如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自半导体芯闻综合 。 据财经报道，华为海思原总裁、现任华为半导体业务部总裁何庭波，将兼任华为高级人才定薪科科 长。该任命公告6月27日由华为创始人兼CEO任正非签发，7月1日在华为内部正式公布。 华为官方资料显示，何庭波女士出生于1969年，毕业于北京邮电大学，半导体物理和通信工程专 业双学士、硕士。1996年加入华为，历任芯片业务岗位（开发、研究、架构、供应链）、研发部 长、海思总裁、2012实验室总裁，现任科学家委员会主任、ITMT主任、半导体业务部总裁。 何庭波：半导体正处于变革的十字路口 自2004年海思成立以来，在何庭波带领下，华为半导体业务支撑了华为产品体系连续20多年的发 展和创新。 从起初的固定通信领域，到无线通信，在3G/4G/5G移动通信网络芯片、宽带接入网络芯片、光通 信芯片、数据通信芯片等领域，助力华为从跟随者成长为行业领导者；此外，还先后拓展进入了智 能手机套片、光电芯片、通用CPU、AI处理器等全球巨头同台竞技的高难度前沿领域，且取得了 一系列堪称行业里程碑的成果，如天罡多模多制式基站处理器、麒麟应用处理器、鲲鹏高性能通用 ...

Core Viewpoint - Chiplet Solutions Platform Development: The company has completed a private placement of shares, raising a total of 1.807 billion yuan, which will be primarily used for the development of Chiplet solutions in the AIGC and smart mobility sectors, as well as for the R&D and industrialization of next-generation IP targeting AIGC and graphics processing applications [1] Summary by Relevant Categories - Fundraising Details - The company announced the completion of a private placement of shares, raising a total of 1.807 billion yuan [1] - Strategic Focus Areas - The raised funds will be allocated to multiple strategic directions, including the development of Chiplet solutions for AIGC and smart mobility [1] - The funds will also support the R&D and industrialization of next-generation IP for AIGC and graphics processing scenarios [1]

Core Viewpoint - The recent IPO applications of domestic GPU companies, Moore Threads and Muxi Integrated Circuit, have reignited discussions about the challenges and potential of the domestic GPU industry, particularly regarding the high costs and the need for substantial investment to achieve profitability [1][3][4][5]. Group 1: IPO Developments - Both Moore Threads and Muxi Integrated Circuit have had their IPO applications accepted by the Shanghai Stock Exchange, marking a significant step for the domestic GPU sector [1][3]. - Muxi plans to raise 3.9 billion yuan, while Moore Threads aims to raise 8 billion yuan through their IPOs [4][5]. Group 2: Financial Performance - Muxi's projected net losses from 2022 to 2024 are 777 million yuan, 871 million yuan, and 1.4 billion yuan, with R&D expenditures of 647.8 million yuan, 699 million yuan, and 900 million yuan respectively [4]. - Moore Threads anticipates net losses of 1.84 billion yuan, 1.673 billion yuan, and 1.492 billion yuan over the same period, with R&D costs of 1.116 billion yuan, 1.334 billion yuan, and 1.359 billion yuan [5]. - Despite the losses, both companies are seeing revenue growth, with Muxi's revenue projected to reach 743 million yuan by 2024, and Moore Threads expecting 438 million yuan in the same year [7][9]. Group 3: Market Dynamics - The domestic GPU market is characterized by high competition, with various players adopting different strategies, including those aligned with NVIDIA and AMD technologies [12][14]. - The GPU industry is heavily reliant on R&D investments, with companies needing to continue funding their development efforts to remain competitive [21][22]. Group 4: Future Prospects - The AI sector is identified as a significant growth area for GPUs, with the market for AI chips in China projected to grow substantially, indicating a promising future for domestic GPU manufacturers [25][26]. - The competitive landscape is expected to undergo consolidation, as many players vie for market share, suggesting that mergers and acquisitions may become more common [26][27].

