Core Viewpoint - The article emphasizes the growing importance of chiplet integration technology and the shift towards advanced packaging techniques in the semiconductor industry, particularly in China, which holds a significant market share in bonding equipment demand [2][3]. Group 1: Industry Trends - Chiplet integration technology is becoming a strategic focus in semiconductor innovation, with the complexity of processes and equipment evolving alongside traditional scaling methods [2]. - The market for hybrid bonding is projected to grow at a compound annual growth rate (CAGR) of 13.4% over the next five years, with China accounting for 40% of the global demand for bonding equipment [2]. - The hybrid bonding market is expected to reach USD 397 million by 2030, highlighting its critical role in advanced three-dimensional heterogeneous integration technologies [2]. Group 2: Market Dynamics - The hybrid bonding equipment market is currently dominated by companies such as Besi, Applied Materials, and EVG, due to the limited demand and high technical difficulty associated with specific chip hybrid bonding [3]. - Domestic innovative enterprises are accelerating their efforts in this niche market to capture market share and establish brand influence [3]. Group 3: Upcoming Events - TrendBank plans to host the 2025 Heterogeneous Integration Annual Conference from November 17-19, 2025, in Ningbo, focusing on advanced packaging technologies and fostering collaboration between industry and academia [7].

Group 1: Industry Developments - Advanced packaging technology is becoming crucial for extending Moore's Law, as traditional scaling methods face limitations due to rising costs in processes below 7nm [1][4] - The demand for advanced packaging is driven by high-performance computing, AI, data centers, autonomous driving, smartphones, and 5G communications [4][5] - Major global players like TSMC, Intel, and Samsung are prioritizing advanced packaging as a strategic focus [3][4] Group 2: Company Activities - Zhizheng Co., Ltd. plans to acquire Advanced Assembly Materials International Limited, a leading semiconductor lead frame supplier, through a significant asset swap and fundraising [1] - Huada Technology announced the establishment of a wholly-owned subsidiary for advanced packaging, indicating a trend among domestic chip companies to invest in this area [1][3] - Qizhong Technology aims to raise up to 850 million yuan for advanced packaging projects, while Baiwei Storage completed a private placement to fund its advanced packaging manufacturing expansion [3] Group 3: Equipment Demand - The shift towards advanced packaging is creating new demands for semiconductor equipment, with companies like ASMPT reporting a 50% year-on-year increase in orders for advanced packaging equipment [5] - The performance of advanced packaging equipment is critical, especially in complex scenarios like multi-layer stacking and hybrid bonding [5][6] - Domestic companies are striving to catch up, with projections of significant revenue growth for firms like Tuojing Technology, which anticipates a 52% to 58% increase in revenue by Q2 2025 [6]

Core Viewpoint - The article discusses the recent rumors regarding South Korean equipment manufacturers, specifically Hanmi Semiconductor, halting the supply of critical TCB equipment for China's HBM production, highlighting the geopolitical tensions affecting the semiconductor industry [1][4]. Group 1: HBM Technology and Equipment - HBM chips have gained significant popularity due to their high memory bandwidth and capacity, essential for AI model training and inference [2]. - The TCB equipment plays a crucial role in the production of HBM chips by aligning and welding DRAM chips to substrates with micron-level precision [2][3]. - Hanmi Semiconductor has become a leader in the TCB equipment market, supported by SK Hynix's investment and collaboration since 2017 [3]. Group 2: Geopolitical Context - The U.S. has been exerting pressure on South Korea to restrict the supply of semiconductor equipment to China, particularly targeting HBM technology [4][5]. - Chinese companies like Huawei and Biren Technology face procurement restrictions for HBM from South Korean suppliers, impacting their AI chip development [4]. Group 3: Impact and Alternatives - Despite the potential supply disruptions, Chinese companies have been stockpiling HBM equipment, with reports indicating that Hefei Changxin's inventory could last until 2027 [5]. - Other global suppliers, including Japanese and Singaporean companies, can provide similar TCB equipment, offering alternatives to Chinese manufacturers [5]. - Domestic Chinese companies, such as Plascent, are developing their own TCB equipment, indicating a shift towards self-sufficiency in semiconductor manufacturing [5]. Group 4: Future Prospects - The article suggests that advancements in HBM4 technology may favor Chinese manufacturers, as they have already begun exploring mixed bonding techniques necessary for achieving high yields [5]. - Longjiang Storage is highlighted as a key player in this development, having previously adopted complex architectures to avoid patent conflicts, positioning itself ahead of competitors [5].