2026 年 2 月 27 日 刘梦麟 SAC 执业证书编号： S0340521070002 电话：0769-22110619 邮箱： liumenglin@dgzq.com.cn 报 陈伟光 S0340520060001 电话：0769-22119430 邮箱： chenweiguang@dgzq.com.cn 资料来源：东莞证券研究所，iFind 究 超配（维持） 半导体行业双周报（2026/02/13-2026/02/26） 英伟达超预期财报彰显 AI 高景气 行 业 周 投资要点： 本报告的风险等级为中高风险。 本报告的信息均来自已公开信息，关于信息的准确性与完整性，建议投资者谨慎判断，据此入市，风险自担。 请务必阅读末页声明。 半导体行业 半导体行业指数近两周涨跌幅：截至2026年2月26日，申万半导体行业指 数近两周（2026/02/13-2026/02/26）累计上涨2.86%，跑赢沪深300指 数2.71个百分点；2026年以来申万半导体行业指数累计上涨17.18%，跑 赢沪深300指数15.09个百分点。 SAC 执业证书编号： 行业新闻与公司动态：（1）机构：涨价效应带动2025年第四季度 ...

每经AI快讯，2月27日，乐鑫科技发布业绩快报，2025年实现营业总收入25.65亿元，同比增长27.82%； 归母净利润4.98亿元，同比增长46.72%；基本每股收益3.152元。 （文章来源：每日经济新闻） ...

乐鑫科技公告称，2025年度公司实现营业收入256,527.54万元，同比增加27.82%；归属于母公司所有者 的净利润49,784.01万元，同比增加46.72%。营业利润、利润总额同比分别增加51.83%、52.47%。业绩 增长源于新增客户导入、既有客户项目放量与复购。研发费用同比增长约23.07%，经营活动现金流量 净额同比增加30,214.95万元。此外，因发行股票等，归属于母公司的所有者权益同比增107.38%。数据 为初步核算，以年报为准。 ...

乐鑫科技公告，2025年度实现营业收入25.65亿元，同比增长27.82%；营业利润5.07亿元，同比增长 51.83%；利润总额5.08亿元，同比增长52.47%；净利润4.98亿元，同比增长46.72%；扣除非经常性损益 后净利润4.55亿元，同比增长47.62%。 ...

Group 1 - The core point of the news is that Lexin Technology's stock price increased by 5.62% to 170.56 CNY per share, with a trading volume of 560 million CNY and a turnover rate of 2.17%, resulting in a total market capitalization of 28.508 billion CNY [1] - Lexin Technology, established on April 29, 2008, and listed on July 22, 2019, is primarily engaged in the research, design, and sales of integrated circuit products [1] - The main revenue composition of Lexin Technology includes modules and development kits at 60.47%, chips at 38.89%, and others at 0.64% [1] Group 2 - Among the top circulating shareholders of Lexin Technology, a fund under Harvest Fund Management holds a significant position, having reduced its holdings by 100,100 shares to 2.134 million shares, representing 1.36% of the circulating shares [2] - The Harvest SSE STAR Chip ETF (588200), established on September 30, 2022, has a latest scale of 39.658 billion CNY, with a year-to-date return of 13.84% and a one-year return of 59.66% [2] - The fund manager, Tian Guangyuan, has a tenure of 4 years and 355 days, with the fund's total asset size at 79.133 billion CNY, achieving a best return of 168.19% and a worst return of -46.65% during his tenure [2]