Core Viewpoint - Unisoc, as the largest independent mobile chip design company in China, has completed the IPO counseling filing for the Sci-Tech Innovation Board, with a valuation of 71.5 billion yuan, positioning itself to become the "first stock of domestic smartphone chips" [1] Market Performance - In 2024, Unisoc's revenue is expected to reach 14.5 billion yuan, marking a historical high, with global chip delivery volume reaching 1.6 billion units and over 5,000 employees, 85% of whom are R&D personnel [1] - In Q1 2025, Unisoc's global market share for smartphone chips is projected to be 10%, ranking fourth behind MediaTek (36%), Qualcomm (28%), and Apple (17%) [1] Technical Strength and Product Layout - Unisoc is one of the few companies globally that master full-scene communication technology from 2G to 5G, with products covering mobile phones, IoT, and automotive electronics [2] - Key technical highlights include: - 5G technology: One of three companies in the global open market for 5G mobile chips, launching the 6nm EUV process T8300 chip, entering the mid-range 5G smartphone market [2] - R16 features: The V620 platform fully supports 5G R16 standards, including TSN and high-precision positioning [2] - AI capability: The T820 chip's NPU computing power reaches 8 TOPS, a 67% increase from the previous generation [2] - International layout: Products cover over 140 countries, certified by more than 270 operators [2] Core Shortcomings - Dependence on the low-end market: Unisoc's products are almost exclusively used in budget phones within the Xiaomi supply chain, while MediaTek covers models under $400 and Qualcomm occupies 20% of the high-end market [2] - Performance gap: The T8100 processor's performance is only comparable to Snapdragon 765G, indicating a generational gap with flagship chips [3] - Weak profitability: Unisoc has not yet achieved profitability, with expectations to break even by 2025; the high proportion of R&D personnel (85%) indicates a need for improved technology conversion efficiency [4] - Customer concentration risk: The company heavily relies on a few smartphone manufacturers for low-end model orders, resulting in weak risk resistance [5] Peer Comparison Analysis - Comparison of Unisoc with competitors like MediaTek, Qualcomm, Huawei HiSilicon, and Xiaomi's玄戒 shows differences in core products, process levels, market positioning, and technical advantages [6] - Unisoc's core product is the T8300 5G SoC, with a 6nm EUV process, targeting budget phones under $99, while competitors focus on mid to high-end markets [7] Development Prospects and Recommendations - The IPO will provide critical capital support for Unisoc, but it must address several issues: - Product upgrades: Utilize advanced packaging technologies like chiplets to bridge process gaps and penetrate the mid to high-end market [8] - Diversified layout: Increase investment in emerging fields such as IoT and automotive electronics [8] - Technical collaboration: Leverage resources from the new Unisoc Group to strengthen cooperation across the industry chain [8] - As the IPO process advances, Unisoc is expected to accelerate technological breakthroughs, but its ability to escape the "high volume, low price" dilemma and achieve a transition to high-value markets will determine its long-term investment value [8]

Investment Rating - The report initiates coverage of K&S (KLIC US) with a Buy rating, and BE Semiconductor (BESI NA) with a Neutral rating, while maintaining a Buy rating on ASMPT (522 HK) [3][6][11]. Core Insights - Advanced packaging (AP) is expected to evolve significantly from 2025 onwards, with a shift from CoWoS-S to CoWoS-L/R, increased adoption of SoIC driven by HBM5, and potential upgrades in InFO technology led by Apple [3][6]. - The semiconductor cycle's recovery is a key catalyst for K&S and ASMPT, given their substantial sales exposure to conventional packaging [3][6]. CoWoS Technology - CoWoS technology is transitioning from CoWoS-S to CoWoS-L, with TSMC expected to increase its CoWoS-L capacity from approximately 20% in 2024 to nearly 60% in 2025 [7][21]. - CoWoS-S is anticipated to face oversupply due to non-TSMC supply chain expansions, while CoWoS-L is expected to be in demand for high-end GPUs [7][28]. SoIC Technology - SoIC is projected to gain importance with the adoption of high-NA EUV technology, although headwinds are expected in 2025 due to limited new adopters and potential capex constraints from Intel [8][14]. - AMD is currently the major adopter of SoIC, with potential future demand driven by Apple and HBM technologies [8][14]. InFO Technology - Apple is likely to adopt upgraded InFO technology from 2026 onwards, necessitating capacity upgrades to accommodate new application processor designs [9][20]. - The transition from InFO-PoP to InFO-M is expected as the I/O count between DRAM and application processors becomes insufficient [9][20]. Company-Specific Insights - K&S is positioned to be the primary TCB supplier for TSMC's on-wafer process starting in 2025, benefiting from the shift towards CoWoS-L technology [3][6]. - ASMPT is expected to gain market share in the HBM market from a low base, with its TCB potentially adopted by TSMC and Apple in the future [3][6]. - BE Semiconductor faces challenges due to rich valuations and potentially disappointing hybrid bonding orders in 2025 [3][6].

