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英特尔下一代旗舰CPU亮相,3D先进封装技术受关注
Xuan Gu Bao· 2025-09-25 14:35
Group 1 - Intel showcased its next-generation Xeon processors at the 2025 Yunqi Conference, utilizing the new Intel 18A process technology and Foveros Direct3D advanced packaging technology to enhance performance and efficiency [1] - The advanced packaging market is rapidly growing, driven by AI market demand, with a projected market size increase from $44.3 billion in 2022 to $78.6 billion by 2028, representing a compound annual growth rate (CAGR) of 10% from 2022 to 2028 [1] - In the advanced packaging market, FC packaging held the largest share at 51% in 2022, while 2.5D/3D packaging accounted for 21%. By 2028, FC packaging's share is expected to decrease to 47%, and 2.5D/3D packaging's share is projected to rise to 33%, making 2.5D/3D packaging the fastest-growing advanced packaging form [1] Group 2 - Changdian Technology possesses advanced and comprehensive chip manufacturing technologies, including wafer-level packaging (WLP), 2.5D/3D packaging, and system-in-package (SiP) solutions [1] - Northern Huachuang is actively developing in the advanced packaging field, providing comprehensive thin film deposition, electroplating, and etching equipment for 2.5D/3D packaging and system-in-package (SiP) technologies [2]
中国产业叙事:通富微电
新财富· 2025-09-25 08:55
20世纪90年代,石明达临危受命担任南通市晶体管厂厂长。 面对南通市十五家特困企业之一的绝境,他毅然决然地将重心转向刚兴起的集成电路领域,进而四处奔走筹措资金,于1994年成功建成一条年封装超千 万块的集成电路生产线。 正如石明达当初所言:"毛主席教导我们要自力更生。别人靠不住,力量的支点要放在自己身上"。 2024年,通富微电凭借超238亿元营收和稳居全球前四的委外封测市场份额,进而成为中国重塑全球半导体市场竞争格局的关键节点——从1990年濒临 破产的南通晶体管厂,再到如今屹立于全球半导体封测行业市场前列的跨国企业,通富微电用三十余年时间,成功走出一条极具中国特色的生存发展之 路。 0 1 通富微电的奠基时代 20世纪90年代,中国国企正在经历改革开放的阵痛期——面对这个"特困企业",石明达展现了超越时代的视野和生存的决心,进而深刻意识到,在传统 的晶体管领域已无出路,企业唯一的生机就在于向技术含量更高的集成电路产业进行转型。 如今回望,这一决策在当时无疑极具风险——集成电路产业技术门槛高、投资规模巨大,进而对于一家营收匮乏的地方国企而言,无异于一场豪赌。彼 时,石明达凭借其深厚的半导体专业背景和对产业趋 ...
先进封装,最新预测
半导体行业观察· 2025-09-02 01:11
Core Insights - The global advanced chip packaging market is projected to reach USD 50.38 billion by 2025 and USD 79.85 billion by 2032, with a compound annual growth rate (CAGR) of 6.8% from 2025 to 2032 [2][3] - The growth is driven by increasing demand for smaller, faster, and more efficient electronic devices, alongside the expansion of high-performance computing, 5G networks, and the Internet of Things (IoT) [2][3][4] - Advanced packaging technologies such as 2.5D and 3D packaging are expected to significantly boost market growth during the forecast period [2][3] Market Dynamics - Fan-out wafer-level packaging (FOWLP) is the most widely used type of advanced packaging, expected to account for 58.6% of the global market share by 2025 [2] - The Asia-Pacific region is anticipated to dominate the market with a share of 53.2% by 2025, while North America is expected to achieve the fastest growth, capturing 29.3% of the global market share by 2025 [3] Technological Trends - The demand for high-performance and miniaturized electronic devices is a key growth driver, with advanced packaging technologies being favored for their ability to support heterogeneous integration [3][5] - Emerging technologies such as artificial intelligence, IoT, 5G, and high-performance computing are creating substantial growth opportunities for advanced chip packaging companies [4][5] Industry Applications - Rapid expansion in sectors like automotive, medical devices, and industrial electronics is likely to increase the demand for advanced chip packaging, as these industries require reliable, compact, and high-performance packaging solutions [5] - The rise of electric vehicles and advanced driver-assistance systems (ADAS) is driving the need for robust semiconductor components, with advanced packaging technologies enhancing power efficiency and thermal management [5]
华创证券:AI算力需求激增 先进封装产业加速成长
智通财经网· 2025-08-26 02:15
Group 1 - The core viewpoint is that the advanced packaging market is expanding due to the rapid development of AI servers and smart vehicles, leading to increased demand for high-integration packaging solutions like Chiplet and 2.5D/3D [1][2] - Advanced packaging is becoming a key technology in the high-performance computing cycle, overcoming the limitations of Moore's Law, as traditional processes struggle with bandwidth, power consumption, and integration density challenges [1][2] - The global advanced packaging market is projected to reach $45 billion in 2024, accounting for over 55% of the overall packaging market, with a forecasted CAGR of 9.4% from 2024 to 2030 [2] Group 2 - The Chinese advanced packaging market is expected to grow rapidly, reaching a market size of 69.8 billion yuan in 2024, with a compound annual growth rate (CAGR) of 18.7% from 2020 to 2024, although its penetration rate remains at 40% [3] - Major players like TSMC are leading the AI packaging ecosystem with their CoWoS technology, while domestic manufacturers are accelerating their layouts to capture market opportunities [4] - Companies such as Longi Technology, Tongfu Microelectronics, and Huatian Technology are making significant advancements in various packaging technologies, positioning themselves competitively in the high-end process breakthrough and market share enhancement [4]
