目前正值非工作时间，高通暂未对此事作出回应。三星电子则表示，不对特定客户相关事宜发表评论。 三星电子联席首席执行官兼芯片业务负责人庆桂显（Jun Young-hyun）上周曾表示，近期与多家大客户 达成的供应协议，已使其此前处于亏损状态的代工业务 "做好了实现跨越式发展的准备"。今年 7 月， 三星电子曾与特斯拉签署了一份价值 165 亿美元的合作协议。 责任编辑：郭明煜 据韩国《朝鲜经济日报》周三援引美国高通公司首席执行官克里斯蒂亚诺・阿蒙的话报道，高通正与三 星电子就2 纳米芯片代工事宜展开洽谈。 据韩国《朝鲜经济日报》周三援引美国高通公司首席执行官克里斯蒂亚诺・阿蒙的话报道，高通正与三 星电子就2 纳米芯片代工事宜展开洽谈。 这家韩国媒体称，阿蒙表示，在多家半导体代工企业中，高通首先与三星电子开启谈判，商讨采用最先 进的 2 纳米制程工艺进行代工合作，相关芯片的设计工作已完成，有望在不久后实现商业化量产。 这家韩国媒体称，阿蒙表示，在多家半导体代工企业中，高通首先与三星电子开启谈判，商讨采用最先 进的 2 纳米制程工艺进行代工合作，相关芯片的设计工作已完成，有望在不久后实现商业化量产。 目前正值非工作时 ...

Core Insights - Qualcomm has unveiled its next-generation complete technology solution for robotics at CES 2026, integrating hardware, software, and composite AI capabilities, along with the latest high-performance robotics processor, the Qualcomm Snapdragon IQ10 series [1][3] Group 1: Qualcomm's Innovations - The Snapdragon IQ10 series is designed specifically for industrial-grade autonomous mobile robots (AMRs) and advanced full-sized humanoid robots, enhancing Qualcomm's existing robotics product roadmap with a "robotic brain" that combines high performance and energy efficiency [1][3] - Qualcomm's expertise in edge AI and high-performance low-power systems is expected to help developers transition robot prototypes into deployable intelligent devices [1][3] Group 2: Industry Collaboration and Vision - Nakul Duggal, Qualcomm's Executive Vice President, emphasized the importance of reliable, safe, and scalable operation for complex robotic systems, highlighting Qualcomm's foundational technologies that cover various aspects from sensing to execution [3] - Brett Adcock, CEO of Figure, stated that Qualcomm's platform, with its superior computing power and energy efficiency, is a crucial technological foundation for realizing Figure's mission of creating AI-driven humanoid robots to enhance productivity and improve quality of life [3] Group 3: Technological Advancements - The universal robot architecture powered by Snapdragon IQ10 integrates heterogeneous edge computing, edge AI, hybrid safety-critical systems, software, machine learning operations, and AI data flywheel technology, redefining the application possibilities of robotics [4] - This end-to-end solution enables robots to perform environmental reasoning and intelligently adapt to spatial and temporal changes, facilitating scalable deployment with industrial-grade reliability across various robot forms [4] Group 4: Product Demonstrations - During CES, Qualcomm showcased several robot products powered by its technology, including the VinMotion Motion 2 humanoid robot and the Booster K1 geek version robot, demonstrating Qualcomm's leadership in edge AI and commitment to advancing physical AI [4] - The exhibition also featured a commercially available robot development kit from Advantech, supporting rapid development and multi-scenario deployment, along with tools for remote robot control and AI data flywheel for data collection, training, and deployment [4]

Core Insights - Qualcomm announced the expansion of its IoT product portfolio with the launch of the new Qualcomm Leap Q series processors at CES 2026, aiming to become a preferred provider of edge computing and AI core technologies in the industrial and embedded sectors [1] Group 1: Product Launch and Strategy - Qualcomm introduced two significant IoT processors: the Qualcomm Leap Q-8750, which features 77 TOPS AI computing power and supports real-time inference for large language models, and the Qualcomm Leap Q-7790, which offers 24 TOPS AI computing power for consumer and industrial IoT devices [3] - The company has made five strategic acquisitions, including Augentix and Edge Impulse, to enhance its industrial and embedded IoT offerings, providing a comprehensive solution for developers to accelerate the transition from prototype to large-scale deployment [1][4] Group 2: AI and Imaging Capabilities - The acquisition of Augentix allows Qualcomm to strengthen its position in smart imaging by integrating low-power visual processing chips into its IoT devices, enhancing image clarity and performance [4] - Qualcomm's Qualcomm Insight platform has been upgraded to support smart camera selections, enabling real-time, perceptive data analysis for security and operational teams [4] Group 3: Positioning Services and AI Tools - Qualcomm's ground positioning services leverage over 9 billion Wi-Fi access points and over 100 million cellular towers, providing more than 60 trillion positioning instances annually without relying solely on GNSS satellite systems [5] - The integration of Edge Impulse into Qualcomm's Leap AI local device solutions allows for secure, offline AI inference and training, supporting models with up to 120 billion parameters [5]

