证券代码：300604 证券简称：长川科技 公告编号：2026-003 杭州长川科技股份有限公司 关于公司实际控制人之一致行动人 减持计划实施完毕的公告 公司实际控制人之一致行动人杭州长川投资管理合伙企业（有限合伙） 保证信息披露的内容真实、准确、完整，不存在虚假记载、误导性陈述或重 大遗漏。 本公司及董事会全体成员保证信息披露内容与信息披露义务人提供的 信息一致。 特别提示： 1、本次权益变动后，公司控股股东、实际控制人赵轶先生及其一致行动人杭 州长川投资管理合伙企业（有限合伙）合计持有公司股份数量从158,600,654股减 少至155,932,385股，占公司总股本的比例从25.0000%减少至24.5794%。 2、本次权益变动属于股份减持，不触及要约收购，不会导致公司控股股东、 实际控制人发生变化。 3、截至本公告披露日，杭州长川投资管理合伙企业（有限合伙）本次减持计 划已实施完毕。 杭州长川科技股份有限公司（以下简称"公司"）于2025年11月28日披露了《关 于公司实际控制人之一致行动人及持股5%以上股东、部分董事减持股份计划的预 披露公告》（公告编号：2025-078）（以下简称"本次减持计划 ...

（文章来源：证券时报网） | 成交量 | 成交金额 | 成交价 | 相对当日收盘 | | | | --- | --- | --- | --- | --- | --- | | （万 | （万元） | 格 | 折溢价（%） | 买方营业部 | 卖方营业部 | | 股） | | （元） | | | | | 140.00 | 15747.20 | 112.48 | -12.58 | 机构专用 | 财通证券股份有限公司杭 | | | | | | | 州体育场路证券营业部 | | 33.00 | 3711.84 | 112.48 | -12.58 | 机构专用 | 财通证券股份有限公司杭 | | | | | | | 州体育场路证券营业部 | | 30.00 | 3374.40 | 112.48 | -12.58 | 机构专用 | 财通证券股份有限公司杭 | | | | | | | 州体育场路证券营业部 | | 18.00 | 2024.64 | 112.48 | -12.58 | 中信证券股份有限公司徐 | 财通证券股份有限公司杭 | | | | | | 州建国西路证券营业部 | 州体育场路证券营业部 | | 16.63 ...

Market Overview - The Shanghai Composite Index rose by 1.09% on January 12, with 28 out of the 31 sectors experiencing gains, led by the media and computer sectors, which increased by 7.80% and 7.26% respectively [1] - The electronic sector saw a modest increase of 1.46% [1] - The sectors that faced declines included oil and petrochemicals, coal, and real estate, with decreases of 1.00%, 0.47%, and 0.29% respectively [1] Capital Flow Analysis - The net outflow of capital from the two markets was 27.468 billion yuan, with 11 sectors experiencing net inflows [1] - The computer sector had the highest net inflow of capital, amounting to 15.774 billion yuan, coinciding with its 7.26% increase [1] - The media sector followed with a net inflow of 5.391 billion yuan and a daily increase of 7.80% [1] - The power equipment sector experienced the largest net outflow, totaling 14.093 billion yuan, followed by the electronic sector with a net outflow of 11.193 billion yuan [1] Electronic Sector Performance - Within the electronic sector, 345 out of 476 stocks rose, with 6 hitting the daily limit up [2] - The leading stock in terms of net capital inflow was Lingyi Technology, which saw an inflow of 1.696 billion yuan, followed by Zhaoyi Innovation and Changchuan Technology with inflows of 668 million yuan and 322 million yuan respectively [2] - Conversely, the stocks with the highest net outflows included Industrial Fulian, Qianzhao Optoelectronics, and Shenghong Technology, with outflows of 1.429 billion yuan, 1.373 billion yuan, and 1.303 billion yuan respectively [3] Electronic Sector Capital Inflow and Outflow - The top gainers in the electronic sector included Lingyi Technology (10.02%), Zhaoyi Innovation (4.71%), and Changchuan Technology (4.09%) [2] - The stocks with the highest capital outflows were Industrial Fulian (-0.89%), Qianzhao Optoelectronics (3.90%), and Shenghong Technology (-3.32%) [3]

