国泰海通证券股份有限公司（以下简称"国泰海通"或"保荐机构"）作为 天津金海通半导体设备股份有限公司（以下简称"金海通"或"公司"）首次公 开发行股票并在主板上市持续督导的保荐机构，根据《证券发行上市保荐业务管 理办法》《上海证券交易所股票上市规则》《上海证券交易所上市公司自律监管指 引第 1 号——规范运作》《上海证券交易所上市公司自律监管指引第 11 号——持 续督导》《上市公司募集资金监管规则》等有关法律法规和规范性文件的要求， 就公司使用部分闲置募集资金进行现金管理的事项进行了审慎核查，并发表如下 核查意见： 一、投资情况概述 （一）投资目的 为提高募集资金使用效率，在不影响募集资金投资项目建设及确保资金安全 的情况下，公司合理利用闲置募集资金进行现金管理，可以增加公司收益，为公 司和股东谋取更多的投资回报。 国泰海通证券股份有限公司 关于天津金海通半导体设备股份有限公司 使用部分闲置募集资金进行现金管理的核查意见 （二）投资金额 经中国证券监督管理委员会证监许可[2023]83 号文《关于核准天津金海通半 导体设备股份有限公司首次公开发行股票的批复》核准，公司于 2023 年 2 月公 开发行人民币 ...

天津金海通半导体设备股份有限公司 关于使用部分闲置募集资金进行现金管理的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 证券代码：603061 证券简称：金海通 公告编号：2026-014 一、投资情况概述 （一）投资目的 为提高募集资金使用效率，在不影响募集资金投资项目建设及确保资金安全 的情况下，公司合理利用闲置募集资金进行现金管理，可以增加公司收益，为公 司和股东谋取更多的投资回报。 （二）投资金额 重要内容提示： 投资种类：安全性高、流动性好、单项产品期限最长不超过 12 个月 的保本型产品（包括但不限于结构性存款、定期存款、大额存单、协定存款 等） 投资金额：不超过人民币 2.2 亿元（含本数） 已履行及拟履行的审议程序：本事项已经天津金海通半导体设备股份 有限公司（以下简称"公司"）第二届董事会第二十四次会议审议通过。保荐 机构已发表明确的同意意见。本事项无需提交股东会审议。 特别风险提示: 尽管公司使用募集资金购买安全性高、流动性好、保 本型的理财产品，总体风险可控，但金融市场会受宏观经济等影响，公司将 根 ...

关于为全资子公司提供担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 被担保人名称：天津金海通半导体设备股份有限公司（以下简称"公司"） 全资子公司 JHT SEMICONDUCTOR SDN. BHD.（以下简称"马来西亚槟城金海 通"）。 预计担保额度及已实际为其提供的担保余额：公司拟为马来西亚槟城金 海通提供不超过人民币 1,500 万元（含美元、林吉特或其他等值货币）的担保。 截至本公告披露日，公司已实际为马来西亚槟城金海通提供的担保余额为 0 元， 无逾期对外担保情形。 证券代码：603061 证券简称：金海通 公告编号：2026-015 天津金海通半导体设备股份有限公司 本次对外担保已经公司第二届董事会第二十四次会议审议通过，无需提 交股东会审议。 一、担保情况概述 （一）担保基本情况 为满足公司全资子公司马来西亚槟城金海通生产经营和业务发展的资金需 求，公司拟为马来西亚槟城金海通贷款业务提供担保，担保额度预计不超过人民 币1,500万元（含美元、林吉特或其他等值货币）。具体授信品种、担保 ...

证券代码：603061 证券简称：金海通 公告编号：2026-013 天津金海通半导体设备股份有限公司 第二届董事会第二十四次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 一、董事会会议召开情况 天津金海通半导体设备股份有限公司（以下简称"公司"）第二届董事会第二十 四次会议于 2026 年 2 月 3 日在公司会议室以现场结合通讯的方式召开。会议通知已 于 2026 年 1 月 29 日以电子邮件、电话、短信等方式送达全体董事。本次会议应出 席董事 9 人，实际出席董事 9 人（其中：通讯方式出席董事 7 人）。 会议由董事长崔学峰召集并主持，部分高级管理人员列席。本次会议召集和召 开程序符合《中华人民共和国公司法》等有关法律、法规、规章和《天津金海通半 导体设备股份有限公司章程》的规定。 本议案已经公司第二届董事会审计委员会第十七次会议审议通过。 表决结果：9 票同意，0 票反对，0 票弃权，0 票回避。 此议案获得通过。 二、董事会会议审议情况 经各位董事认真审议，会议形成了如下决议： （一）审议通过《关 ...

