Fundraising Overview - The company, Yongxi Electronics (Ningbo) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue convertible bonds to unspecified investors, with a total issuance of 11,650,000 bonds [1] - The total amount of funds raised is not specified in the provided documents, but the company has established a special account for the management of these funds [1][2] Fund Management and Supervision - To ensure proper management and usage of the raised funds, the company has signed a tripartite supervision agreement with its sponsor, Ping An Securities, and the banks managing the special accounts [2][3] - The special accounts are designated solely for the storage and use of funds related to the company's advanced packaging technology research and industrialization project, and cannot be used for other purposes [2][3][4] Special Account Opening - As of July 2, 2025, the company has opened special accounts at several banks, including: - Bank of Communications for advanced packaging technology project - Agricultural Bank of China for technology research and industrialization - China Merchants Bank for supplementing working capital and repaying bank loans [2][4] Tripartite Agreement Details - The tripartite agreement outlines the responsibilities of each party, including the requirement for the sponsor to supervise the use of funds and conduct semi-annual inspections [3][5] - The agreement stipulates that if the company withdraws more than 50 million yuan or 20% of the net raised funds within a twelve-month period, the bank must notify the sponsor [6][11] - The agreement is effective upon signing and remains in force until all funds are spent and the account is closed [7][12]

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications and high-performance computing [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a remarkable rate of 20.9% over the next five years, becoming a key driver for overall market growth [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is projected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is expected to increase rapidly due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets, along with the continuous application of advanced packaging technology, is expected to sustain healthy growth in the coming years [15]. - The integration of AI applications in various sectors, including automotive and consumer electronics, is driving the demand for advanced packaging solutions [30]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei are highlighted as key players benefiting from the local supply chain advantages in the advanced packaging sector [5]. - Significant investments in packaging projects are underway, with total planned investments amounting to approximately $100 billion [29]. - The ongoing demand for advanced packaging solutions is expected to lead to sustained revenue growth for companies involved in this sector [30].

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].

Group 1 - The fan-out panel-level packaging is regarded as the next generation of advanced packaging, with major players like TSMC, ASE, and Powertech actively competing for opportunities in high-performance computing chip integration [1] - TSMC's technology, named CoPoS (Chip-on-Panel-on-Substrate), is expected to establish a pilot line in Chiayi by 2026, focusing on AI and HPC applications [2][1] - ASE has already established a production line for 300x300mm panel-level packaging in Kaohsiung, utilizing Fan-Out technology [3] - Powertech has been developing its fan-out panel-level packaging technology, named PiFO, since 2019, which is similar to TSMC's CoPoS [4][1] Group 2 - The advantages of panel-level fan-out packaging include larger substrate areas and heterogeneous integration capabilities, enhancing chip performance and functionality, making it suitable for 5G communication and IoT devices [1] - TSMC's CoPoS technology is a square design that allows for increased chip output, with mass production expected by 2028 [2] - TSMC also plans to launch a new CoWoS technology in 2027, which will integrate more logic and memory chips into a single package, aligning with the trends of CoPoS development [2]

Core Viewpoint - The article discusses the advancements and future potential of Fan-Out Panel Level Packaging (FOPLP) technology in the semiconductor industry, highlighting the strategic moves by major players like ASE Technology and Powertech Technology to enhance their operational contributions starting next year [4][6]. Group 1: Industry Trends - The global semiconductor industry is experiencing growth driven by emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, which are pushing advanced packaging technologies to the forefront [4]. - FOPLP technology is gaining traction due to its high efficiency, low cost, and high yield, making it a key solution for next-generation packaging [4]. Group 2: Company Developments - ASE Technology has been developing FOPLP for over ten years and plans to begin trial production by the end of this year, with a gradual increase in operational contributions starting next year [4]. - Powertech Technology has already started small-scale shipments of FOPLP and is validating high-end products for significant clients, indicating a positive outlook for future operational contributions [6]. Group 3: Technical Specifications - ASE Technology has progressed from a 300x300mm specification to a 600x600mm specification for FOPLP, with expectations that if the yield meets projections, it will become the mainstream specification [5]. - Powertech Technology has developed a packaging solution for a high-end system-on-chip (SoC) using a 2nm process, with a total packaging cost reaching $25,000, showcasing the high value of advanced packaging designs [6].

Group 1 - The company held its 14th meeting of the third board of directors on May 26, 2025, where all 7 directors attended, and the meeting was deemed legal and effective [1][2]. - The board approved the achievement of the vesting conditions for the second vesting period of the 2023 restricted stock incentive plan, allowing 1,213,530 shares to vest for 244 eligible participants [1][20][54]. - The board also approved the cancellation of certain unvested restricted stocks due to participants leaving the company and performance issues, totaling 119,430 shares [4][68][71]. Group 2 - The company plans to extend the validity period of the shareholder meeting resolution for issuing convertible bonds to June 12, 2026, to ensure the smooth progress of the issuance [7][8][23]. - The board proposed to hold the second extraordinary general meeting of shareholders on June 11, 2025, combining on-site and online voting [17][18]. Group 3 - The company nominated Li Xuesheng as a candidate for independent director to replace Wang Zheyao, who resigned, pending approval at the upcoming shareholder meeting [12][14][15]. - The board approved the adjustment of the committee members of the board to ensure the orderly operation of the committees following the resignation [15][16].

