Core Viewpoint - The SEMI-e Shenzhen International Semiconductor Exhibition and 2025 Integrated Circuit Industry Innovation Exhibition will take place from September 10-12, 2025, in Shenzhen, serving as a significant indicator of industry transformation in 2025 [1] Group 1: Event Overview - The exhibition is organized by CIOE China Optical Expo and the Integrated Circuit Innovation Alliance, aiming to enhance the scale and influence of the event [1] - The combined exhibition area will reach 300,000 square meters, featuring 5,000 exhibitors and attracting over 160,000 professional visitors [1] - The event will integrate the "Optoelectronics + Semiconductor" industries, creating more cross-industry collaboration opportunities [1] Group 2: Themes and Coverage - The exhibition will focus on three main themes: "IC Design and Application," "IC Manufacturing and Supply Chain," and "Compound Semiconductors," covering the entire industry chain from design to manufacturing [2] - It will showcase the latest technologies from industry leaders, including major companies like Ziguang Zhanrui, ZTE, and SMIC [3][4] Group 3: Industry Trends and Innovations - The exhibition will highlight key industry trends, such as the integration of "Optoelectronics + Semiconductors," and will present core products and technologies across the semiconductor value chain [5] - It will also address advancements in packaging technologies, domestic equipment capabilities, and the commercialization of third-generation semiconductor materials [7] Group 4: Professional Audience and Resources - The event will gather professionals from wafer foundries, packaging and testing, and semiconductor core equipment sectors, facilitating resource sharing across various industries [6] - A series of high-level forums will be held, featuring international analysts and industry experts discussing the most pressing topics of the year [11]

Core Viewpoint - The Ministry of Industry and Information Technology (MIIT) has released key points for automotive standardization work for 2025, focusing on accelerating the development and revision of automotive chip standards [1] Group 1: Standardization of Automotive Chips - The MIIT aims to expedite the formulation of general specifications for automotive chip environments and reliability, information security, and consistency testing [1] - The initiative includes improving basic evaluation methods for automotive chips [1] - The ministry will promote the implementation of standards for safety chips and power drive chips for electric vehicles [1] Group 2: Specific Chip Standards - The MIIT plans to complete the review and approval of standards for intelligent cockpit computing chips, satellite positioning chips, infrared thermal imaging chips, and chassis control chips [1] - There is a focus on accelerating the development of standards for control chips, sensor chips, communication chips, and storage chips to meet the application needs for automotive chip product selection [1]