Core Viewpoint - Tianyue Advanced (02631) saw a nearly 5% increase in stock price, attributed to significant advancements in silicon carbide wafer processing technology by Beijing Jingfei Semiconductor Technology, a spin-off from the Chinese Academy of Sciences [1] Company Summary - Tianyue Advanced's stock rose by 4.75% to HKD 50.7, with a trading volume of HKD 112 million [1] - The company has focused on the research and industrialization of high-quality silicon carbide substrates since its inception [1] - It is one of the few companies globally capable of mass-producing 8-inch silicon carbide substrates and was the first to commercialize the transition from 2-inch to 8-inch substrates [1] - Tianyue Advanced is also a pioneer in launching 12-inch silicon carbide substrates [1] Industry Summary - Recent breakthroughs in silicon carbide wafer processing technology are expected to lower costs and improve efficiency in the global silicon carbide industry [1] - The potential applications of silicon carbide materials in high-end computing chips have not been fully explored, indicating future growth opportunities in advanced packaging and other areas [1] - NVIDIA's plans to use silicon carbide substrates in the advanced packaging of next-generation GPU chips highlight the increasing relevance of silicon carbide in the semiconductor industry [1]

Core Viewpoint - Tianyue Advanced (02631) shares rose nearly 5%, reaching HKD 50.7 with a trading volume of HKD 112 million, following significant advancements in silicon carbide wafer processing technology by Beijing Jingfei Semiconductor Technology, a spin-off from the Chinese Academy of Sciences [1] Company Summary - Tianyue Advanced has focused on the research and industrialization of high-quality silicon carbide substrates since its inception [1] - The company is among the few globally capable of mass-producing 8-inch silicon carbide substrates and was the first to commercialize the transition from 2-inch to 8-inch substrates [1] - Tianyue Advanced is also a pioneer in launching 12-inch silicon carbide substrates [1] Industry Summary - The recent breakthrough in silicon carbide wafer processing is expected to provide a new solution for cost reduction and efficiency improvement in the global silicon carbide industry [1] - NVIDIA plans to utilize silicon carbide substrates in the advanced packaging of its next-generation GPU chips, indicating a growing application potential for silicon carbide materials in high-performance computing [1] - According to Dongfang Securities, the application potential of silicon carbide materials in high-end computing chips has not been fully explored, suggesting future growth opportunities in the industry [1]

Core Viewpoint - Tianyue Advanced (688234) reported a revenue of 794 million yuan and a net profit of 10.88 million yuan for the first half of 2025, focusing on increasing market penetration of silicon carbide substrates and enhancing R&D investment in large-size substrates [1][2][3] Financial Performance - The company achieved a revenue of 794 million yuan and a net profit of 10.88 million yuan in the first half of 2025 [1] - R&D expenses increased by 34.94% year-on-year, amounting to 75.85 million yuan, primarily for large-size substrate technology and emerging applications like AR glasses [1] Product Development and Market Position - Tianyue Advanced has made significant breakthroughs in large-size silicon carbide substrate technology, commercializing substrates from 2 inches to 8 inches and being one of the first to launch 12-inch substrates [1] - The company aims to strengthen its long-term layout in silicon carbide substrate products to capture new industry opportunities and increase market share [1] Production Capacity and Client Expansion - The company has two production bases: Jinan factory is optimizing processes to enhance capacity, while Shanghai Lingang factory has reached an annual capacity target of 300,000 conductive substrates ahead of schedule [2] - As of June 2025, the combined design capacity of both factories exceeded 400,000 substrates [2] - The company has established business relationships with over half of the top ten power semiconductor manufacturers globally and is deepening these collaborations [2] Strategic Partnerships - In August 2025, Tianyue Advanced reached a basic agreement with Toshiba Electronic Components to enhance the performance and quality of SiC power semiconductors [2] - The company is also expanding into new application scenarios for silicon carbide substrates, including partnerships with leading optical manufacturers [2] Global Expansion and Market Strategy - Tianyue Advanced successfully listed its H-shares on the Hong Kong Stock Exchange on August 20, 2025, marking a key step in its global strategy [3] - The listing is expected to accelerate overseas business development, enhance foreign financing capabilities, and improve international brand recognition [3] - The company plans to leverage the listing to capture the growing market demand for silicon carbide as a core material in the third-generation semiconductor sector, driven by the dual engines of new energy and artificial intelligence [3]

Group 1 - Tianyue Advanced (688234) officially launched its H-share global offering in August 2025, with Shenzhen Heertai (002402) as one of the cornerstone investors, subscribing for HKD 80 million [1] - Tianyue Advanced focuses on wide-bandgap semiconductor materials and is one of the few companies capable of mass production of 8-inch silicon carbide substrates, having also launched 12-inch silicon carbide substrate products [1] - In 2024, Tianyue Advanced is projected to capture 16.7% of the global silicon carbide substrate market, ranking among the top three [1] Group 2 - The company achieved a revenue of RMB 1.768 billion in 2024, representing a year-on-year growth of 41.4%, and net profit of RMB 179 million, marking a turnaround from losses [1] - The silicon carbide substrates produced by Tianyue Advanced have advantages in high voltage, high frequency, and high temperature, with applications in electric vehicle drive systems, AI servers, and smart power management modules [2] - The global silicon carbide substrate market is expected to grow from USD 1.2 billion in 2023 to USD 8.2 billion by 2030, with a compound annual growth rate of 31.1% [2]

