据了解，本届展会以"All for AI，All for Green"为主题，聚焦嵌入式AI与边缘计算、存储、功率半导 体、电源、元器件以及SiP/先进封装等方向，旨在为AI时代相关行业的发展提供技术与供应链支持，吸 引了全球400多家嵌入式和电子技术供应商参展，包括国民技术（300077）、灵动微、智多晶等。 8月26日，第22届深圳国际电子展暨嵌入式展(elexcon2025)在深圳(福田)会展中心开幕。 高通技术公司产品市场总监李大龙在会上发表了题为《智慧赋能、开放协作，释放端侧AI的无限可 能》的主题演讲，深入探讨了物联网行业演进趋势下，AI、计算与连接技术在推动产业变革中的核心 作用，并分享了高通如何通过技术、产品与生态布局满足行业需求。 展会期间同步举办了十多场论坛，涉及AI算力、智能驾舱、新能源汽车三电技术、先进封装等热点议 题。另外，今年现场还特设了AI玩具、机器人和AI眼镜生态专区。 他重点介绍了高通于今年推出的高通跃龙品牌，以及该品牌下的产品组合如何通过领先的边缘侧AI、 高性能低功耗计算与连接技术，为工业及嵌入式物联网、网络和蜂窝基础设施提供支持。据李大龙介 绍，高通于2025年2月推出 ...

Summary of ST Microelectronics Analyst Conference Call Company and Industry - **Company**: ST Microelectronics - **Industry**: Semiconductor, specifically focusing on MEMS (Micro-Electro-Mechanical Systems) sensors Key Points and Arguments 1. **Acquisition Announcement**: ST Microelectronics announced the acquisition of NXP's MEMS sensor business for up to $950 million, which includes $900 million upfront and $50 million contingent on technical milestones [6][10] 2. **Strategic Fit**: The acquisition is seen as a strategic fit, enhancing ST's position in the automotive, industrial, and consumer markets. The combined product offerings will be well-balanced across these sectors [9][11] 3. **Market Position**: ST has been a leader in semiconductor sensing applications for over 20 years, with a strong presence in automotive and industrial applications. The company aims to make its sensors smarter through technology fusion and embedded AI [7][8] 4. **Revenue Generation**: NXP's MEMS business generated approximately $300 million in revenue in fiscal year 2024, indicating a significant scale for the acquired business [10] 5. **Growth Potential**: The MEMS sensor market is expected to grow at a CAGR of over 4% from 2024 to 2028, with the acquired business anticipated to grow even faster due to its focus on automotive applications [11] 6. **Accretive to Margins**: The acquired business is expected to be accretive to ST's gross and operating margins, aligning with the company's target model for 2027-2028 [10][24] 7. **Competitive Landscape**: Bosch is identified as the primary competitor in the automotive MEMS market. The acquisition positions ST as a strong alternative to Bosch, enhancing its R&D capabilities and market competitiveness [34][56] 8. **Minimal Overlap**: There is minimal product overlap between ST and NXP, allowing for a smooth integration and cross-selling opportunities within existing customer bases [15][64] 9. **Inventory Situation**: The inventory situation for MEMS products in the automotive supply chain is reported to be healthy, with ST's MEMS business showing double-digit growth year-over-year [42] 10. **Future M&A Strategy**: ST maintains a solid balance sheet post-acquisition, indicating potential for future acquisitions that align with its strategic goals [28] Other Important Content - **Technological Integration**: The acquisition allows ST to own the technology and IP previously held by NXP, enhancing its capabilities in automotive safety applications [36][56] - **Market Dynamics**: The automotive market is characterized by long entry times and significant competition, particularly from established players like Bosch. The acquisition is viewed as a means to accelerate ST's growth in this sector [58][59] - **Geographic Opportunities**: ST has a stronger presence in automotive MEMS in China compared to NXP, presenting opportunities for expanding sales in that market [65]