在旗舰级产品落地方面，高通专为AI定义汽车打造的骁龙座舱平台至尊版与Snapdragon Ride平台至尊版，凭借高性 能计算能力与加速AI性能，获得全球车企的广泛认可，可支持座舱系统与先进驾驶辅助系统（ADAS）中实现具身 智能和智能体智能。目前，高通已与理想、零跑、极氪、长城汽车、蔚来、奇瑞等车企达成全新合作或扩展原有合 作，车型定点总数达到10个。其中，零跑汽车发布了基于这两款平台的高性能汽车中央计算平台，这也是全球首款 采用双骁龙8797打造的中央域控制器；Garmin佳明也宣布将采用骁龙汽车平台至尊版，打造其Nexus高性能计算平 台。 另一款核心产品Snapdragon Ride Flex，作为行业首款可同时支持数字座舱与先进驾驶辅助系统工作负载的量产芯 片，正加速推动汽车行业向中央计算架构转型。截至目前，该芯片已在全球8个量产车型项目中成功部署，助力AI 赋能的座舱功能与驾驶辅助功能快速普及。国内领先的汽车一级供应商车联天下、德赛西威、航盛电子、卓驭科技 等，也明确了基于Snapdragon Ride Flex的舱驾融合解决方案量产计划。 在驾驶辅助领域，高通通过推进自有端到端AI算法研发，同时 ...

Group 1 - Qualcomm is in discussions with Samsung Electronics regarding the contract manufacturing of two-nanometre chips [1]

Core Insights - Qualcomm's CEO Cristiano Amon highlighted the significant potential of the personal AI terminal market, particularly in smart wearable devices, predicting a future market size that could reach billions of units [1][3] Group 1: Market Potential - Amon stated that the next generation of personal AI devices will leverage edge AI, contextual awareness, and user data to understand user environments and intentions in real-time [3] - The expected shipment volume of these smart wearable devices is projected to reach between 10 million and 100 million units in the coming years, with a market size forecasted to reach billions of units [3] Group 2: Product Development - Amon emphasized that these devices will coexist with smartphones and will include various familiar wearable forms such as smart glasses, jewelry, pendants, rings, and brooches, creating opportunities for deep integration between technology and fashion [3] - Despite their small size, these devices require excellent energy efficiency, strong computing power, stable connectivity, and the ability to run local AI models [3] Group 3: Technological Advancements - Qualcomm's Snapdragon chips are capable of running models with billions of parameters on small wearable devices, and innovations in connectivity have been achieved, such as operating Wi-Fi at Bluetooth power levels to maintain continuous connection with smart agents [3]

首发EXMP-Q911COM-HPC Mini模组，搭载高通SoC，构建高效边缘AI平台 AI解决方案领先品牌宜鼎国际（Innodisk）宣布推出全新"AIon Dragonwing"系列计算解决方案。该系列 由宜鼎国际与高通技术公司（QualcommTechnologies, Inc.）联合开发，专为工业级边缘AI应用打造。首 款产品EXMP-Q911COM-HPCMini模组提供高达100TOPS的AI算力，兼具低功耗设计，并支持-40°C至 85°C宽温工作环境，适用于边缘端严苛场景。此外，QualcommDragonwing™ SoC提供长达至2038年的 供货保障，确保长期部署的供应链稳定。作为宜鼎"AIon ARM"产品组合的首发产品线，"AIon Dragonwing"系列标志着宜鼎集团将携手全球合作伙伴，持续推进基于ARM架构的计算解决方案，为边 缘AI开拓更多可能性。 宜鼎国际推出全新"AIon Dragonwing"系列计算解决方案 宜鼎与高通技术公司合作成果，融合卓越算力、高速接口与完整软件支持 "AIonARM"产品组合的推出，标志着宜鼎与高通技术公司的重要合作里程碑，充分体现了双方在 ...

