Investment Rating - The report maintains an "Overweight" rating for the semiconductor equipment industry, indicating a positive outlook for the sector [1]. Core Insights - The development of domestic computing power chips is gaining attention, with significant benefits expected for domestic equipment manufacturers. Huawei announced a three-year roadmap for its Ascend AI chips, aiming to release four new products between 2026 and 2028, which is expected to enhance the market share of domestic computing power chips [4]. - Domestic advanced process expansion is exceeding expectations, which is favorable for local equipment manufacturers. The report highlights the establishment of Changxin Storage and the anticipated new iteration cycle in memory technology [4]. - The high-end SoC testing machine market presents significant opportunities, with domestic companies like Huafeng Measurement and Changchuan Technology actively working on SoC testing machines to meet the high demands of testing [4]. - The demand for advanced packaging in computing power chips is expected to benefit equipment manufacturers, as domestic supply chains are anticipated to shift towards local advanced packaging suppliers [4]. - Investment recommendations include companies involved in front-end processes such as North Huachuang and Zhongke Feimeng, as well as back-end packaging firms like Huafeng Measurement and Changchuan Technology [4].

点击 最 下方 "在看"和" "并分享，"关注"材料汇 添加 小编微信 ，遇见 志同道合 的你 正文 7 东吴证券 ■ 半导体封装概览：后摩尔时代渐进，先进封 发快速发展 传统 统 先 进 封 装 设 备 有 一 定 重 合 （ 减 薄 / 测 片 / 固 晶 / 健 合 ） ， 增 量 主 要 在 于 前 道 图 形 化 设 备 2 3 他山之石可以攻玉，海外龙头经验借鉴 4 本土重点公司 5 | 投资建议 6 风险提示 % 公众号·材料汇 目录 1.1. 半导体封装的关键作用是实现芯片和外部系统的电连接 唱图 -芯片 机械连接 板上芯片(COB) 单芯片封装 多芯片封装(MCP) 1级封装 1级封装 机械保护 散热 模块、电路卡 2级封装 电气连接 主板 3级封装 省公众号·材料汇4 数据来源:半导体行业观察, ◆图: 半导体封装工艺等级 ◆ 图:半导体封装的主要作用 7 乐吴址芬 ● 封装的核心是实现芯片和系统的电连接。芯片封装是指将芯片密封在塑料、金属或陶瓷等材料制成的封装体 内，使芯片与外部环境之间建立一道屏障，保护芯片免受外部环境影响，同时封装还提供了一个接口，使芯 片能够与其他电子元件进行连接， ...

Group 1 - The stock price of Guangli Technology is reported at 17.61 yuan, down 1.35 yuan or 7.12% from the previous trading day, with a trading volume of 328,100 hands and a transaction amount of 598 million yuan [1] - The main business of the company includes semiconductor packaging and testing equipment manufacturing and IoT safety production monitoring, with products such as wafer cutting machines and gas extraction systems [1] - In the first half of 2025, the company achieved operating revenue of 288 million yuan, with the semiconductor business contributing 134 million yuan and the safety production monitoring business generating 154 million yuan [1] Group 2 - The company reported a net profit attributable to shareholders of 25.18 million yuan in the first half of 2025, successfully turning a profit [1] - The semiconductor business saw batch sales of 12-inch fully automatic dual-axis wafer cutting machines, with progress in the localization of core components [1] - The gross margin of the safety production monitoring business reached 71.43%, with continuous growth in product sales [1] Group 3 - On August 27, the net outflow of main funds was 114 million yuan, accounting for 2.74% of the circulating market value [1] - Over the past five trading days, the cumulative net outflow was 39.69 million yuan, representing 0.95% of the circulating market value [1]

Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging utilizes high-density interconnects, heterogeneous integration, and 3D stacking technologies to meet the demands of high-performance computing, 5G, and AI [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with advanced packaging driving an increase in the share of packaging equipment sales [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing backend packaging equipment and new front-end equipment [9][27]. - The traditional backend packaging equipment must undergo technological upgrades to accommodate smaller sizes, higher integration, and more complex structures, focusing on precision, material compatibility, process control, and automation [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various semiconductor equipment types, including thinning machines, dicing machines, and bonding machines, to support advanced packaging processes [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies like Huahai Qingke and Jing Sheng Machinery are emerging players [40][44]. Traditional Backend Equipment Upgrades and Manufacturers - Traditional backend packaging equipment requires upgrades to meet the demands of advanced packaging, focusing on precision enhancement, material compatibility, process control, and automation [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group [32].

