近日，美国商务部负责出口管制的助理部长肯德勒（Thea Kendler）在硅谷一次闭门会上大放厥词，声称 "中国半导体所谓 7nm 乃至 5nm 的突破只是「实 验室里给领导看的样品」，离规模化、商用化还差十万八千里。封锁一天不松，他们就一天造不出能用的先进芯片" 。 再看看 5nm 芯片领域，面对美国 "无 EUV 难造 5nm" 的断言，中国科研人员另辟蹊径，利用深紫外光刻机（DUV）结合自对准四重图案化（SAQP）技 术，成功将 28nm DUV 光刻精度压缩至 5nm 级别，套刻误差精准控制在 2nm 内，实现了对物理分辨率极限的突破。 事实并非如此！ 先看 7nm 芯片，中芯国际通过技术创新，在 N+2 工艺上取得了显著进展。该工艺采用了多重曝光等先进技术，实现了 12 层芯片的堆叠，其性能已能对 标台积电的 7nm 制程。更为关键的是，中芯国际的 N+2 工艺良率已成功突破 70%，这一成绩绝非 "实验室样品" 所能比拟，而是迈向规模化生产的坚实 一步。 与此同时，国产半导体产业链上的其他环节也在协同发力，半导体级硅片和光刻胶的纯度不断提升，大大降低了因材料缺陷引发的芯片失效问题，为 7nm 芯片 ...

Core Viewpoint - The CSEAC 2025, a significant semiconductor exhibition in China, showcases the country's growing influence and capabilities in the semiconductor industry, with a focus on professionalization, industrialization, and internationalization [1][4][5]. Group 1: Event Overview - CSEAC 2025 will take place from September 4 to 6 at the Wuxi Taihu International Expo Center, highlighting China's authoritative position in the semiconductor equipment and core components sector [1]. - The exhibition has seen a 40% year-on-year increase in the number of exhibitors, with over 1,000 exhibitors expected and an exhibition area exceeding 60,000 square meters [5][4]. - Nearly 200 international exhibitors are participating, indicating a growing trend of global engagement in the event [5]. Group 2: Industry Impact - The event serves as a platform for technology exchange, trade negotiations, market expansion, and product promotion, with over 20 specialized forums addressing market hotspots and industry pain points [4][8]. - The theme for this year's event is "Strengthening China's Chip, Embracing the Chip World," reflecting the strategic importance of the semiconductor industry to the national agenda [5]. Group 3: Talent Development - CSEAC 2025 emphasizes talent development through a dedicated talent zone, integrating education and industry needs, with participation from nearly 30 renowned universities and over 100 leading enterprises [8]. - The event aims to bridge the gap between talent cultivation, research innovation, and industry demand, fostering a robust ecosystem for semiconductor talent in China [8]. Group 4: Global Collaboration - The exhibition will feature a "Global Semiconductor Industry Chain Cooperation Forum," gathering industry leaders and technical experts to discuss key technologies in the semiconductor field [7]. - The introduction of the "IC Elite Lecture Hall" aims to facilitate knowledge sharing and collaboration among international experts and industry leaders, focusing on critical areas such as AI computing clusters and advanced packaging detection [7].

Core Viewpoint - The article outlines the evolution of China's semiconductor industry over the past three decades, highlighting its transition from a nascent stage to a significant player in the global market, driven by marketization, internationalization, and the need for self-reliance in the face of geopolitical challenges [1][2]. Group 1: Historical Development Phases - The development of China's semiconductor industry can be divided into three phases: the initial phase from 2000 to around 2010, where key enterprises were established and the industry chain began to take shape; the second phase from 2010 to around 2020, characterized by large-scale global mergers and acquisitions; and the third phase from 2020 to the present, marked by a push for independence due to geopolitical influences [1][2]. - The early 2000s saw a shift from a planned economy to a market-driven approach, with the emergence of domestic semiconductor companies and industry leaders [3][4]. Group 2: Key Players and Contributions - The return of talent from abroad, particularly from the U.S. and Japan, played a crucial role in igniting the semiconductor entrepreneurial wave in China, with figures like Dr. Deng Zhonghan founding companies like Zhongxing Microelectronics [5][6]. - Companies like Spreadtrum (展讯) emerged during the marketization phase, successfully introducing venture capital and innovative management practices, which helped the industry overcome initial challenges [9][11]. - Semiconductor manufacturing, particularly through the establishment of SMIC (中芯国际), filled a critical gap in China's semiconductor capabilities, leading to the development of a complete industry chain [13][15]. Group 3: Challenges and Internal Dynamics - SMIC faced significant legal challenges from TSMC, including lawsuits over intellectual property theft, which impacted its operational stability and leadership dynamics [18][20]. - Internal conflicts within SMIC, particularly between factions with different management backgrounds, hindered its growth and development during critical periods [23][24]. Group 4: Industry Growth and Collaboration - The establishment of various industry alliances and collaborations in the late 2000s and early 2010s fostered a cooperative ecosystem, enhancing the overall development of the semiconductor sector in China [32][33]. - The growth of semiconductor talent and educational initiatives, particularly from institutions like Tsinghua University, laid the groundwork for future advancements in the industry [27].

Core Viewpoint - Unisoc (紫光展锐) has successfully positioned itself as the fourth largest smartphone chip manufacturer globally, achieving significant growth in market share and revenue through strategic partnerships and product development in the mid-range and low-end markets [3][4][12]. Group 1: Company Background and Development - In March 2023, Unisoc completed its transformation into a joint-stock company, changing its name to 紫光展锐（上海）科技股份有限公司 [2]. - The company has received substantial financial backing, including a credit line of 3.2 billion yuan from a consortium of five major banks and multiple rounds of equity financing totaling 60 billion yuan [2]. - Unisoc was formed through the merger of 展讯通信 and 锐迪科, which were pioneers in GSM and RF chip technology, respectively [5][6]. Group 2: Market Performance and Positioning - In Q1 2025, Unisoc held a 10% share of the global smartphone AP-SoC market, ranking fourth behind MediaTek, Qualcomm, and Apple [2]. - The company achieved a remarkable 14% market share in smartphone chip shipments in 2024, with over 1.6 billion chips shipped, indicating a strong presence in the mid-range and low-end markets [3]. - Unisoc's 5G chip sales surged by 82% year-on-year in 2024, contributing significantly to its overall market share growth [6]. Group 3: Product Innovations and Future Strategies - Unisoc has focused on developing cost-effective 5G solutions, launching its first 5G chip, the Tiger T7510, in 2020, which has been well-received in the market [6]. - The company is diversifying its product offerings by entering new markets such as smart automotive, IoT, and satellite communication, with products like the A7870 automotive chip and V517 5G RedCap chip [7][8][9]. - Unisoc is also making strides in the mid-range market with the introduction of the T9100 processor, aiming to enhance its competitive position against leading chip manufacturers [11].