● 本报记者 黄一灵 2005年成立、2008年研发出全球首创的SAPS（空间交变相移）兆声波清洗技术、2011年首台12英寸单 片清洗设备拿到海外订单、2013年至今持续维持盈利状态、2017年后设备销售呈指数增长趋势。二十年 磨一剑，半导体设备制造商盛美上海如今已成长为一家平台化公司，布局了七大板块产品，正向着成为 全球半导体设备公司第一梯队的目标大步迈进。 今年不仅是盛美上海创立二十周年，也是其登陆科创板的第四年。盛美上海总经理王坚近日在接受中国 证券报记者专访时表示，公司深切体会到科创板这一平台对企业发展的全方位助推作用。上市以来，盛 美上海迎来了前所未有的发展机遇，实现了从技术积累到产能突破的质的飞跃，同时在财务指标上也实 现了快速增长。 "精进内功，是我们矢志不渝的追求。接下来我们将继续坚持'技术差异化、产品平台化、客户全球 化'的发展战略，以差异化创新铸就'芯'高度，积极向全球市场扩张，为全球集成电路行业提供卓越的设 备及工艺解决方案。"王坚进一步称。 从清洗设备崛起 同时，在公司上市后，清洗设备、电镀设备、先进封装湿法设备、立式炉管设备的种类及先进性也在持 续升级和迭代。"研发不能停、市场拓展 ...

Summary of Conference Call Records Company and Industry Overview - **Company**: 盛美上海 (ACMR) - **Industry**: Semiconductor Equipment Key Points and Arguments Industry Insights - Global semiconductor equipment spending is projected to reach **$117.1 billion** in 2024, with China leading at **$49.6 billion**, a **35%** year-on-year increase [2][4] - By 2026, China's **300mm wafer capacity** is expected to account for **26%** of global capacity, with domestic self-sufficiency projected to reach **26.6%** by 2027 [2][5] - The semiconductor cleaning process is critical, accounting for over **30%** of all chip manufacturing steps, with increasing complexity driving demand for advanced cleaning technologies [15] Company Performance - 盛美上海 is a leading domestic player in semiconductor cleaning and plating equipment, with a **7%** global market share, ranking fifth worldwide [3][17] - Revenue for 2024 is projected at **5.6 billion yuan**, a **49%** increase year-on-year, with a compound annual growth rate (CAGR) of **54%** from 2020 to 2024 [12] - The company aims for revenue between **6.5 billion to 7.1 billion yuan** in 2025, reflecting a **16% to 26%** growth [3] Technological Innovations - The company has developed the **SUBS Tibo ultrasonic cleaning technology**, suitable for processes at **28nm** and below, aiming to cover over **95%** of cleaning needs [2][6] - New product lines include high-temperature single wafer SPM and single wafer slot combination cleaning technologies [2][6] - The introduction of **plasma-enhanced chemical vapor deposition (PECVD)** equipment is expected to enhance processing capabilities while reducing footprint [11] Market Strategy - 盛美上海 is expanding its product portfolio to include five major series: cleaning, plating, advanced packaging wet processes, vertical furnace tubes, and coating development [2][7] - The company plans to capture **55% to 60%** of the domestic machine equipment market [4][17] - Continuous investment in R&D has increased from **140 million yuan** in 2020 to **729 million yuan** in 2024, enhancing its competitive edge [14] Financial Projections - Revenue forecasts for cleaning equipment are **4.8 billion**, **5.3 billion**, and **5.7 billion yuan** for 2025-2027, respectively [26] - Other semiconductor equipment revenues are projected at **1.6 billion**, **2.2 billion**, and **2.8 billion yuan** for the same period [26] - Advanced packaging wet process equipment is expected to generate revenues of **320 million**, **380 million**, and **460 million yuan** [26] Important but Overlooked Content - The company has a strong leadership team, with founder Dr. Wang Hui holding an **81%** stake in ACMR, providing stability and direction for technological advancements [8] - The company has successfully reduced reliance on major clients from over **80%** in 2020 to around **50%** in 2024, indicating improved supply chain stability [13] - Risks include potential downturns in downstream demand, increased domestic competition, and the impact of policy changes on operations [27][28] This summary encapsulates the key insights from the conference call, highlighting the company's strategic positioning, financial performance, and market dynamics within the semiconductor equipment industry.

