#四大芯片巨头CEO齐聚#【英伟 达、英特尔、AMD、高通，四巨头CEO历史同框：一同现身联想发布会】1月7日，全球消费电子展 2026开幕。AI浪潮下不可或缺的几名巨头在此齐聚一堂。在全球创新科技大会上，联想集团董事长兼 CEO杨元庆与英伟达创始人兼CEO黄仁勋、超威半导体（AMD）董事会主席兼CEO苏姿丰、英特尔 CEO陈立武，以及高通CEO克里斯蒂亚诺·安蒙一齐亮相。联想释出了多项重磅合作计划。 0:00 ...

Core Insights - The fourth annual SDV (Software-Defined Vehicle) Innovator Awards were announced by MotorTrend, celebrating individuals redefining the automotive industry through software innovation [1][2] - The awards recognize pioneers, leaders, and experts in the automotive sector, highlighting their contributions to the evolution of software-defined vehicles [2][3] Group 1: Award Categories - The SDV Innovator Awards feature three categories: Pioneer, Leader, and Expert, with 20 winners selected by MotorTrend editors [2] - Pioneer Award winners have made significant advancements in SDV through research and development of new automotive software [3] - Leader Award winners are senior management individuals who drive the adoption of software solutions in the automotive industry [4] - Expert Award winners are recognized for their specialized knowledge in specific SDV disciplines, such as advanced driver assistance systems and over-the-air updates [5] Group 2: Notable Winners - Notable winners include Ashok Elluswamy from Tesla, Shaoqing Ren from NIO, and Laura Major from Motional, among others, showcasing a diverse range of expertise in the automotive software field [6]

该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的大规模2nm芯片制造工艺进行合同代工制造展开磋商；阿蒙表示，高 通面向PC、智能手机甚至AI数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将 来实现大规模代工以及全面商业化。 相较N3E制程(等同于3nm先进制程)，N2约可实现同功耗下性能+10%到15%，或同性能下功耗缩减 25%~30%，以及晶体管密度+15%~20%(具体取决于芯片架构设计)。 另一芯片制造巨头英特尔，则跳过2nm整数制程，聚焦于1.8nm级别制程(即18A)。英特尔表示，18A已 经从"制程节点承诺"走到"终端产品发布与量产爬坡"，而14A仍在研发与路线图/客户导入阶段。英特尔 在CES2026重磅发布/展示了基于18A制程打造的Panther Lake(Core Ultra Series3)，并将其作为18A的"首 批产品平台"对外确认。18A的关键工艺特征，即GAA/RibbonFET+背面供电PowerVia，也作为该代产品 与制程卖点被媒体与英特尔官方材料同步强调，但是具体的生产良率指标仍未 ...

Core Insights - The article highlights the acceleration of native AI hardware development, emphasizing the growing demand for computing power and the expansion of AI applications from cloud to edge [1][2][12] - Chinese manufacturers are increasingly becoming significant players at CES 2026, showcasing a variety of AI hardware, including AI glasses and robots, which have garnered substantial attention [1][12] Group 1: AI Hardware and Computing Power - The rapid evolution of underlying computing infrastructure is supporting the accelerated development of AI large models, with a noted annual increase in floating-point operations for training by four times and a 100-fold increase in inference token consumption over the past two years [2][3] - NVIDIA's CEO highlighted the arrival of the "ChatGPT moment" for physical AI, with autonomous taxis being one of the first applications to benefit from this technology [2] - AMD's CEO discussed the transition to Yotta Scale compute, indicating that AI potential will be fully unleashed across data centers, personal computing devices, and edge AI [2][3] Group 2: Robotics and Physical AI - The maturity of physical AI was emphasized at CES, with a notable improvement in the capabilities of showcased robots compared to previous years, indicating a shift from simple demonstrations to more complex functionalities [7][8] - Companies like UTree Technology and Zongqiong Robotics are showcasing advanced robots capable of performing intricate movements, signaling a move towards mass production and real-world applications [8][9] - The integration of edge AI and real-time situational awareness in wearable devices is expected to create significant market opportunities, with projections of reaching 100 million units in the coming years [5][6] Group 3: Chinese Manufacturers and Global Role - Chinese firms are transitioning from being merely the "world's factory" to becoming key players in global technological innovation, supported by strong supply chain and R&D capabilities [1][12] - The efficiency of China's supply chain allows for rapid product iteration, with a production cycle of about one year compared to three to five years for European companies [12][13] - The article underscores that the advancements in AI technology are not just about manufacturing but also about creating better solutions and technologies, marking a shift from "Chinese manufacturing" to "Chinese innovation" [13]