Core Viewpoint - Tianyue Advanced successfully listed on the Hong Kong Stock Exchange, raising its market capitalization to approximately HKD 22.8 billion (around RMB 21 billion) with a strong demand for its shares during the IPO process [2][3] Group 1: IPO Details - Tianyue Advanced's H-share was issued at HKD 42.80 per share, opening at HKD 45.60, reflecting a 6.54% increase [2] - The Hong Kong public offering accounted for 35% of the total shares, with a subscription rate of 2809.19 times, while the international offering made up 65% with a subscription rate of 9.04 times [2] - The company attracted cornerstone investors including Guoneng Environmental Investment Group, Future Asset Securities, and others [2] Group 2: Company Positioning and Market - Tianyue Advanced is a leading player in the wide bandgap semiconductor materials sector, focusing on the research and industrialization of silicon carbide (SiC) substrates [3][6] - According to Frost & Sullivan, the company ranks among the top three global manufacturers of SiC substrates, holding a market share of 16.7% as of 2024 [3][7] - The company's SiC substrates are essential for industries such as electric vehicles and AI, with applications in power devices and RF devices [4][6] Group 3: Production Capabilities - Tianyue Advanced has achieved mass production of 8-inch SiC substrates and is set to launch the industry's first 12-inch SiC substrate in 2024 [6] - The company is one of the first to industrialize semi-insulating and conductive SiC substrates, enhancing production efficiency and cost-effectiveness [6][7] Group 4: Financial Performance - The company reported revenues of approximately RMB 417 million, RMB 1.251 billion, RMB 1.768 billion, and RMB 408 million for the fiscal years 2022, 2023, 2024, and the three months ending March 31, 2025, respectively [7] - Profit figures for the same periods were approximately -RMB 176 million, -RMB 46 million, RMB 179 million, and RMB 9 million [7] Group 5: Future Plans - The company plans to allocate approximately 70% of the net proceeds from the IPO to expand its production capacity for 8-inch and larger SiC substrates, 20% for enhancing R&D capabilities, and 10% for working capital and general corporate purposes [8]

Core Viewpoint - Tianyue Advanced, a leading semiconductor materials manufacturer in Shandong, successfully listed on the Hong Kong Stock Exchange, with an initial share price of HKD 42.80, rising to a peak of HKD 47.80, giving it a market capitalization of approximately HKD 228 billion (around RMB 210 billion) [1][2]. Company Overview - Tianyue Advanced is recognized as the top manufacturer of silicon carbide substrates in China and ranks among the top three globally, holding a market share of 16.7% as of 2024 [4]. - The company was established in 2010 and has pioneered the industrialization of semi-insulating and conductive silicon carbide substrates, with production sizes evolving from 2 inches to 8 inches, and plans to launch the first 12-inch silicon carbide substrate in November 2024 [6][8]. Financial Performance - The revenue figures for Tianyue Advanced from 2022 to 2025 (Q1) are as follows: RMB 4.17 billion (2022), RMB 12.51 billion (2023), RMB 17.68 billion (2024), and RMB 4.08 billion (Q1 2025). The net profits for the same periods were -RMB 1.76 billion, -RMB 0.46 billion, RMB 1.79 billion, and RMB 0.085 billion respectively [9][12]. - The gross profit margins for the same periods were -7.9% (2022), 14.6% (2023), 24.6% (2024), and 22.7% (Q1 2025) [12]. Production and Sales - Tianyue Advanced's production capacity for silicon carbide substrates has increased significantly, with annual production figures of 71,000 pieces (2022), 262,000 pieces (2023), 410,200 pieces (2024), and 83,700 pieces (Q1 2025) [25]. - The average selling prices for silicon carbide substrates have decreased from RMB 5,110.4 (2022) to RMB 3,369.4 (Q1 2025) [18]. Research and Development - The company has a dedicated R&D team of 154 members, with over 40% holding doctoral or master's degrees, and has accumulated 503 patents and 176 patent applications [16][17]. Customer Base - Revenue from the largest customer accounted for 26.0% of total revenue in 2022, decreasing to 15.3% in Q1 2025. Revenue from the top five customers represented 65.0% in 2022 and 52.9% in Q1 2025 [20][22]. Supply Chain - Tianyue Advanced has two production bases located in Shandong and Shanghai, with total construction areas of 69,732 square meters and 93,897 square meters respectively [25]. - The procurement from the largest supplier accounted for 14.4% of total procurement in 2022, increasing to 23.9% in Q1 2025 [25][30].