封测行业市场需求稳步提升 华天科技上半年盈利2.26亿元
Group 1 - The semiconductor industry is experiencing an overall recovery, leading to increased market demand in the packaging and testing sector, resulting in steady growth in orders and operating performance for the company, which achieved a net profit of 226 million yuan in the first half of 2025 [1] - In the first half of 2025, the company reported operating revenue of 7.78 billion yuan, a year-on-year increase of 15.81%, and a net profit of 226 million yuan, a year-on-year increase of 1.68% [1] - The second quarter saw significant growth in both revenue and net profit, with the company achieving operating revenue of 4.21 billion yuan, an increase of 643 million yuan from the first quarter, marking a record high for a single quarter [1] Group 2 - The company has completed the development of ePoP/PoPt high-density memory and automotive-grade FCBGA packaging technology for smart cockpits and autonomous driving applications in the first half of the year [2] - The company has also initiated the research and development of CPO packaging technology, with key unit process development currently underway, and completed product validation for various clients in FOPLP packaging [2] - The shareholder structure has seen changes, with the Huaxia Guozheng Semiconductor Chip ETF increasing its holding from 1.38% to 1.39%, and the CSI 500 ETF purchasing 5.099 million shares, raising its holding from 1.03% to 1.18% [2]
华天科技上半年实现营收77.8亿元,净利润同比增长15.81%
Ju Chao Zi Xun· 2025-08-18 10:18
Group 1 - The core viewpoint of the article highlights the steady growth in the company's orders and operating performance due to the overall recovery in the semiconductor industry and the increasing market demand in the packaging and testing sector [2] - In the first half of 2025, the company achieved operating revenue of 7.78 billion yuan, representing a year-on-year increase of 15.81% [3] - The net profit attributable to shareholders of the listed company was 226 million yuan, showing a year-on-year growth of 1.68% [3] - The net profit after deducting non-recurring gains and losses was -8.13 million yuan, which is a significant improvement of 77.36% year-on-year [3] Group 2 - In Q2 2025, the company achieved operating revenue of 4.21 billion yuan, an increase of 6.43 billion yuan compared to Q1, marking a record high for a single quarter [2] - The net profit attributable to shareholders in Q2 was 2.45 billion yuan, which is an increase of 2.64 billion yuan from Q1 [2] - The company completed the development of ePoP/PoPt high-density memory and automotive-grade FCBGA packaging technology for smart cockpits and autonomous driving applications during the reporting period [4] - The company has obtained 11 authorized patents during the reporting period, including 10 invention patents [4] - The company is expanding its advanced packaging industry scale and optimizing its industrial layout through the gradual release of production capacity from its Jiangsu and Shanghai projects [4]
13页PPT详解先进封装技术路线与市场趋势
材料汇· 2025-08-09 16:00
Core Insights - The article discusses the advancements and trends in the semiconductor packaging industry, particularly focusing on 2.5D and 3D packaging technologies, which are being led by major players like Intel, Samsung, and TSMC [10][11]. Advanced Packaging Trends - Advanced packaging is projected to grow significantly, with revenue expected to increase from $37.5 billion in 2021 to $65.1 billion by 2027, capturing approximately 53% of the total packaging market [16]. - The shipment volume for advanced packaging is anticipated to reach 90 billion units by 2027, with a compound annual growth rate (CAGR) of 13% for 2.5D/3D packaging [18][20]. Capital Expenditure - In 2022, the estimated capital expenditure (CapEx) for top packaging companies was $14.5 billion, up from $11.9 billion in 2021, indicating a growing investment in advanced packaging technologies [9]. Market Share and Competition - OSATs (Outsourced Semiconductor Assembly and Test) accounted for 65% of the advanced packaging wafer market in 2021, while foundries are increasingly taking market share from OSATs [23]. - Major players in the high-end packaging market include Intel, Samsung, and TSMC, which are competing vigorously in the development of advanced packaging technologies [10][12]. Technology Adoption - The adoption of chip-level packaging and heterogeneous integration is driving higher yields and optimized costs, with finer bump or pad spacing leading to increased density and faster time-to-market for products [6][10]. Global Market Overview - The global advanced packaging market is characterized by a diverse range of players, including major technology companies and specialized packaging suppliers, indicating a competitive landscape [13][14].