Investment Rating - The report initiates coverage with a "Buy" rating for the company, setting a target price of 136.08 CNY based on a 42x PE ratio for 2025 [2][5]. Core Insights - The company is a leading player in the domestic semiconductor cleaning and plating equipment market, with a strong focus on platformization and differentiation to drive growth [1][9]. - The company is expected to achieve revenue between 6.5 billion to 7.1 billion CNY in 2025, reflecting a year-on-year growth of approximately 16% to 26% [9]. - The semiconductor equipment industry is experiencing significant growth, with China's semiconductor equipment spending projected to reach 49.6 billion USD in 2024, a 35% increase year-on-year [9]. Financial Forecast and Investment Recommendations - The company is projected to have earnings per share of 3.24 CNY, 4.04 CNY, and 4.63 CNY for the years 2025, 2026, and 2027 respectively [2]. - Revenue forecasts for 2023 to 2027 show a consistent upward trend, with total revenue expected to grow from 3.888 billion CNY in 2023 to 9.156 billion CNY in 2027 [4]. - The company’s net profit is anticipated to increase from 911 million CNY in 2023 to 2.045 billion CNY in 2027, indicating a robust growth trajectory [4]. Company Overview - The company has established itself as a leader in the semiconductor equipment sector, with a comprehensive product range that includes cleaning, plating, and advanced packaging equipment [19][24]. - The company has a strong focus on R&D, with a significant increase in R&D expenditure from 141 million CNY in 2020 to 729 million CNY in 2024, supporting its innovation-driven strategy [33][49]. - The company has a well-defined strategic roadmap, transitioning from a single-product focus to a diversified platform strategy that includes six major product lines [23][48]. Market Position and Competitive Advantage - The company aims to capture 55% to 60% of the domestic semiconductor cleaning equipment market, leveraging its technological differentiation and strong R&D capabilities [10]. - The company has developed proprietary technologies such as SAPS and TEBO, which enhance its competitive edge in the cleaning equipment market [46][47]. - The company has established stable relationships with major semiconductor manufacturers, enhancing its market presence and customer base [36][37]. Growth Drivers - The ongoing shift towards high-end semiconductor equipment and the increasing domestic demand for advanced packaging solutions are key growth drivers for the company [9][10]. - The company’s platformization strategy is expected to open new revenue streams and enhance its market competitiveness across various semiconductor equipment segments [11][12]. - The anticipated growth in global semiconductor production capacity and the increasing trend of localization in semiconductor manufacturing will further benefit the company [9][19].

Fundraising Plan - The company plans to issue up to 44,129,118 shares to raise a total of no more than 448,200 million yuan, with the net proceeds allocated to R&D and process testing platform construction, high-end semiconductor equipment iterative R&D projects, and supplementing working capital [1][2] R&D and Process Testing Platform Construction - The project aims to establish an integrated circuit equipment R&D and process testing platform, enhancing the company's R&D testing capabilities and shortening product verification cycles, thereby improving efficiency and competitiveness [4][6][28] - The platform will utilize existing cleanroom environments and necessary testing instruments, including lithography machines and ion implanters, to support the R&D process from design to product finalization [4][5][6] High-End Semiconductor Equipment Iterative R&D Project - This project focuses on acquiring R&D hardware and software to enhance the company's capabilities in high-end semiconductor equipment, ensuring that key technologies possess differentiated global intellectual property rights [11][12][28] - The project is expected to accelerate the iterative development of cleaning equipment, high-end electroplating equipment, and advanced packaging wet process equipment, positioning the company among the top global semiconductor equipment suppliers [12][14][28] Working Capital Supplement - The company intends to use 130,418.07 million yuan of the raised funds to supplement working capital, addressing the increasing financial demands due to business expansion and ensuring sustainable development [23][26] Market Environment and Competitive Position - The semiconductor equipment market is experiencing significant growth, with China's market size reaching 366 billion USD in 2023, making it the largest globally [17][28] - The company has established a strong customer base and maintains stable relationships with leading semiconductor manufacturers, which supports its project initiatives [18][28] Technological and Talent Foundation - The company has a robust R&D foundation, with 931 R&D personnel, representing 46.50% of total employees, and a high level of educational qualifications among its staff [10][9][28] - The company has accumulated significant technological expertise, holding 470 patents, including 468 invention patents, which underpins its competitive edge in the semiconductor equipment sector [19][20][28]