AI算力、先进封装与汽车电子"三轮驱动"，开启量价齐升窗口期 1)AI算力逻辑：芯片复杂度跃迁导致测试向量深度指数级膨胀，单芯片测试时间成倍延长，驱动机台需 求"量增";同时，千瓦级功耗芯片对设备的主动热管理及信号完整性提出极端要求，推升单机价值量。2) 先进封装逻辑：Chiplet架构使得KGD测试成为刚需，测试节点由封测向晶圆环节前移;异构集成与系统 复杂度上行推动SLT系统级测试需求，形成了ATE之外的流程新增量。3)汽车电子逻辑：智能车芯片数 量呈翻倍增长，AEC-Q100严苛标准下的三温循环测试使得三温探针台与三温分选机需求刚性放大，测 试设备在汽车电子领域具备长期、可验证的放量逻辑。 全球格局呈现美日双寡头高度垄断，平台化与垂直整合成为巨头演进路径 半导体测试设备是集成电路产业链的核心装备，也是决定产能效率与产品良率的关键瓶颈 测试环节贯穿晶圆制造(CP)与封装(FT)全生命周期，承担着"剔除早期失效"与"把好最后一关"的重任。 在半导体后道产线设备投资中，测试设备价值量占比最高。根据SEMI数据，2025年测试设备在后道产 线投资中占比预计达63.6%，显著高于封装设备，是封测厂商的核心资产配置 ...

Investment Rating - The report maintains a "Buy" rating for the semiconductor testing equipment industry, indicating a favorable outlook for investment opportunities in this sector [1]. Core Insights - The semiconductor testing equipment industry is experiencing a critical phase characterized by "value reassessment, demand surge, and accelerated domestic substitution," which presents significant investment opportunities [5][6]. - The testing equipment is essential throughout the semiconductor manufacturing process, with ATE (Automatic Test Equipment) leading in value contribution, while probe stations and handlers work in synergy to enhance testing efficiency [11][20]. - The demand for testing equipment is driven by three main factors: AI computing power, advanced packaging, and automotive electronics, which collectively create a favorable environment for growth [5][6]. Summary by Sections 1. Testing Equipment's Role in Manufacturing - Semiconductor testing equipment is a core component of the integrated circuit industry, covering wafer testing, packaging testing, and functional verification [11]. - Testing occurs in two main phases: Circuit Probing (CP) and Final Test (FT), which are crucial for ensuring product quality and cost efficiency [11][15]. 2. Demand Drivers - The complexity of AI computing chips is increasing, leading to longer testing cycles and higher equipment demand [6]. - Advanced packaging techniques are creating new testing requirements, such as KGD (Known Good Die) and SLT (System Level Test), which further drive the need for testing equipment [6]. - The automotive sector is also contributing to demand growth, with a significant increase in the number of chips required for smart vehicles, necessitating rigorous testing standards [5][6]. 3. Global Market Dynamics - The testing equipment market is dominated by a few key players, particularly in the ATE segment, where companies like Advantest and Teradyne hold over 90% market share [5][6]. - The report highlights the importance of platform integration and vertical consolidation as strategies for leading companies to maintain competitive advantages [5][6]. 4. Domestic Substitution Opportunities - The report identifies a clear path for domestic manufacturers to increase their market share, particularly in the SoC and storage testing segments, where current domestic production rates are low [5][6]. - Companies such as Changchuan Technology, Huafeng Measurement Control, and Xidian Co. are highlighted as key players with potential for growth in the domestic market [5][6].

Core Viewpoint - The global semiconductor industry is expected to strengthen in 2026, driven by AI demand and domestic substitution, with a notable increase in semiconductor equipment and materials [1] Group 1: Semiconductor Equipment and ETF Performance - The semiconductor equipment ETF (561980) opened up 1.15% on January 12, with a net inflow of nearly 100 million yuan over the past two trading days [1] - The index tracked by the semiconductor equipment ETF has risen over 15% this year, outperforming mainstream semiconductor indices [2] - Key stocks such as Zhongwei Company and Cambrian have seen significant gains, with Zhongwei up nearly 4% and Jianghua Micro up over 5% [2] Group 2: Market Trends and Pricing - A significant increase in trading volume in A-shares indicates the start of a spring market, with semiconductor equipment leading the upward trend [4] - NVIDIA's new AI chip architecture, Vera Rubin, showcases a fivefold increase in inference performance compared to the previous generation, indicating a surge in storage demand [5] - Major international storage companies plan to raise server DRAM prices by 60% to 70% in Q1 2026 compared to Q4 2025 [5] Group 3: Domestic Substitution and Material Demand - The domestic substitution process for semiconductor materials is advancing, with a recent anti-dumping investigation into dichlorodihydrosilane from Japan, a key material for chip manufacturing [5] - The demand for semiconductor materials and electronic chemicals is expected to rise due to the upgrade of storage driven by AI data centers [6] - The global semiconductor materials market is projected to reach approximately $70 billion by 2025, with a year-on-year growth of 6% [6] Group 4: Industry Outlook and Key Players - The trend of "supply security + domestic substitution" for key semiconductor materials is strengthening, driven by AI computing and data center demands [7] - Leading companies with technological accumulation and production capacity in high-end materials are expected to gain market share and profitability amid advanced process promotion and domestic substitution trends [7] - The semiconductor equipment ETF focuses on leading companies in the sector, with over 90% of its holdings in the upper and mid-stream areas of the semiconductor industry, which have the highest technical barriers and value concentration [7]