Fundraising Overview - The company, Chiplet Microelectronics (Shanghai) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue shares to specific investors, raising a total of RMB 1,806,856,851.88 [1][2] Special Account and Supervision Agreement - The company has established a special account for the raised funds, which will only be used for the designated projects and not for any other purposes [2][3] - A tripartite supervision agreement has been signed between the company, the sponsoring institution (Guotai Junan Securities Co., Ltd.), and the banks holding the funds to ensure proper management and usage of the raised capital [2][3] Specific Projects and Fund Allocation - The funds will be allocated to research and development projects in the fields of AIGC (Artificial Intelligence Generated Content) and smart mobility, specifically for the Chiplet solution platform [3][4] - The agreement stipulates that the funds must be used solely for the specified projects, ensuring investor protection and compliance with relevant regulations [4][5] Monitoring and Reporting - The sponsoring institution is responsible for ongoing supervision of the fund usage, conducting at least biannual on-site inspections to verify compliance with the agreement [6][7] - The company is required to notify the sponsoring institution of any significant expenditures from the special account and provide detailed expenditure reports [8][9]

以下文章来源于橙子不糊涂 ，作者橙子 橙子不糊涂 . 88年，集成电路背景，主要写科技，偶尔聊聊宏观和新鲜事儿。 今天信息量有点大，挑重点的说。 1，今天野村的一篇报告内容比较狂野，标题更狂野： 雄心有多雄？ 先要挑战英伟达的主导地位… 2， Meta搞的是机架级的玩意儿，看起来不像是要纯自用 。具体的： （1）MTIA T-V1（2025年底-2026年初） 由博通设计，类似AWS Trainium 2的中介层尺寸，Celestica负责机架和交换机， 广达 制造计算托盘和 CDU，PCB使用高规格材料（M8混合 CCL ，36层）。 架构与散热方面，16个计算刀片和6个交换刀片垂直插入2个电缆背板，通过DAC连接，主要芯片液 冷，低功耗组件风冷。 （2）MTIA T-V1.5（2026年中期） （按住，翻译…） 中介层尺寸翻倍，超过5个光罩，计算能力接近NVIDIA下一代GPU Rubin，PCB高达40层。 （3）MTIA T-V2（2027年），计划采用更大的 CoWoS 封装，可能需要液冷到液冷散热，功率系统达 170KW以上。 3， Meta MTIA的百万级的出货量目标 2025年底-2026年 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 综合自 wccftech 。 在 上 月 底 ， AI 芯 片 霸 主 英 伟 达 黄 仁 勋 在 全 球 媒 体 问 答 中 表 示 ， 关 于 英 伟 达 芯 片 与 特 殊 应 用 IC （ASIC）之间的比拼，他坚定地表示，英伟达的增长速度会持续超过ASIC。 对于上述看法，黄仁勋的理由是，这世界上有会出现很多ASIC专案，但其中大约九成会失败，就像 会一直有新创公司冒出头，但大部分都会以败局告终。就算其中有些逃过此命运，但长时间下来，也 可能难以为继。 相较之下，黄仁勋认为，英伟达要延续并不难，这也是他的职责所在。由于英伟达的步伐很快，所以 如果有人想要打造ASIC，可能得比该公司的ASIC还要好才行。 黄仁勋说，市场竞争确实很激烈，但英伟达的技术进展很快，对架构持续进行最佳化，而且也努力让 成本尽速降低，如今已被广泛采用。 ASIC必须得英伟达竞争，且各种ASIC之间也要相互竞争。 毫无疑问，GPU龙头在人工智能领域进展迅速，通过快速引入新架构，打破了规模和性能方面的限 制。NVIDIA 并不担心在当今的人工智能市场中被边缘化，相反，他们 ...

Novel multi-die packaging platform enables multi-die architectures with lower power consumption and reduced total cost  Industry-first modular RDL interposer offers an alternative to traditional silicon interposers and enables supply chain flexibility for data center infrastructure Solution is production-qualified and now entering production ramp in support of customer-specific AI accelerator designsSANTA CLARA, Calif., May 29, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data ...

Group 1 - EDA-related stocks showed strong performance on the 29th, with significant price increases for several companies [1] - Companies like GeLun Electronics saw a 20% increase, closing at 27.77 CNY per share, while Broadcom Micro closed at 56.74 CNY per share [1] - The U.S. government has effectively cut off some American companies' channels to sell semiconductor design software to China, prompting a response from China's Ministry of Commerce [1] Group 2 - The EDA industry is primarily dominated by Synopsys, Cadence, and Siemens EDA, with ongoing active mergers and acquisitions [2] - Synopsys announced the acquisition of EDA leader Ansys, receiving conditional approval from the U.S. Federal Trade Commission, while Siemens is set to complete its acquisition of Altair in March 2025 [2] - Domestic wafer fabs are expanding, driving demand for EDA tools, and local EDA companies are actively pursuing mergers [2] Group 3 - Huada Jiutian has focused on the development of EDA software tools and is involved in several national major projects [3] - The company plans to acquire 100% of Chip and Semiconductor through a combination of stock issuance and cash payment, enhancing its EDA capabilities [3] - The semiconductor design companies and wafer fabs are closely collaborating with EDA firms to accelerate the application of domestic tools [3]