Group 1 - Company plans to issue A-shares to no more than 35 specific investors, with a maximum of 83.92 million shares and total fundraising not exceeding 4.6 billion yuan, aimed at high-end semiconductor equipment industrialization, advanced technology R&D center construction, and working capital supplementation [1] - Company will increase capital in its subsidiary, with a total financing amount not exceeding 1.04 billion yuan from six participants, including a major investment from Guotou Jixin [1] - After the capital increase, the company's shareholding in its subsidiary will decrease to 53.57%, while Guotou Jixin will become the second-largest shareholder with approximately 12.71% [1] Group 2 - Three-dimensional integration technology is a frontier area in the semiconductor industry, offering significant development potential through vertical stacking of chips to enhance packaging efficiency and reduce power consumption [2] - The subsidiary has launched several products, including wafer-to-wafer hybrid bonding equipment and surface pre-treatment equipment, targeting advanced storage and logic customers [2] - Despite the potential, the subsidiary is still in the early stages of development, with projected revenue of 97.30 million yuan and a net loss of 21.36 million yuan for 2024, and zero revenue in the first quarter of the current year [2]

Company Performance - In 2024, the company achieved a revenue of approximately 4.103 billion, representing a year-on-year growth of 51.7% [1] - The net profit attributable to shareholders was 688 million, with a year-on-year increase of 3.86% [1] - However, in the first quarter of this year, the company reported a net loss of 147 million, attributed to high costs associated with new products and processes [1] Order Backlog and Market Outlook - The company has a robust order backlog, with an order amount of approximately 9.4 billion as of the end of 2024, indicating a healthy operational trend for 2025 [1] - The main products include thin film deposition equipment and advanced bonding equipment for 3D integration [1] Industry Position and Competition - The thin film deposition equipment industry is characterized by monopolistic competition, dominated by international giants such as Applied Materials, Lam Research, and Tokyo Electron, which hold about 70% of the CVD market [2] - The company has established a significant first-mover advantage in the domestic semiconductor equipment industry through its technological accumulation and rapid development [2] Research and Development - In 2023, the company's R&D investment reached 756 million, and in the first quarter of this year, it totaled 157 million, accounting for 22.38% of revenue, one of the highest among domestic semiconductor equipment companies [3] - The company launched over 10 new products/processes in 2024, including various thin film deposition equipment and advanced bonding equipment for 3D integration [3] International Expansion - The company's revenue is primarily sourced from mainland China, but it has established subsidiaries in Japan and Singapore to facilitate overseas market expansion [4] - The company plans to actively seek opportunities in overseas markets to continue its growth trajectory [4]

多种薄膜新工艺设备实现批量出货，关键材料持续突破。 公司拓展了芯片沟槽填充用Flowable CVD设 备，多台通过客户验证；基于新平台、新反应腔的PECVD Stack（ONO叠层）、ACHM等先进工艺设备 实现了大批量出货，通过客户验证；ALD SiCO、SiN、AlN等工艺设备实现大批量出货。目前公司推出 的PECVD、ALD、SACVD、HDPCVD及Flowable CVD薄膜设备可以支撑全部介质薄膜材料的约100多 种工艺应用。 点击招商研究小程序查看PDF报告原文 拓荆科技发布2024年报，24Q4利润快速释放，在手订单同比高增长。公司多种薄膜新工艺设备实现批 量出货，3D IC领域混合键合设备获得重复订单。 24Q4利润快速释放，在手订单同比高增长。 1）2024全年： 公司收入41亿元，同比+51.7%；归母净利 润6.88亿元，同比+3.86%；扣非净利润3.56亿元，同比+14.1%；截至2024年底，公司在手订单约94亿 元，同比+46.3%； 2）24Q4： 公司收入18.26亿元，同比+82%/环比+81%；毛利率39.3%，同 比-12.8pcts/环比持平，同比承压主要系新品或 ...