证券日报网讯 1月9日，长川科技发布公告称，公司2026年第一次临时股东会审议通过《关于2025年度 公司及子公司向银行申请增加综合授信额度的议案》《关于长川科技（内江）有限公司申请银行借款并 为其提供担保的议案》《关于公司下属全资子公司长川科技（内江）有限公司投资进行项目建设的议 案》。 （文章来源：证券日报） ...

国浩律师（杭州）事务所 关 于 杭州长川科技股份有限公司 2026 年第一次临时股东会之 法律意见书 地址：杭州市上城区老复兴路白塔公园 B 区 2 号、15 号国浩律师楼 邮编：310008 关 于 杭州长川科技股份有限公司 2026 年第一次临时股东会之 Grandall Building, No.2 ＆ No.15, Block B, Baita Park, Old Fuxing Road, Hangzhou, Zhejiang 310008, China 电话/Tel: (+86)(571) 8577 5888 传真/Fax: (+86)(571) 8577 5643 电子邮箱/Mail：grandallhz@grandall.com.cn 网址/Website：http://www.grandall.com.cn 二〇二六年一月 国浩律师（杭州）事务所 长川科技 2026 年第一次临时股东会法律意见书 国浩律师（杭州）事务所 法律意见书 致：杭州长川科技股份有限公司 国浩律师（杭州）事务所（以下简称"本所"）接受杭州长川科技股份有限 公司（以下简称"公司"）委托，指派律师出席公司 2026 年第一次 ...

证券代码：300604 证券简称：长川科技 公告编号：2026-002 杭州长川科技股份有限公司 2026 年第一次临时股东会决议的公告 本公司及董事会全体成员保证公告内容真实、准确和完整，没有虚假记载、 误导性陈述或重大遗漏。 特别提示： 1、本次股东会无增加、变更、否决提案的情况； 本次股东会采取现场表决与网络投票相结合的方式 （1）现场会议召开时间：2026 年 1 月 9 日（星期五）下午 14:30； （2）网络投票时间：2026 年 1 月 9 日（星期五）； 其中，通过深圳证券交易所交易系统进行网络投票的时间为 2026 年 1 月 9 日（星期五）9:15-9:25，9:30-11:30 和 13:00-15:00；通过深圳证券交易所互 联网投票系统投票的具体时间为：2026 年 1 月 9 日（星期五）上午 9:15 至下午 15:00 期间的任意时间。 本次股东会由公司董事会召集，由董事长赵轶先生主持，会议的召集和召开 符合《公司法》、《上市公司股东会规则》、《深圳证券交易所创业板股票上市 规则》及《公司章程》等法律法规和规范性文件的规定。 二、出席人员及出席情况 1、股东出席会议的总体情 ...

截至11月10日，长川科技股东户数11.91万，较上期减少9.84%；人均流通股4108股，较上期增加 11.81%。2025年1月-9月，长川科技实现营业收入37.79亿元，同比增长49.05%；归母净利润8.65亿元， 同比增长142.14%。 分红方面，长川科技A股上市后累计派现3.05亿元。近三年，累计派现1.87亿元。 长川科技今年以来股价涨21.76%，近5个交易日涨16.71%，近20日涨41.60%，近60日涨46.98%。 资料显示，杭州长川科技股份有限公司位于浙江省杭州市滨江区创智街500号，成立日期2008年4月10 日，上市日期2017年4月17日，公司主营业务涉及集成电路专用设备的研发、生产和销售。主营业务收 入构成为：测试机57.68%，分选机32.73%，其他9.59%。 长川科技所属申万行业为：电子-半导体-半导体设备。所属概念板块包括：半导体设备、专精特新、半 导体、集成电路、大基金概念等。 1月8日，长川科技（维权）盘中下跌2.02%，截至13:32，报123.36元/股，成交33.43亿元，换手率 5.46%，总市值782.60亿元。 资金流向方面，主力资金净流出1.43 ...