist business is progressing rapidly, with over 20 products developed and 12 samples sent for client verification [8]

Investment Rating - The report initiates coverage with a "Buy" rating for the company [11] Core Insights - The semiconductor business is driving revenue growth, with innovative materials achieving breakthroughs across multiple areas. In 2024, the company is expected to achieve revenue of 3.338 billion yuan, a year-on-year increase of 25.14%, and a net profit attributable to shareholders of 521 million yuan, a year-on-year increase of 134.54% [3][10] - The CMP polishing pad business continues to solidify its leading position in domestic supply, with sales revenue of 716 million yuan in 2024, representing a year-on-year growth of 71.51% [4] - The company is diversifying its semiconductor business, with significant advancements in CMP polishing liquids, cleaning liquids, and semiconductor display materials, all showing substantial revenue growth [5][7] Company Overview - The latest closing price is 27.91 yuan, with a total market capitalization of 26.2 billion yuan and a total share capital of 938 million shares [2] - The company has a debt-to-asset ratio of 34.1% and a price-to-earnings ratio of 49.84 [2] Financial Projections - Revenue projections for 2025, 2026, and 2027 are 4.053 billion yuan, 4.901 billion yuan, and 5.900 billion yuan, respectively, with net profits of 701 million yuan, 959 million yuan, and 1.290 billion yuan [10][13] - The expected growth rates for revenue are 21.44%, 20.91%, and 20.39% for the respective years [13] Product Development - The company has made significant progress in high-end wafer photoresists, with over 20 products developed and 12 samples sent for client verification [8] - The semiconductor packaging materials, including PI and temporary bonding adhesives, have also seen initial orders, indicating a strong market entry [9]