数据显示，截至2026年1月30日，中证人工智能主题指数(930713)前十大权重股分别为中际旭创、新易 盛、寒武纪、澜起科技、科大讯飞、中科曙光、海康威视、豪威集团、芯原股份、金山办公，前十大权 重股合计占比57.27%。 AI人工智能ETF(512930)，场外联接(平安中证人工智能主题ETF发起式联接A：023384；平安中证人工 智能主题ETF发起式联接C：023385；平安中证人工智能主题ETF发起式联接E：024610)。 风险提示：基金有风险，投资需谨慎。基金管理人承诺以诚实信用、勤勉尽责的原则管理和运用基金资 产，但不保证本基金一定盈利，也不保证最低收益。基金管理人提醒投资人基金投资的"买者自负"原 则，在做出投资决策后，基金运营状况与基金净值变化引致的投资风险，由投资人自行负担。基金的过 往业绩及其净值高低并不预示其未来业绩表现，基金管理人管理的其他基金的业绩不构成对本基金业绩 表现的保证。投资人购买基金，既可能按其持有份额分享基金投资所产生的收益，也可能承担基金投资 所带来的损失。投资人应当认真阅读《基金合同》《招募说明书》等基金法律文件，全面认识本基金的 风险收益特征和产品特性，并根据自 ...

AI应用的落地离不开端侧硬件支撑，其快速发展也持续抬升端侧硬件需求，豆包手机形态、Openclaw 带火的Mac Mini均是端侧AI终端落地的标志性案例。AI应用对端侧硬件算力与效率提出明确要求，推 动传统手机、PC芯片加速向高端化升级，也推动相关芯片在制程工艺与架构设计上持续革新。PC和手 机作为核心用户入口，是大模型从算力中心走向物理世界、触达C端与B端用户的第一入口，也是端侧 AI最大的落地载体；该赛道亦吸引各大云厂商跨界布局，新兴力量的突围进一步重塑市场竞争格局。 抓住端侧入口的大厂，以及积极适配新型AI应用、重新定义PC和手机芯片产品的公司将在AI竞争中占 据优势。行业巨头虽坐拥深厚的端侧芯片技术壁垒，可满足低功耗与高端算力的核心要求，但仍需与时 俱进，以软件模型驱动硬件产品创新，方能持续稳固行业领先地位。 车载场景是端侧AI落地的最佳实践场景，车载芯片的迭代升级与国产生态构建将迎来重要发展机遇 智通财经APP获悉，东吴证券发布研报称，互联网与云算力大厂加速布局端云协同硬件生态、筑牢AI转 型硬件底座，云算力企业与互联网大厂均在持续加大端侧布局力度，通过搭建端云协同的闭环硬件生态 体系，夯实自身向 ...

东吴证券近日发布2026年端侧AI产业深度：互联网与云算力大厂加速布局端云协同硬件生态、筑牢AI 转型硬件底座，云算力企业与互联网大厂均在持续加大端侧布局力度，通过搭建端云协同的闭环硬件生 态体系，夯实自身向AI全面转型的底层硬件支撑。 IoT市场是当前规模最大的蓝海市场，也是国产替代的核心机遇所在。IoT覆盖穿戴、家居、工业等多元 场景，不仅对硬件技术能力提出要求，更需要适配具体场景与终端的定制化解决方案和软件生态。国产 芯片依托国内丰富的终端消费电子产业基础，拥有广阔的合作开发空间。其中，AI眼镜仍是当下尚未 被证伪的优质端侧场景，无论是作为手机的衍生产品，还是探索替代手机的产业方向，均在持续寻求最 优解决方案。具身智能有望实现与IoT、智能驾驶领域的技术能力平滑迁移，其适配场景的需求逐步清 晰，这些尚未完全定型的终端AI新场景，均为国产IoT芯片带来重要发展机遇。 端侧存储芯片：兆易创新等 以下为研究报告摘要： 投资要点 AI应用迭代驱动端侧硬件需求持续攀升，端侧高算力升级推动传统手机和PC端侧存量市场格局重塑， 行业巨头需依托AI软件需求驱动硬件创新以巩固地位。AI应用的落地离不开端侧硬件支撑，其快速 ...