联想集团大秀"朋友圈"，并发布个人AI（人工智能）智能体Qira及多款创新性概念产品。 当地时间1月6日，在2026年国际消费电子展（CES）开幕之际，联想集团史上最大规模的全球创新科技大会（Tech World）在拉斯维加斯举办。大 会上，联想面向全球发布被称为"首款个人超级智能体"的Lenovo Qira和一系列硬件新品，并携手英伟达推出全新的"联想人工智能云超级工厂"合 作计划。 联想集团董事长兼CEO杨元庆指出，当前，AI正以前所未有的速度突破传统界限——从内容生成拓展至感知三维空间、学习复杂逻辑，并与现实 世界深度互动。由于单一的AI模型或AI设备无法满足用户的所有需求，因此，需要打造能够整合个人智能、企业智能与公共智能的混合式AI。 杨元庆表示："最终，混合式AI将推动实现技术与人携手共进、数字世界与物理世界深度融合。对个人而言，它能强化人们的感知力、激发创造 力，最大化释放潜能。对企业而言，它将超越流程管理和工作流优化，赋能企业利用自身数据自主决策。" 四大芯片巨头CEO陆续登台，宣布多项合作计划 为了实现联想在AI时代的创新理念，在联想的带动下，四大芯片巨头齐聚一堂。英伟达CEO黄仁勋、超威半 ...

Core Insights - The article highlights the collaboration and competition among four major chip companies: NVIDIA, Intel, AMD, and Qualcomm, during the Lenovo Tech World event, emphasizing the evolving landscape of the AI industry [2] - A new partnership between Lenovo and NVIDIA aims to quadruple their business collaboration over the next three years, focusing on AI infrastructure and deployment [3][4] - The shift from traditional computing to AI-driven applications is reshaping the IT industry, with an estimated investment of $10 to $15 trillion needing upgrades to accommodate new AI architectures [4] Group 1: Collaboration and Partnerships - Lenovo and NVIDIA announced a new initiative called "Lenovo AI Cloud Super Factory," which aims to standardize AI infrastructure and streamline AI deployment for clients [5] - This collaboration is expected to help cloud service providers reduce the "time to first token" for AI deployment and scale up to 100,000 GPUs [7] - Lenovo will also be one of the first adopters of AMD's Helios AI platform, indicating a strategic partnership to address enterprise needs for local inference and data security [8] Group 2: Industry Trends and Innovations - NVIDIA's focus is on GPU-accelerated computing, while AMD emphasizes system-level architecture, showcasing the need for a comprehensive computing ecosystem rather than a single chip solution [8] - Intel's new AI PC, Aura Edition, represents a shift in the traditional PC market towards AI integration, highlighting the convergence of legacy computing systems with new AI paradigms [9] - Qualcomm is targeting AI-native endpoints, collaborating with Lenovo to develop wearable devices that function as "personal intelligent companions," indicating a trend towards low-power, always-connected devices [10] Group 3: Market Potential and Future Outlook - The wearable device market is projected to exceed one billion units, showcasing significant growth potential in this segment [11] - The article emphasizes that the true value of AI lies not in having the most powerful chip but in the ability to transform computing power into usable capabilities for businesses and consumers [11]

Core Insights - AI has transitioned from a conceptual phase to a fully realized stage, with edge AI and physical AI emerging as significant technological breakthroughs [2][3] - The latest CES highlights AI evolving from a mere function to the foundational basis of all experiences, indicating a shift in human-computer interaction [2] Group 1: Personal AI Developments - Personal AI is advancing through wearable devices, personal terminals, and computers, evolving into intelligent assistants for users [3] - Diverse hardware forms, including AI glasses, home appliances, jewelry, and cameras, are emerging to meet specific needs in areas like visual impairment assistance and outdoor activities [3] Group 2: Physical AI Advancements - Physical AI is rapidly integrating into automobiles, robots, and smart homes, enabling machines to perceive environments, understand intentions, and act in real-time [3] - The development of embodied intelligence is crucial for connecting AI with the physical world, transforming intelligence into executable productivity [3] - Robots are increasingly taking on high-intensity or repetitive tasks in logistics, manufacturing, and retail, potentially enhancing production efficiency [3] Group 3: Automotive AI Integration - The acceleration of AI capabilities in the automotive sector is a key trend, with human-vehicle interaction evolving from clicks to understanding [4] - Qualcomm and Google are deepening their collaboration in the automotive field to support the deployment of next-generation AI in vehicle scenarios [4] Group 4: Future AI Trends - Future AI will operate in a hybrid model across cloud, edge cloud, and endpoint, with edge AI being the mainstream form due to its advantages in real-time performance, reliability, privacy, and energy efficiency [4] - 6G technology is expected to play a vital role in connecting cloud and edge, facilitating the development of intelligent networks with perceptual capabilities [4] Group 5: Key Focus Areas for Edge AI - Future breakthroughs in edge AI are likely to concentrate on robotics and wearable devices, while smartphones, AI personal computers, and smart connected vehicles will remain significant platforms for edge AI [5]