Group 1 - The company will utilize up to 220 million yuan of idle raised funds for cash management, investing in high-security, liquid principal-protected products with a maximum term of 12 months [1] - This investment has been approved by the company's board of directors, and the sponsor institution has expressed agreement [1] - The funds will be used in a rolling manner within 12 months to enhance the efficiency of fund utilization and increase company returns [1] Group 2 - The investment will not affect the construction of fundraising projects or the safety of funds [1] - The company will adjust its investment strategy in response to market changes and will strictly adhere to relevant regulations for management [1]

Group 1 - The Shanghai Stock Exchange's Sci-Tech Innovation Board semiconductor materials and equipment index decreased by 1.85%, with mixed performance among constituent stocks [1] - The semiconductor equipment ETF Huaxia fell by 1.6%, with a latest price of 1.91 yuan and a trading volume of 141 million yuan [1] - The semiconductor materials and equipment index from Zhongzheng dropped by 1.64%, with leading stocks like Xidian Co. and Kangqiang Electronics showing gains, while Yuyuan New Materials and Hu Silicon Industry faced declines [1] Group 2 - FPT Group of Vietnam announced the establishment of the first domestically owned semiconductor chip packaging and testing factory, with phase one expected to be completed by April 30, 2026 [2] - The factory's phase one will cover 1,600 square meters and include six functional testing lines, with plans for expansion in phase two to increase production capacity significantly [2] - Analysts believe that the demand for AI chips and storage will positively impact the upstream packaging and testing sector, leading to price increases and capacity expansions among leading manufacturers [2] Group 3 - The Sci-Tech Innovation Board semiconductor ETF tracks the semiconductor materials and equipment index, focusing on companies in semiconductor equipment (60%) and materials (25%) [3] - The semiconductor equipment ETF Huaxia also emphasizes the upstream semiconductor sector, with a significant focus on domestic substitution opportunities [3] - The semiconductor industry is seen as a critical area for domestic replacement, benefiting from low domestic substitution rates and high ceilings for domestic alternatives [3]

Core Viewpoint - The semiconductor materials and equipment sector is experiencing volatility, with the index showing a decline while certain stocks demonstrate mixed performance [1][2] Group 1: Index Performance - As of January 29, 2026, the CSI Semiconductor Materials and Equipment Theme Index (931743) decreased by 4.21% [1] - Over the past two weeks, the semiconductor equipment ETF from E Fund (159558) has increased by 7.04%, ranking 1 out of 5 among comparable funds [1] Group 2: Stock Performance - Leading stocks include Fuchuang Precision, which rose by 2.94%, and Jinhaitong, which increased by 0.98% [1] - Declining stocks include Jingyi Equipment, which fell by 8.91%, and Shenkong Co., which dropped by 8.69% [1] Group 3: ETF Trading Activity - The E Fund semiconductor equipment ETF had a turnover rate of 6.7% and a trading volume of 310 million yuan [1] - The average daily trading volume over the past week was 321 million yuan, placing it in the top 2 among comparable funds [1] Group 4: Fund Size and Inflows - The latest size of the E Fund semiconductor equipment ETF reached 4.758 billion yuan, marking a one-year high and ranking 2 out of 5 among comparable funds [1] - Recent net outflow was 2.2458 million yuan, but over the last five trading days, there were net inflows on four days, totaling 304 million yuan [1] Group 5: Index Composition - The top ten weighted stocks in the CSI Semiconductor Materials and Equipment Theme Index account for 65.08% of the index [2] - Key companies in the top ten include Northern Huachuang, Zhongwei Company, and Tuo Jing Technology [2]