Investment Rating - The report assigns an IPO-specific rating of 5.9 out of 10 for the company, based on operational performance, industry outlook, valuation, and market sentiment [7]. Core Insights - The company specializes in the research and production of silicon carbide substrates, being one of the first in China to industrialize semi-insulating silicon carbide substrates and further achieve the industrialization of conductive silicon carbide substrates [9]. - The company has established partnerships with over half of the top ten global power semiconductor manufacturers, with applications in electric vehicles, AI data centers, and other fields [9]. - The global silicon carbide substrate market is highly competitive, with the company holding a market share of 16.7%, ranking among the top three manufacturers globally [9]. - The report highlights the significant growth potential in the power semiconductor market, projected to reach USD 19.7 billion by 2030, with a compound annual growth rate of 35.8% from 2024 to 2030 [9]. Financial Overview - The company’s revenue is expected to grow from approximately CNY 417 million in 2022 to CNY 1.768 billion in 2024, with a net profit of CNY 179 million anticipated in the fiscal year 2024 [9]. - The IPO price is set at a maximum of HKD 42.80, with a projected market capitalization of approximately HKD 20.435 billion post-IPO [12][13]. - The report indicates a significant discount of approximately 35.7% compared to the A-share closing price, suggesting a reasonable valuation in the context of the semiconductor sector [13]. Use of Proceeds - The company plans to allocate approximately 70% of the net proceeds from the IPO to expand its production capacity for 8-inch and larger silicon carbide substrates, 20% for enhancing R&D capabilities, and 10% for working capital and general corporate purposes [12].

Core Viewpoint - Tianyue Advanced (02631.HK) is launching a global offering of 47.7457 million H-shares, with a maximum price of HKD 42.80 per share, aiming to raise approximately HKD 1.9381 billion for capacity expansion and R&D [2][7] Group 1: Company Overview - Tianyue Advanced specializes in wide-bandgap semiconductor materials, focusing on the research and industrialization of silicon carbide (SiC) substrates [3] - The company ranks among the top three global manufacturers of SiC substrates, holding a market share of 16.7% as of 2024 [3] - Tianyue Advanced's SiC materials support key industries such as renewable energy and AI, with applications in electric vehicles, AI data centers, and photovoltaic systems [3][4] Group 2: Market Position and Technology - The company has established partnerships with over half of the top ten power semiconductor manufacturers globally [4] - Tianyue Advanced is one of the few companies capable of mass-producing 8-inch SiC substrates and has pioneered the commercialization of 12-inch SiC substrates [6] - The global SiC substrate market is highly competitive, with the top five players holding a combined market share of 68.0% [6] Group 3: Financial Performance - For the fiscal years ending March 31, 2022, 2023, 2024, and the three months ending March 31, 2025, the company reported revenues of approximately CNY 417 million, CNY 1.251 billion, CNY 1.768 billion, and CNY 408 million, respectively [7] - The company expects to allocate approximately 70% of the net proceeds from the global offering to expand its 8-inch and larger SiC substrate production capacity [7]

山東天岳先進科技股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 股份代號：2631 全球發售 聯席賬簿管理人及聯席牽頭經辦人 聯席保薦人、保薦人兼整體協調人、整體協調人、聯席全球協調人、 整體協調人、聯席全球協調人、聯席賬簿管理人及聯席牽頭經辦人 聯席全球協調人、聯席賬簿管理人及聯席牽頭經辦人 山東天岳先進科技股份有限公司 山東天岳先進科技股份有限公司 C M Y CM MY CY CMY K Project 216 Cover V08T_32mm_CHI_OP.pdf 1 7/8/2025 7:02 PM 重要提示 重要提示：如閣下對本招股章程任何內容有任何疑問，應徵詢獨立專業意見。 SICC CO., LTD. 山東天岳先進科技股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 全球發售 全球發售項下的發售股份數目 ： 47,745,700股H股（視乎超額配股權行使與 否而定） 香港發售股份數目 ： 2,387,300股H股（可予重新分配） 國際發售股份數目 ： 45,358,400股H股（可予重新分配及視乎超 額配股權行使與否而定） 最高發售價 ： 每股H股42.80港元，另加1.0%經 ...

Core Viewpoint - Tianyue Advanced, a leading global manufacturer of silicon carbide substrates, has passed the Hong Kong Stock Exchange listing hearing, with CICC and CITIC Securities as joint sponsors [1] Company Summary - Tianyue Advanced ranks among the top three silicon carbide substrate manufacturers globally, holding a market share of 16.7% in 2024 [1] - The company focuses on the research and industrialization of silicon carbide substrates, providing core materials for the new energy and AI industries [1] - Tianyue Advanced is one of the few companies capable of mass-producing 8-inch silicon carbide substrates and has been a pioneer in commercializing 2-inch to 8-inch substrates, as well as launching 12-inch silicon carbide substrates [1] - The company's silicon carbide substrates are widely used in electric vehicles, AI data centers, and photovoltaic systems [1] - Tianyue Advanced has established business partnerships with over half of the world's top ten power semiconductor device manufacturers [1] Industry Summary - The global silicon carbide substrate market is highly competitive and concentrated, with the top five players accounting for 68.0% of the market share [1] - Silicon carbide materials are rapidly developing in the power semiconductor device sector due to their superior performance [1] - The global power semiconductor device market is expected to reach a scale of $19.7 billion by 2030, with a compound annual growth rate of 35.8% from 2024 to 2030 [1]