Group 1 - The core point of the news is that拓荆键科 has completed a new round of financing amounting to approximately 1 billion yuan, led by国投集新, with the participation of several well-known investors [2][3] - The leading investor,国投集新, is solely backed by the国家集成电路产业投资基金三期股份有限公司, marking the first investment by this fund since its establishment in 2024, indicating strong recognition of拓荆键科's technological capabilities and growth prospects by national-level capital [3] -拓荆键科, a subsidiary of拓荆科技, focuses on the research and industrial application of advanced bonding equipment for three-dimensional integration, including mixed bonding and fusion bonding equipment, as well as associated measurement devices [3] Group 2 - The company has launched several products, including wafer-to-wafer mixed bonding equipment, wafer-to-wafer fusion bonding equipment, chip-to-wafer bonding pre-treatment equipment, and various measurement devices, which have been delivered to clients in advanced storage, logic, and image sensor sectors [3] - The legal services for this financing round were provided by中伦律师事务所, with partner都伟 leading the project and team members including lawyers姚腾越 and谢莹 [3]

Group 1 - Company plans to issue A-shares to no more than 35 specific investors, with a maximum of 83.92 million shares and total fundraising not exceeding 4.6 billion yuan, aimed at high-end semiconductor equipment industrialization, advanced technology R&D center construction, and working capital supplementation [1] - Company will increase capital in its subsidiary, with a total financing amount not exceeding 1.04 billion yuan from six participants, including a major investment from Guotou Jixin [1] - After the capital increase, the company's shareholding in its subsidiary will decrease to 53.57%, while Guotou Jixin will become the second-largest shareholder with approximately 12.71% [1] Group 2 - Three-dimensional integration technology is a frontier area in the semiconductor industry, offering significant development potential through vertical stacking of chips to enhance packaging efficiency and reduce power consumption [2] - The subsidiary has launched several products, including wafer-to-wafer hybrid bonding equipment and surface pre-treatment equipment, targeting advanced storage and logic customers [2] - Despite the potential, the subsidiary is still in the early stages of development, with projected revenue of 97.30 million yuan and a net loss of 21.36 million yuan for 2024, and zero revenue in the first quarter of the current year [2]

Company Performance - In 2024, the company achieved a revenue of approximately 4.103 billion, representing a year-on-year growth of 51.7% [1] - The net profit attributable to shareholders was 688 million, with a year-on-year increase of 3.86% [1] - However, in the first quarter of this year, the company reported a net loss of 147 million, attributed to high costs associated with new products and processes [1] Order Backlog and Market Outlook - The company has a robust order backlog, with an order amount of approximately 9.4 billion as of the end of 2024, indicating a healthy operational trend for 2025 [1] - The main products include thin film deposition equipment and advanced bonding equipment for 3D integration [1] Industry Position and Competition - The thin film deposition equipment industry is characterized by monopolistic competition, dominated by international giants such as Applied Materials, Lam Research, and Tokyo Electron, which hold about 70% of the CVD market [2] - The company has established a significant first-mover advantage in the domestic semiconductor equipment industry through its technological accumulation and rapid development [2] Research and Development - In 2023, the company's R&D investment reached 756 million, and in the first quarter of this year, it totaled 157 million, accounting for 22.38% of revenue, one of the highest among domestic semiconductor equipment companies [3] - The company launched over 10 new products/processes in 2024, including various thin film deposition equipment and advanced bonding equipment for 3D integration [3] International Expansion - The company's revenue is primarily sourced from mainland China, but it has established subsidiaries in Japan and Singapore to facilitate overseas market expansion [4] - The company plans to actively seek opportunities in overseas markets to continue its growth trajectory [4]

多种薄膜新工艺设备实现批量出货，关键材料持续突破。 公司拓展了芯片沟槽填充用Flowable CVD设 备，多台通过客户验证；基于新平台、新反应腔的PECVD Stack（ONO叠层）、ACHM等先进工艺设备 实现了大批量出货，通过客户验证；ALD SiCO、SiN、AlN等工艺设备实现大批量出货。目前公司推出 的PECVD、ALD、SACVD、HDPCVD及Flowable CVD薄膜设备可以支撑全部介质薄膜材料的约100多 种工艺应用。 点击招商研究小程序查看PDF报告原文 拓荆科技发布2024年报，24Q4利润快速释放，在手订单同比高增长。公司多种薄膜新工艺设备实现批 量出货，3D IC领域混合键合设备获得重复订单。 24Q4利润快速释放，在手订单同比高增长。 1）2024全年： 公司收入41亿元，同比+51.7%；归母净利 润6.88亿元，同比+3.86%；扣非净利润3.56亿元，同比+14.1%；截至2024年底，公司在手订单约94亿 元，同比+46.3%； 2）24Q4： 公司收入18.26亿元，同比+82%/环比+81%；毛利率39.3%，同 比-12.8pcts/环比持平，同比承压主要系新品或 ...