截至2026年1月29日13:58，上证科创板半导体材料设备主题指数下跌3.91%。成分股方面涨跌互现，欧 莱新材领涨6.4%，富创精密上涨3.04%，耐科装备上涨0.99%；京仪装备领跌8.42%，安集科技下跌 8.03%，神工股份下跌7.27%。科创半导体ETF（588170）下跌3.86%，最新报价1.82元。流动性方面， 科创半导体ETF盘中换手10.8%，成交8.9亿元，市场交投活跃。 相关ETF：公开信息显示， 科创半导体ETF（588170）及其联接基金（A类：024417；C类：024418） 跟踪上证科创板半导体材料设备主题指数，囊括科创板中 半导体设备（60%）和半导体材料（25%）细 分领域的硬科技公司。 半导体设备和材料行业是重要的国产替代领域，具备国产化率较低、国产替代 天花板较高属性，受益于人工智能革命下的半导体需求，扩张、科技重组并购浪潮、光刻机技术进展。 半导体设备ETF华夏（562590）及其联接基金（A类：020356；C类：020357），指数中半导体设备 （63%）、半导体材料（24%）占比靠前，充分聚焦半导体上游。 爱建证券认为，存储芯片封测行业充分受益于下游需求市场 ...

Group 1: Semiconductor Market Performance - The Shanghai Stock Exchange Sci-Tech Innovation Board Semiconductor Materials and Equipment Theme Index (950125) decreased by 3.11% as of January 29, 2026 [1] - Notable performers included Fuchuang Precision, which rose by 4.33%, and Oulaixin Materials, which increased by 3.42%, while Jingyi Equipment led the decline with a drop of 7.26% [1] - The ChiNext Semiconductor Materials and Equipment Theme Index (931743) fell by 3.45%, with Fuchuang Precision again leading gains at 3.82% [1] Group 2: ETF Performance - The Sci-Tech Semiconductor ETF (588170) declined by 3.17%, with a latest price of 1.83 yuan, and had a turnover rate of 8.94% with a transaction volume of 739 million yuan [1] - The Semiconductor Equipment ETF Huaxia (562590) also saw a decrease of 3.35%, with a latest price of 1.96 yuan and a turnover rate of 5.31% with a transaction volume of 160 million yuan [1] - Over the past week, the average daily transaction volume for the Sci-Tech Semiconductor ETF was 1.282 billion yuan, while the Semiconductor Equipment ETF Huaxia averaged 240 million yuan [1] Group 3: Alibaba's AI Chip Development - Alibaba's PingTouGe launched the high-end AI chip "Zhenwu 810E," which has been deployed in multiple large-scale clusters on Alibaba Cloud, serving over 400 clients including State Grid and Xiaopeng Motors [2] - This development positions Alibaba as the second global company, after Google, to possess a full-stack self-developed capability in "large models + cloud + chips" [2] - According to Shenwan Hongyuan, Alibaba is a rare domestic cloud provider with a complete self-developed technology system encompassing "chips, servers, cloud computing operating systems, and large models," with revenue and profit margins in the domestic top tier [2]

Summary of the Conference Call Industry Overview - The semiconductor industry is experiencing a price increase across the board, particularly in the packaging and testing (封测) segment, driven by strong demand from AI applications [1] - The price increase for packaging services from companies like ASE (日月光) is projected to rise by 5%-20%, exceeding previous expectations of 5%-10% [1] Core Insights - **Demand Drivers**: Advanced packaging is essential for AI chips, and with the expansion of advanced manufacturing expected to ramp up in 2026, a significant demand surge in the packaging segment is anticipated [1] - **Supply Dynamics**: Local packaging manufacturers are actively investing in 2.5D/3D packaging technologies and are making substantial capital expenditures (Capex) to expand capacity, positioning themselves to meet the expected demand surge [1] Financial Projections - The unit price for 2.5D/3D packaging, exemplified by the multi-chip integration packaging from 盛合晶微, is expected to reach 50,000 yuan per piece, with a gross margin of approximately 30%+ under conditions of 63% capacity utilization [1] - Assuming a production rate of 10,000 pieces per month, this could lead to an additional revenue of 6 billion yuan annually, significantly enhancing net profits [1] Key Players in the Industry - **Packaging Manufacturers**: Notable companies include 长电科技, 通富微电, 佰维存储, 甬矽电子, 汇成股份, and 华天科技 [1] - **Third-party Testing Firms**: Companies such as 伟测科技 and 利扬芯片 are mentioned [1] - **Equipment Manufacturers**: Key players include 金海通, 华峰测控, 芯碁微装, 芯源微, and 华海清科 [1] Risk Factors - Potential risks include industry conditions not meeting expectations and technological advancements not progressing as anticipated [1]