Core Viewpoint - Foxconn is considering bidding for UTAC, a semiconductor packaging and testing company in Singapore, with a transaction valuation potentially reaching $3 billion [1] Group 1: Company Overview - UTAC, established in 1997, operates in multiple sectors including consumer electronics, computing devices, security, and medical fields, with production bases in Singapore, Thailand, China, and Indonesia [1] - The company serves a diverse client base, including fabless design companies, IDM integrated device manufacturers, and wafer foundries [1] Group 2: Financial Insights - Although UTAC has not disclosed specific financial data, it is reported that the company has an annual EBITDA of approximately $300 million [1] Group 3: Strategic Implications - The potential acquisition of UTAC by Foxconn could enhance its vertical integration capabilities within the semiconductor supply chain, which may significantly impact the global semiconductor supply chain landscape [1] - The ongoing U.S.-China technology competition has heightened interest in non-U.S. strategic investments, making UTAC an attractive target for such acquisitions [1]

Investment Rating - The report does not explicitly state an investment rating for the semiconductor advanced packaging industry Core Insights - Advanced packaging technology is a critical link between chip design and application, significantly enhancing chip performance and reducing power consumption while alleviating constraints in high-end chip manufacturing processes [2] - The Chinese government places high importance on the development of the semiconductor industry, implementing various policies to support independent innovation and technological breakthroughs [2] - The advanced packaging market is expected to grow rapidly, with China's packaging market projected to reach 355.19 billion yuan by 2025, with advanced packaging accounting for 32% of the market [45][47] Summary by Sections Overview of the Semiconductor Packaging Industry - Packaging is a core process in semiconductor manufacturing, involving the placement, fixation, sealing of chips, and connecting chip contacts to the package shell [14][18] - The development of semiconductor packaging technology can be divided into four stages, with the current stage being advanced packaging [19][21] Advanced Packaging Technology Types - The global advanced packaging market includes IDM, Foundry, and OSAT manufacturers, with leading companies adopting a "large platform + technology branch" architecture [4][51] - Major OSAT manufacturers in China have formed industrial capabilities through independent research and acquisitions, covering a wide range of applications from consumer electronics to AI chips [7] Market Dynamics - The global packaging testing market is expected to grow from $51 billion in 2016 to $72.27 billion by 2025, with advanced packaging projected to capture half of the market share [47] - China's packaging testing market is growing at a compound annual growth rate (CAGR) of 12.54%, significantly higher than the global market's 3.89% [47] Importance of Advanced Packaging - Advanced packaging is essential for integrating multiple functions within a system, enhancing overall system performance beyond the limitations of Moore's Law [35][38] - The report highlights that advanced packaging can improve chip performance without shrinking process nodes, addressing the rising costs associated with advanced process development [39][44]

2025港澳山东周活动5月19日—23日举办 山东与港澳合作不断走深走实 山东高度重视打造一流营商环境，2024年将全省高水平开放暨高质量招商引资大会作为"新春第一 会"，出台《关于打造高水平对外开放新高地的实施意见》，为包括港澳企业在内的跨国公司来鲁投资 兴业提供全方位服务。数据显示，2024年，山东新设香港投资企业739家，实际使用港资85.9亿美元， 占全省实际使用外资的72.7%，新设澳门投资企业11家，实际使用澳门投资693万美元。根据最新数 据，山东在营香港投资企业6335家，实际使用港资951.5亿美元，占比为65.2%，在来山东投资国家和地 区中名列第一位。2025年1-3月，山东新设香港投资企业117家，实际使用港资26.2亿美元，占全省实际 使用外资的74.1%。 近日，在日月新半导体（威海）有限公司成品仓库内，一箱箱半导体集成电路正在紧张有序完成封 装贴标，即将从威海发往香港。"随着智能汽车、5G通信等行业高速发展，半导体封装测试市场需求持 续增长。我们公司规模化交付及时率达100%、良品率99.95%、在全球行业排名第一，这是我们的核心 竞争力。"该公司关务部经理郭庆华介绍，2025年 ...

证券代码：688216 证券简称：气派科技 气派科技股份有限公司 议案六：关于公司 2024 年度董事薪酬情况及 2025 年度薪酬方案的议案 ...16 议案七：关于公司 2024 年度监事薪酬情况和 2025 年薪酬方案的议案 .......17 议案九：关于 2025 年公司及控股子公司申请综合授信额度及提供相应担保 议案十三：关于提请股东大会授权董事会以简易程序向特定对象发行股票的 气派科技股份有限公司 气派科技股份有限公司 China Chippacking Technology Co., Ltd. 会议资料 为了维护全体股东的合法权益，确保股东大会会议秩序和议事效率，保证股 东大会的顺利召开，根据《中华人民共和国公司法》（以下简称《公司法》）、 《中华人民共和国证券法》（以下简称《证券法》）、《上市公司股东会规则》 以及《气派科技股份有限公司章程》（以下简称《公司章程》）等相关规定，气 派科技股份有限公司（以下简称"公司"）特制定 2024 年年度股东大会会议须 知： 一、为保证本次股东大会的正常秩序，切实维护股东的合法权益，请出席股 东大会的股东、股东代理人或其他出席者在会议召开前 30 分钟到 ...