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天准科技(688003) - 关于调整第四届董事会审计委员会委员的公告
2025-12-31 10:31
苏州天准科技股份有限公司 关于调整第四届董事会审计委员会委员的公告 | 证券代码:688003 | 证券简称:天准科技 | 公告编号:2026-002 | | --- | --- | --- | | 转债代码:118062 | 转债简称:天准转债 | | 苏州天准科技股份有限公司董事会 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 2026 年 1 月 1 日 苏州天准科技股份有限公司(以下简称"公司")于 2025 年 12 月 31 日召开 第四届董事会第二十六次会议,审议通过了《关于调整第四届董事会审计委员会 委员的议案》。现将有关情况公告如下: 为进一步完善公司治理结构,保障董事会审计委员会的规范运作,根据《公 司章程》等相关规定,并结合公司实际情况,公司董事会调整了第四届董事会审 计委员会委员,选举公司职工代表董事陈建涛先生担任审计委员会委员,与罗来 千先生(主任委员)、楼佩煌先生共同组成公司第四届董事会审计委员会,调整 后的董事会审计委员会委员任期自本次董事会审议通过之日起至第四届董事会 任期届满之日。 特此 ...
天准科技(688003) - 关于变更公司总经理的公告
2025-12-31 10:31
苏州天准科技股份有限公司 | 证券代码:688003 | 证券简称:天准科技 | 公告编号:2026-001 | | --- | --- | --- | | 转债代码:118062 | 转债简称:天准转债 | | 关于变更公司总经理的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 一、公司总经理离任情况 (一) 提前离任的基本情况 苏州天准科技股份有限公司(以下简称"公司")董事会于近日收到总经理 徐一华先生辞去总经理职务的书面辞呈。徐一华先生为更专注履行公司董事长职 责,集中精力统筹公司战略规划、公司治理结构优化、重大决策部署等工作,故 申请辞去公司总经理职务。 辞任总经理后,徐一华先生仍将继续担任公司第四届董事会董事长、董事、 董事会战略委员会主任委员、董事会提名委员会委员、董事会薪酬与考核委员会 委员和公司核心技术人员,与新任总经理和管理团队一道,持续推动公司的长远 发展和市场竞争力的提升。 | | | | | | 是否继续 在上市公 | | 是否存 在未履 | | --- | --- | --- | --- | ...
天准科技(688003) - 关于开立可转换公司债券募集资金专项账户并签订募集资金专户存储三方监管协议的公告
2025-12-31 10:18
一、募集资金基本情况 苏州天准科技股份有限公司(以下简称"公司")已取得中国证券监督管理 委员会出具的《关于同意苏州天准科技股份有限公司向不特定对象发行可转换公 司债券注册的批复》(证监许可〔2025〕2266 号),同意公司向不特定对象发 行可转换公司债券(以下简称"本次发行")的注册申请。 公司向不特定对象发行 87,200.00 万元的可转换公司债券,期限为六年,每 张面值为人民币 100 元,发行数量为 87.20 万手(872 万张)。本次发行的募集 资金总额为人民币 872,000,000.00 元,扣除发行费用 9,722,406.43 元,实际募 集资金净额为 862,277,593.57 元。上述募集资金已于 2025 年 12 月 18 日到位, 中汇会计师事务所(特殊普通合伙)对公司募集资金到账情况进行了审验,并出 具了《苏州天准科技股份有限公司可转换公司债券募集资金到位情况验证报告》 (中汇会验[2025]11879 号)。 | 证券代码:688003 | 证券简称:天准科技 | 公告编号:2026-002 | | --- | --- | --- | | 转债代码:118062 | 转 ...
天准科技:聘任蔡雄飞为公司总经理
Mei Ri Jing Ji Xin Wen· 2025-12-31 10:10
每经头条(nbdtoutiao)——最高返现60%!惠民保年末销售乱象调查:业务员"贴钱"冲考核,谁在"赔 本赚吆喝"? 每经AI快讯,天准科技12月31日晚间发布公告称,苏州天准科技股份有限公司董事会于近日收到总经 理徐一华先生辞去总经理职务的书面辞呈。徐一华先生为更专注履行公司董事长职责,集中精力统筹公 司战略规划、公司治理结构优化、重大决策部署等工作,故申请辞去公司总经理职务。辞任总经理后, 徐一华先生仍将继续担任公司第四届董事会董事长、董事、董事会战略委员会主任委员、董事会提名委 员会委员、董事会薪酬与考核委员会委员和公司核心技术人员,与新任总经理和管理团队一道,持续推 动公司的长远发展和市场竞争力的提升。经公司董事长提名、董事会提名委员会审核通过,同意聘任蔡 雄飞先生为公司总经理。 (记者 曾健辉) ...