Core Viewpoint - Qualcomm is showcasing its advancements in personal AI and physical AI at CES 2026, emphasizing the shift from cloud dependency to terminal autonomy through powerful edge computing capabilities [2][6][7]. Group 1: Personal AI Developments - Qualcomm's Snapdragon X series processors are enabling a new generation of AI PCs, demonstrating capabilities such as real-time multimodal AI content creation without latency [2][6]. - The demand for AI PCs has surged, with companies like Lenovo and ASUS reporting a 2.5 times increase in AI PC product offerings within a year [9]. - 62% of users consider "local intelligent agent invocation" a core reason for purchasing AI PCs, highlighting the importance of local processing in enhancing user experience [13]. Group 2: Physical AI Innovations - Qualcomm's advancements in physical AI are evident in the automotive sector, with over 400 million vehicles utilizing Snapdragon digital chassis solutions [19]. - The company is leading in the in-car infotainment and cockpit SoC solutions, with over 75 million vehicles adopting the Snapdragon cockpit platform [19]. - The Snapdragon 8797 platform supports multi-modal large models for cockpit and driving assistance, enhancing the in-vehicle experience [21]. Group 3: Strategic Vision and Market Trends - Qualcomm's strategy focuses on building a comprehensive ecosystem that integrates personal AI and physical AI, aiming for a seamless user experience across various devices [8][26]. - The global AI PC market penetration is expected to exceed 80% in the next three years, indicating a significant shift towards edge computing [27]. - The company is positioned to capitalize on the exponential growth in demand for edge computing capabilities, as AI evolves towards intelligent agents and embodied forms [10][11]. Group 4: Technological Advancements - The Snapdragon X2 Plus platform features an 80 TOPS NPU, setting a new speed record for its class, and offers a 35% performance improvement while reducing power consumption by 43% compared to previous generations [15][29]. - Qualcomm's new processors, such as the Q-8750 and Q-7790, are designed for diverse IoT applications, enhancing the company's ability to support a wide range of smart devices [26][39]. - The Snapdragon Ride platform has been validated in over 60 countries, accumulating extensive data that enhances Qualcomm's capabilities in physical AI applications [46].

Group 1: Industry Overview - The CES 2026 showcased over 4,000 companies, focusing on AI and its integration into various products, including PCs, home appliances, and foundational chips [1] - The combined market capitalization of the four major semiconductor companies—NVIDIA, AMD, Qualcomm, and Intel—reaches nearly $5.3 trillion, indicating significant investor interest in AI technologies [1] - Concerns about the over-exuberance of the AI market persist, with 2026 expected to be a year for evaluating genuine value creation rather than mere speculation [1] Group 2: NVIDIA Developments - NVIDIA unexpectedly launched its next-generation AI chip platform "Rubin," which significantly enhances training and inference performance by 3.5 times and 5 times, respectively, compared to its predecessor [2] - The company reported over $500 billion in orders for its Blackwell and Rubin architectures for 2025-2026, reflecting strong demand for computing power in data centers [2] - NVIDIA introduced the open-source autonomous driving model "Alpamayo," which features 10 billion parameters and aims to streamline the processing from sensor input to driving commands [3] Group 3: AMD Initiatives - AMD adopted an aggressive "stacking" strategy, showcasing the Helios AI rack, which integrates 72 MI455X accelerator chips and 31TB of HBM4 memory, claiming it to be the best AI rack globally [5][6] - The new generation of chips is expected to deliver up to a 10-fold performance improvement under various workloads, aided by a hybrid 2nm and 3nm manufacturing process [6] - AMD signed a significant infrastructure procurement agreement with OpenAI, valued at 6 gigawatts, marking a substantial entry into the core supply chain of leading AI model developers [6] Group 4: Qualcomm and Intel Strategies - Qualcomm is diversifying its strategy to reduce reliance on the smartphone market, launching the Snapdragon X2 Plus chip aimed at the mid-range laptop market, with a focus on energy efficiency and 5G connectivity [8] - Intel introduced the "Panther Lake" third-generation Core Ultra processor, its first chip manufactured using the 18A process, which is crucial for regaining manufacturing leadership [9] - The third-generation Core Ultra processors are set to be released in the second quarter of 2026, targeting industrial, medical, and smart city applications [10]