Investment Rating - The report maintains a rating of "Buy" for the electronic industry, indicating a positive outlook for investment opportunities in this sector [1]. Core Insights - The IoT market is identified as the largest blue ocean market, presenting significant opportunities for domestic substitution, particularly in customized solutions and software ecosystems [2]. - The report emphasizes the importance of hardware supply chain enterprises in the AI transformation, as major internet and cloud computing companies accelerate their hardware ecosystem development [2]. - The evolution of edge AI is seen as a critical trend, with the need for high-performance edge hardware driving innovation in traditional mobile and PC markets [5][6]. - The automotive sector is highlighted as a prime application area for edge AI, with significant opportunities arising from the upgrade of in-vehicle chips and the construction of domestic ecosystems [5]. Summary by Sections 1. Edge AI and Domestic Supply Chain Opportunities - The transition of edge AI from concept to a well-defined industry path marks a strategic shift towards physical world applications, driven by privacy, security, and latency considerations [15]. - The deep restructuring of edge hardware provides a systemic elevation opportunity for domestic supply chains, particularly in new terminal markets like AI glasses and embodied intelligent robots [16]. 2. AI Empowering Mobile and PC Market Innovations - The demand for high-end smartphones is increasing due to the rapid adoption of AI technology, with projections indicating that by 2028, 54% of smartphones will feature edge AI capabilities [18]. - The average selling price (ASP) of smartphones is expected to rise, with a notable increase in the proportion of high-end models, driven by the demand for AI functionalities [21][19]. - The report notes that the semiconductor industry is experiencing a shift towards higher-end chip manufacturing processes, with TSMC's 2nm technology expected to enhance performance and efficiency significantly [23][24]. 3. Automotive Electronics and Edge AI Growth - The automotive sector is positioned as a second growth engine for edge AI, with in-vehicle chips evolving to meet the demands of intelligent driving and user interaction [5]. - The report discusses the competitive landscape of automotive chips, highlighting the rapid advancements in domestic chip manufacturers and their collaboration with new energy vehicle companies [5]. 4. Internet Giants Building Edge-Cloud Collaborative Ecosystems - Major internet companies are establishing comprehensive strategies that integrate cloud, AI, and chip development to strengthen their hardware foundations for AI transformation [10]. - The report outlines the strategic moves of companies like Alibaba, ByteDance, and Tencent in creating a cohesive hardware ecosystem that supports AI applications across various sectors [10].

Core Insights - The 2026 Spring Festival Gala marked a significant shift with AI becoming the main attraction, integrating deeply into the event in unprecedented ways [1][11] Group 1: AI Application and Engagement - The core of this AI-driven event was the "Doubao" application from ByteDance, which played a crucial role as the exclusive AI cloud partner, contributing to both technical support and interactive segments [3][4] - "Doubao" launched a large-scale "Doubao New Year" campaign a week before the gala, featuring exciting lottery activities with over 100,000 high-tech prizes, including robots and electric vehicles, to engage the audience [3][4] Group 2: Technical Infrastructure - Behind the scenes, ByteDance's video generation model Seedance 2.0 was responsible for creating customized visual experiences for several performances, enhancing the overall viewer experience [6] - The AI server supply chain was led by Inspur Information, which provided high-performance servers equipped with NVIDIA H800 GPUs, crucial for supporting "Doubao" and the gala's high concurrency interactions [7] Group 3: Data and Content Supply - Hai Tian Rui Sheng, a leader in AI training data, supplied high-quality multimodal training data for "Doubao," while Visual China provided essential image and video content [9] - The marketing aspect was significantly supported by BlueFocus, which integrated "Doubao" into its marketing platform, facilitating AI-driven promotional activities for the gala [9] Group 4: Hardware and Software Collaboration - Zhongke Chuangda was designated as the sole system-level software partner for "Doubao," focusing on optimizing the AI's performance on various devices [8] - ZTE collaborated with "Doubao" to develop AI smartphones, while other companies provided essential components for AI-enabled devices, ensuring seamless integration of AI technology into consumer products [8]