Group 1 - The core viewpoint of the news is that Tongxiao Investment has conducted research on Shengmei Shanghai, highlighting the company's advancements in three-dimensional stacking electroplating equipment, high-temperature sulfuric acid cleaning equipment, and ALD furnace tube equipment [1] - Shengmei Shanghai's three-dimensional stacking electroplating equipment has achieved commercial validation in most clients in mainland China, while the high-temperature sulfuric acid cleaning equipment offers advantages such as reduced sulfuric acid consumption and elimination of acid mist splashing [1] - The ALD furnace tube equipment can handle temperatures up to 1250°C and has attracted interest from clients in China and Europe, with the company projecting revenue of 6.5 to 7.1 billion by 2025 [1] Group 2 - The company expects strong delivery in the second and third quarters, following a robust first quarter [1] - The overseas market is primarily focused on mainland China, with the panel-level horizontal electroplating equipment winning international awards, and product sales are set to expand globally [1] - The first PECVD equipment verification is progressing well, with more clients expected to validate it by 2025, and the company is open to acquisition opportunities while prioritizing organic growth and technological advantages [1]

Core Viewpoint - Shengmei Shanghai (688082.SH) demonstrates strong growth momentum driven by its core strategies of "technological differentiation, product platformization, and global customer base," as evidenced by its impressive Q1 2025 financial results [1][14]. Financial Performance - In Q1 2025, Shengmei Shanghai reported revenue of 1.306 billion yuan, a year-on-year increase of 41.73%, and a net profit attributable to shareholders of 246 million yuan, a staggering year-on-year growth of 207.21% [1]. - The company's net profit after deducting non-recurring items reached 248 million yuan, reflecting a year-on-year increase of 194.14% [1]. - The revenue and net profit figures represent historical highs for the company in the same quarter [1]. Market Outlook - UBS forecasts Shengmei Shanghai's revenue to reach 7.05 billion yuan in 2025, with a compound annual growth rate of over 20% expected from 2025 to 2027 [2]. - The company has built strong competitive barriers, and the Q1 2025 results are seen as the beginning of accelerated performance release, with expectations of entering a new high-growth phase [2]. Order Backlog and Cash Flow - Shengmei Shanghai's contract liabilities totaled 1.228 billion yuan, a year-on-year increase of 31.13%, indicating a robust order backlog [4]. - The net cash flow from operating activities improved significantly to 93 million yuan, compared to a cash outflow of 155 million yuan in the same period last year [4]. Industry Context - The global semiconductor equipment market is expected to recover, with a projected market size of 113 billion USD in 2024, growing by 6.4% year-on-year [6]. - China is the largest semiconductor equipment market, with a compound annual growth rate exceeding 20% from 2020 to 2024, significantly outpacing global growth [9]. Product Diversification and Platform Development - Shengmei Shanghai has successfully developed a diverse product portfolio, including cleaning equipment, electroplating equipment, and various semiconductor process equipment, positioning itself as a leading platform enterprise in the industry [10]. - The company has achieved significant market shares in cleaning and electroplating equipment, with international market shares of 8% and 8.2%, respectively [10]. - The company is expanding its product offerings and has begun mass production of several new technologies, including advanced packaging electroplating equipment and atomic layer deposition (ALD) systems [11][12]. Future Growth Potential - Shengmei Shanghai's platform development is expected to accelerate, with new products projected to become significant revenue contributors in the next two to three years [12]. - The company is poised for continued high growth as it capitalizes on the recovery of the semiconductor industry and its strong order backlog [14].

Investment Rating - The semiconductor equipment industry is rated as "Recommended" [2] Core Insights - The acquisition of a 9.49% stake in ChipSource by North Huachuang for 1.687 billion yuan signifies a major step in industry consolidation [1] - The transaction price of 88.48 yuan per share is attractive, with the estimated valuation significantly lower than other domestic competitors [2] - North Huachuang's acquisition is expected to enhance its platform strategy and improve overall competitiveness in the semiconductor equipment sector [2][3] - The entry of industry leaders into ChipSource is likely to accelerate the domestic replacement of Track equipment, which has been slower than market expectations [3] - The acquisition marks the beginning of a wave of mergers and acquisitions in the semiconductor equipment sector, reflecting the government's emphasis on breakthroughs in core technologies [4] Summary by Sections Event Overview - On March 10, North Huachuang and ChipSource announced the transfer of shares, with North Huachuang aiming to gain control over ChipSource through further acquisitions [1] Business Synergy - North Huachuang's main products include etching, thin film deposition, and other core equipment, while ChipSource specializes in Track and bonding equipment, enhancing the overall product offering [2] Industry Dynamics - The acquisition is seen as a response to the government's focus on domestic production capabilities in the semiconductor sector, with expectations of further consolidation among leading companies [4] Investment Recommendations - Beneficiaries in the front-end equipment segment include ChipSource, North Huachuang, and others, while back-end testing equipment and component manufacturers are also highlighted as potential investment opportunities [5]