Core Viewpoint - Samsung's foundry business is experiencing a turnaround as its second-generation 2nm process technology (SF2P) gains industry recognition and attracts major clients, including Qualcomm, Tesla, AMD, and Google [1][3][4] Group 1: Technology and Production - Samsung is the first company globally to announce the mass production of 2nm chips, with the Exynos 2600 chip for the Galaxy S26 series set to utilize the SF2P process [3] - The SF2P process is expected to deliver significant technical advantages, leading to increased interest from external companies [3] - Qualcomm is reportedly in active discussions with Samsung for 2nm chip foundry cooperation, with design work already completed [3][4] Group 2: Market Position and Competitiveness - If the collaboration with Qualcomm is finalized, it would serve as a strong endorsement of Samsung's foundry technology capabilities [4] - Qualcomm previously shifted its most advanced chip orders to TSMC due to stability issues with Samsung's foundry processes, indicating a significant shift in confidence [4] - Successful execution of the SF2P process could position Samsung to compete directly with TSMC in the advanced semiconductor manufacturing sector [4]

智通财经APP获悉，有媒体援引美国高通公司首席执行官克里斯蒂亚诺·阿蒙(Cristiano Amon)的话报道 称，高通(QCOM.US)很可能将使用三星电子的2nm级别芯片代工工艺来制造其下一代移动应用处理器。 高通过去几年在领先制程上"几乎完全依赖台积电"，而此次若把下一代移动AP的一部分先进节点订单 转向三星2nm，意味着高通在"最核心、最量大的手机SoC"上启动双供应链策略或者分散化，会在份额 与议价权层面对台积电形成轻微压力，但是对于台积电基本面增长前景无任何重大扰动。 台积电与英特尔的先进芯片制程布局 该媒体援引阿蒙在采访中透露的消息表示，这家智能手机与PC端芯片领军者正在与包括三星电子在内 的多家晶圆代工厂就采用最前沿的2nm芯片制造品工艺进行合同代工制造展开磋商;阿蒙表示，高通面 向OC、智能手机甚至数据中心的绝大多数新一代核心芯片设计工作已经完成，以便在不久的将来实现 大规模代工以及全面商业化。 有着"全球芯片代工之王"称号的台积电方面同样全面聚焦于2nm及以下这一最先进芯片制程产能，该公 司在其官网制程介绍中明确写到：2nm(N2)"已于2025年第四季度(4Q25)按计划开始量产"，并强 ...

三星联席CEO兼芯片业务主管全永铉(Jun Young-hyun)上周表示，近期与主要客户达成的供应协议有望 让其亏损的代工业务实现"重大飞跃"。去年7月，三星与特斯拉签署了一项价值165亿美元的芯片代工协 议。 截至发稿，高通和三星尚未就此置评。(作者/箫雨) 凤凰网科技讯 北京时间1月7日，据路透社报道，《韩国经济日报》周三援引高通CEO克里斯蒂亚诺·安 蒙(Cristiano Amon)的话称，高通正就2纳米芯片代工生产事宜与三星电子进行磋商。 《韩国经济日报》援引安蒙的话称，在多家半导体代工厂中，高通首先与三星展开谈判，讨论采用三星 最新的2纳米制程为高通代工生产。高通芯片的设计工作已完成，计划在不久的将来实现商业化。 ...

Core Viewpoint - More than 30 companies in the automotive supply chain are collaborating on open-source software to develop next-generation vehicles and reduce costs, as announced by Germany's VDA at the CES trade show in Las Vegas [1][2]. Group 1: Collaboration and Participants - The initiative has expanded from 11 to 32 participating firms, including Stellantis, Traton, Schaeffler, Infineon, and Qualcomm, alongside major German carmakers like Volkswagen, BMW, and Mercedes-Benz [2]. - This collaboration signifies a global shift towards open innovation within the automotive industry, as stated by Mike Milinkovich, executive director of the Eclipse Foundation [3]. Group 2: Goals and Benefits - The initiative aims to reduce development and maintenance efforts by up to 40% and accelerate time to market by up to 30% [2].