爱集微:2024年封测行业上市公司收入同比增长21% 先进封装迎发展机遇
Group 1 - The report by Aijimi highlights the growth of the semiconductor packaging and testing industry, projecting a total revenue of 87.056 billion yuan for listed companies in 2024, representing a year-on-year increase of 20.69% with a gross margin of approximately 15.67% [1] - The top three companies by total revenue in the packaging and testing sector are Changdian Technology (35.962 billion yuan), Tongfu Microelectronics (23.882 billion yuan), and Huatian Technology (14.462 billion yuan) [1] - The report indicates that the R&D expenditure as a percentage of revenue is highest for Liyang Chip (15.95%), Jingfang Technology (14.12%), and Weicai Technology (13.22%) [1] Group 2 - The advanced packaging market is expected to generate total revenue of $51.9 billion in 2024, with a year-on-year growth of 10.9%, and is projected to reach $78.6 billion by 2028, with a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [2] - The global semiconductor packaging market is forecasted to grow from $65.04 billion in 2020 to $118.6 billion in 2027, with a CAGR of 6.6%, while advanced packaging is expected to surpass traditional packaging in market size by 2027 [2] Group 3 - The domestic packaging and testing industry is performing well, with Chinese companies leading in brand strength, diverse teams, international operations, technical capabilities, quality assurance, production scale, and operational efficiency [3] - In 2023, capital expenditure in the advanced packaging sector reached $9.9 billion, primarily from major semiconductor companies and leading OSAT firms, with an expected increase to $11.5 billion in 2024 [3] - The report emphasizes that the growth of the semiconductor packaging market is driven by emerging technologies such as AI, IoT, cloud computing, and big data, which are increasing the demand for chips [3] Group 4 - The global Chiplet market is projected to grow from approximately $3.1 billion in 2023 to around $107 billion by 2033, with a CAGR of 42.5% from 2024 to 2033 [4] - Companies like Intel and TSMC have mature Chiplet technologies, while domestic firms such as Changdian Technology and Tongfu Microelectronics are also advancing in this area [4] - The 2.5D/3D packaging market is expected to expand from $9.4 billion in 2022 to $22.5 billion by 2028, with a CAGR of 15.6%, driven by high-performance computing and AI technologies [4]
先进封装:100页PPT详解传统工艺升级&先进封装技术
材料汇· 2025-06-27 14:12
Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications and high-performance computing [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a remarkable rate of 20.9% over the next five years, becoming a key driver for overall market growth [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is projected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is expected to increase rapidly due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets, along with the continuous application of advanced packaging technology, is expected to sustain healthy growth in the coming years [15]. - The integration of AI applications in various sectors, including automotive and consumer electronics, is driving the demand for advanced packaging solutions [30]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei are highlighted as key players benefiting from the local supply chain advantages in the advanced packaging sector [5]. - Significant investments in packaging projects are underway, with total planned investments amounting to approximately $100 billion [29]. - The ongoing demand for advanced packaging solutions is expected to lead to sustained revenue growth for companies involved in this sector [30].
先进封装:100页PPT详解传统工艺升级&先进封装技术
材料汇· 2025-06-20 15:14
Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].