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全球与中国表面贴装设备(SMT)市场现状及未来发展趋势
QYResearch· 2025-09-12 05:35
SMT 是英文( Surface Mounter Technology )的缩写,翻译为中文就是表面贴装技术,日常生活常见的各类数码家电等电子产品内部的 电路板都是通过这个技术完成实现,通过 SMT 设备中的贴片机将电子元器件贴装到电路光板上,再经过回流炉焊接,最终成为一块主 板, SMT 在当今电子行业发挥着巨大作用。 2024 年, SMT 全球销量约为 7.1 万台,全球市场平均价格约为每台 72.3 千美元。随着全球各行业电子产品需求的加速增长, SMT 设备 市场有望实现强劲持续的增长。对小型化、自动化和高性能设备的追求,确保了 SMT 仍然是 PCB 组装的支柱。由于中国大陆、日本、 韩国和台湾地区的大规模电子产品制造,亚太地区占据主导地位,该地区仍将是最大的 SMT 设备中心。然而,北美和欧洲将加大对电 动汽车、航空航天和医疗设备先进 SMT 生产线的投资。 5G 、物联网、人工智能和电动汽车技术的兴起,持续扩大了对精密、可靠和自 动化组装的需求。制造商也面临着遵守 RoHS 和环保制造标准的压力,因此需要升级到可持续的 SMT 工艺。 市场规模 根据 QYResearch 调研数据显示: 20 ...
松下全球副总裁本间哲朗:以AI与能源驱动,从“本土创新”迈向“全球赋能”
Guo Ji Jin Rong Bao· 2025-09-04 08:14
Group 1: Financial Performance - Panasonic's sales and operating profit in the Northeast Asia region for FY2024 are projected to grow to 103% and 110% of the previous year, respectively [1] - In Q1 FY2025 (April-June), sales reached 103% year-on-year, while operating profit increased by 126% [1] Group 2: AI and Business Growth - The investment boom in global generative AI servers has significantly boosted Panasonic's business in Northeast Asia, with capacitor sales doubling and electronic materials sales increasing by 133% [4] - Panasonic is accelerating capacity expansion to meet market demand, including new factories in Guangzhou and Shanghai for electronic materials [4] Group 3: Global Strategy - Panasonic is replicating its successful strategies from the Chinese market globally, transitioning from "Made in China for China" to "Made in China for the World" [6] - The company has over 6,000 suppliers in China and is leveraging local procurement to supply components globally [6] Group 4: Energy Sector Developments - Panasonic is advancing its operations in both the North American and Chinese markets, with a new factory in Kansas for electric vehicle batteries and a significant investment in Dalian for battery production [7] Group 5: Trade Shows and Strategic Partnerships - Panasonic has actively participated in the China International Import Expo (CIIE), using the platform to showcase products and establish strategic partnerships [8] - The company plans to highlight AI products at the upcoming CIIE, sharing experiences with other Japanese companies operating in China [9] Group 6: Market Positioning - Panasonic emphasizes the importance of unique value over price competition in the Chinese market, focusing on technology, design, and practicality [9] - The company has localized decision-making and development functions to better cater to Chinese consumer expectations [9]
松下加码投资中国AI相关产业,9月将在上海建新工厂
Di Yi Cai Jing Zi Xun· 2025-09-01 12:11
Group 1 - Panasonic is increasing investments in China's AI-related industries, with a new electronic materials factory set to open in Shanghai in September [2] - In the Northeast Asia region, Panasonic's sales revenue for the fiscal year 2024 is expected to grow by 3% year-on-year, with operating profit increasing by 10% [2] - The first quarter of fiscal year 2025 (April to June 2023) also saw revenue and profit growth, with sales up by 3% and operating profit up by 26% [2] Group 2 - Panasonic's investment in the electronic materials factory in Guangzhou, which began construction in June 2020, amounts to 790 million yuan and is set to produce multilayer substrates for AI servers [3] - A new factory in Suzhou, with an investment of 600 million yuan, is scheduled to start construction in October 2024 and will produce new materials for integrated circuits [3] - An additional factory in Shanghai, with an investment of 120 million yuan, is planned to begin construction in September 2025, focusing on electronic materials for AI servers [3] Group 3 - Panasonic's sales of capacitors and electronic materials for AI servers to Western markets increased by 133% year-on-year [3] - The company has signed contracts for cooling liquid circulation pumps for servers, with plans for production at its Hangzhou motor factory [3] Group 4 - Panasonic is enhancing internal AI applications by integrating large models like Chat GPT and DeepSeek into its systems [4] - The company is promoting AI technology through internal competitions and has developed its own small model for generative AI servers [4] - Panasonic plans to share its AI application practices with other Japanese companies operating in China [4]
2025年中国半导体封装设备行业相关政策、产业链、发展现状、竞争格局及未来趋势研判:半导体产业蓬勃发展,一季度半导体封装设备销售额约75亿元[图]
Chan Ye Xin Xi Wang· 2025-07-22 01:21
Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]
2025年中国先进封装设备行业:科技自立,打造国产高端封装新时代
Tou Bao Yan Jiu Yuan· 2025-05-28 12:23
Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging utilizes high-density interconnects, heterogeneous integration, and 3D stacking technologies to meet the demands of high-performance computing, 5G, and AI [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with advanced packaging driving an increase in the share of packaging equipment sales [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing backend packaging equipment and new front-end equipment [9][27]. - The traditional backend packaging equipment must undergo technological upgrades to accommodate smaller sizes, higher integration, and more complex structures, focusing on precision, material compatibility, process control, and automation [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various semiconductor equipment types, including thinning machines, dicing machines, and bonding machines, to support advanced packaging processes [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies like Huahai Qingke and Jing Sheng Machinery are emerging players [40][44]. Traditional Backend Equipment Upgrades and Manufacturers - Traditional backend packaging equipment requires upgrades to meet the demands of advanced packaging, focusing on precision enhancement, material compatibility, process control, and automation [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group [32].
2025年中国先进封装设备行业科技自立,打造国产高端封装新时代
Tou Bao Yan Jiu Yuan· 2025-05-28 12:22
Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. - The future of the IC packaging equipment market is expected to grow significantly as advanced packaging becomes a core and cost-effective path to surpass Moore's Law, leading to an increase in the sales proportion of packaging equipment [5][26]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging meets the demands of high-performance computing, 5G, and AI through high-density interconnects and heterogeneous integration [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with packaging equipment sales expected to increase significantly due to the rising complexity and demand for AI chips [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing back-end packaging equipment and new front-end equipment [9][27]. - The traditional back-end packaging equipment must undergo technological upgrades to meet the requirements of smaller sizes, higher integration, and more complex structures [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various traditional back-end devices, including thinning machines, dicing machines, bonding machines, and molding machines, which must adapt to advanced packaging requirements [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies are also emerging in this space [40][44]. Traditional Back-End Equipment Upgrades and Manufacturers - Traditional back-end packaging equipment requires upgrades in precision, material compatibility, process control, and automation to meet the demands of advanced packaging technologies [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group, among others [32].