天准科技涨2.07%,成交额6045.17万元,主力资金净流入112.92万元
Xin Lang Zheng Quan· 2025-12-31 03:14
Core Viewpoint - Tianzhun Technology's stock has shown a significant increase in price and trading activity, indicating positive market sentiment and potential growth opportunities in the automation equipment sector [1][2]. Group 1: Stock Performance - On December 31, Tianzhun Technology's stock rose by 2.07%, reaching 58.61 CNY per share, with a trading volume of 60.45 million CNY and a turnover rate of 0.54%, resulting in a total market capitalization of 11.389 billion CNY [1]. - Year-to-date, the stock price has increased by 36.93%, with a 1.47% rise over the last five trading days, 9.14% over the last 20 days, and 0.95% over the last 60 days [1]. Group 2: Financial Performance - For the period from January to September 2025, Tianzhun Technology reported a revenue of 977 million CNY, reflecting a year-on-year growth of 14.79%. However, the net profit attributable to shareholders was a loss of 15.169 million CNY, a decrease of 10.98% compared to the previous year [2]. - Since its A-share listing, the company has distributed a total of 516 million CNY in dividends, with 268 million CNY distributed over the past three years [2]. Group 3: Shareholder Information - As of September 30, 2025, the number of shareholders for Tianzhun Technology increased to 13,100, up by 18.91% from the previous period, while the average number of circulating shares per shareholder decreased by 15.67% to 14,830 shares [2]. - Notable institutional holdings include the Huaxia CSI Robot ETF, which is the sixth largest shareholder with 2.667 million shares, an increase of 497,100 shares from the previous period [2].
鼎捷转债、天准转债今日上市
Mei Ri Jing Ji Xin Wen· 2025-12-31 00:31
Group 1 - The core point of the article is that Dingjie Convertible Bonds and Tianzhun Convertible Bonds were listed on December 31 [1] Group 2 - The listing of these convertible bonds indicates a potential opportunity for investors in the bond market [1] - The event reflects ongoing activities in the financial market, particularly in the area of convertible securities [1]
天准科技:天准星智已经成为多家头部人形机器人公司的主要供应商
Zheng Quan Ri Bao· 2025-12-30 12:07
证券日报网讯 12月30日,天准科技在互动平台回答投资者提问时表示,在2025年,天准星智面向人形 机器人的具身智能控制器已经形成大批量销售,且新推出的基于英伟达Jetson Thor的大算力具身智能控 制器也已经开始小批量销售。天准星智已经成为多家头部人形机器人公司的主要供应商,万境千寻(北 京)科技有限公司是天准星智在此领域的客户。 (文章来源:证券日报) ...
天准科技(688003.SH):天准星智已经成为多家头部人形机器人公司的主要供应商
Ge Long Hui A P P· 2025-12-30 07:55
格隆汇12月30日丨天准科技(688003.SH)在投资者互动平台表示,在2025年,天准星智面向人形机器人 的具身智能控制器已经形成大批量销售,且新推出的基于英伟达Jetson Thor的大算力具身智能控制器也 已经开始小批量销售。天准星智已经成为多家头部人形机器人公司的主要供应商,万境千寻(北京)科 技有限公司是天准星智在此领域的客户。 ...
固收-1月债市展望
2025-12-29 15:50
Summary of Key Points from the Conference Call Industry Overview - The conference call primarily discusses the bond market outlook for early 2026, focusing on government bonds and credit bonds, with specific attention to the impact of monetary policy and market dynamics on these instruments [1][3][9]. Core Insights and Arguments - **Monetary Policy and Market Sentiment**: The expectation for monetary policy easing is limited, with concerns about increased government bond supply, particularly from Shandong province, which is set to issue nearly 100 billion in a single day [1][2]. - **Interest Rate Projections**: The forecast for the 10-year government bond yield is between 1.75% and 1.85%, while the 30-year yield is expected to be around 2.3% [1][3][9]. - **Social Financing Growth**: A slight increase in social financing growth is anticipated, projected to rise by 0.1%, but overall, significant upward movement is not expected [1][4]. - **Inflation Expectations**: The impact of rising prices of small and precious metals on the Producer Price Index (PPI) is expected to be limited due to their low weight in the PPI calculation. The CPI is projected to reach 1.5% year-on-year in February 2026, influenced by seasonal factors and technical issues [1][5]. - **Market Stability**: The central bank is expected to maintain market stability through liquidity easing and purchasing operations, with large banks and insurance companies actively participating in the market [1][7][8]. Investment Strategy - **Focus on Space Selection**: The current investment strategy should prioritize space selection over timing, given the stability of interest rate ceilings [1][8]. - **Credit Bond Recommendations**: The most secure investments are expected to be in three-year perpetual bonds, followed by AA- to AA+ rated city investment bonds, and then five-year perpetual bonds and two-year general credit bonds [1][10]. - **Convertible Bonds**: There is a notable demand for convertible bonds at the beginning of the year, although the current low holding levels of insurance and pension funds may affect this trend [1][11]. Additional Insights - **Market Dynamics**: The bond market is expected to experience fluctuations, but significant declines are not anticipated. The market consensus suggests that the peak for the 10-year government bond yield will be around 2.0% [1][9]. - **Sector Performance**: In the convertible bond market, sectors such as AI and robotics are performing well, while previous strong sectors like non-ferrous metals are adjusting [1][14]. - **New Issuances**: There has been an increase in the issuance of new bonds, particularly in the technology sector, with promising opportunities expected in January 2026 [1][15]. Conclusion - The bond market outlook for early 2026 suggests a stable yet cautious environment, with specific strategies recommended for navigating the anticipated fluctuations and opportunities in various sectors. The focus remains on maintaining a balanced approach to investment, considering both the macroeconomic indicators and sector-specific trends.
10月恢复出货以来,安世中国出货超110亿片芯片
Xin Lang Cai Jing· 2025-12-29 13:44
Supply News - Anshi China has shipped over 11 billion chips since resuming shipments in mid-October, serving over 800 global customers [1][7] - In response to semiconductor-related disputes, Wentai Technology has initiated multiple legal proceedings in the Netherlands and submitted a dispute notice, potentially seeking international arbitration with claims up to $8 billion if unresolved within six months [1][7] Project Progress - The third phase of the Muling North Semiconductor Technology Co., Ltd. project has officially commenced production, with a total investment of 2 billion yuan and an annual capacity of 1 million 6-inch wafers, primarily for applications in new energy vehicles, industrial control, and photovoltaics [2][8] - The core equipment for the New Beauty Materials New Station Optical Functional Film project was moved in on December 25, marking significant progress, with a total investment of approximately 5 billion yuan and plans for five internationally leading intelligent display material production lines, expected to achieve mass production by the third quarter of 2026 [2][8] Corporate Dynamics - Zhongwei Company won a provincial patent award for its invention patent "Chemical Vapor Deposition Reactor or Epitaxial Layer Growth Reactor and Its Supporting Device" and also secured the gold award in the second "Changgao Competition" for high-value patent transformation [3][9] - Noreco announced on December 26 the launch of a new product series, Optical Critical Dimension (OCD) equipment NKShape, successfully delivered to a leading domestic customer, designed for advanced semiconductor processes [3][9] - Tianzhun Technology announced on December 28 the successful completion of its public offering of convertible bonds, totaling 872 million yuan, with the bonds set to be listed on the Shanghai Stock Exchange on December 31, 2025 [4][10] - Chipone announced on December 26 that its shareholder, the National Integrated Circuit Industry Investment Fund, plans to reduce its holdings by up to 8.9396 million shares, accounting for no more than 1.70% of the total share capital [4][10] - SK Hynix is accelerating the construction of its 2.5D packaging production line to enhance its overall packaging capabilities for AI semiconductors, including high bandwidth memory (HBM) [4][10] - Media reports indicate that MediaTek announced a strategic partnership with global automotive component supplier DENSO to jointly develop customized automotive system-on-chip (SoC) solutions for advanced driver assistance systems (ADAS) and smart cockpit applications [4][10]