Investment Rating - The report does not explicitly provide an investment rating for the advanced packaging equipment industry. Core Insights - The advanced packaging technology aims to enhance chip performance, increase functional integration, reduce product size, and improve thermal management capabilities, driven by the demand for high-performance electronic products. The key to achieving these advanced packaging technologies lies in advanced packaging equipment [2]. - The future of the IC packaging equipment market is expected to grow significantly as advanced packaging becomes a core and cost-effective path to surpass Moore's Law, leading to an increase in the sales proportion of packaging equipment [5][26]. Summary by Sections Semiconductor Packaging Equipment Industry Overview - Traditional packaging focuses on low cost and simple structures, while advanced packaging meets the demands of high-performance computing, 5G, and AI through high-density interconnects and heterogeneous integration [16]. - The global semiconductor manufacturing equipment sales are projected to grow from $106.3 billion in 2023 to $117.1 billion in 2024, with packaging equipment sales expected to increase significantly due to the rising complexity and demand for AI chips [21][22]. Required Semiconductor Equipment for Packaging Processes - Advanced packaging introduces new applications such as wafer thinning, RDL (Redistribution Layer) production, bump production, and TSV (Through-Silicon Via) production, necessitating both existing back-end packaging equipment and new front-end equipment [9][27]. - The traditional back-end packaging equipment must undergo technological upgrades to meet the requirements of smaller sizes, higher integration, and more complex structures [32]. Advanced Packaging Equipment Analysis - The report highlights the need for various traditional back-end devices, including thinning machines, dicing machines, bonding machines, and molding machines, which must adapt to advanced packaging requirements [35][45]. - The global thinning machine market is dominated by Japanese companies, with a concentration ratio of approximately 85%, while domestic companies are also emerging in this space [40][44]. Traditional Back-End Equipment Upgrades and Manufacturers - Traditional back-end packaging equipment requires upgrades in precision, material compatibility, process control, and automation to meet the demands of advanced packaging technologies [32]. - Key domestic suppliers for thinning machines include Huahai Qingke, Jing Sheng Machinery, and China Electronics Technology Group, among others [32].

Investment Rating - The investment rating for the company is adjusted to "Accumulate-A" [7] Core Views - The company's performance in 2024 was impacted by changes in product structure, leading to revenue growth pressure. The company is accelerating the expansion into new application areas such as photovoltaics and epitaxial equipment [2][4] - In 2024, the company achieved a revenue of 425 million yuan, a year-on-year increase of 4.78%, while the net profit attributable to the parent company was 54 million yuan, a decrease of 24.32% [1][9] - The company is focusing on R&D, with a 16.39% increase in R&D expenses to 44.25 million yuan, accounting for 10.41% of revenue [2][9] Financial Performance - In Q4 2024, the company reported a revenue of 100 million yuan, a decline of 39.90% year-on-year, and a net profit of -1 million yuan, a decrease of 102.29% [1][2] - The overall gross margin for 2024 was 26.07%, down 7.39 percentage points, with the first quarter gross margin at 4.53%, down 29.17 percentage points [2][9] - The company expects revenues of 539 million yuan, 646 million yuan, and 755 million yuan for 2025, 2026, and 2027 respectively, with net profits projected at 65 million yuan, 79 million yuan, and 95 million yuan for the same years [7][9] Product Development and Market Position - The company is a major domestic manufacturer of silicon carbide single crystal furnaces, with a focus on expanding its product range and upgrading technology [7] - The company has successfully supplied 8-inch silicon carbide single crystal furnaces to the market, indicating a shift from 6-inch to 8-inch substrates [3][4] - The company is leveraging AI technology in its photovoltaic automation systems to enhance control precision and improve crystal growth rates [4]

Core Insights - The company reported a total revenue of 425 million yuan in 2024, reflecting a year-on-year growth of 4.78%, but the growth rate significantly slowed compared to 82.70% in 2023 [4] - Net profit attributable to shareholders decreased by 24.32% to 53.74 million yuan, while the net profit excluding non-recurring items fell by 28.70% to 30.23 million yuan, indicating challenges in cost control and profitability [4][5] - The gross profit declined from 132 million yuan in 2023 to 111 million yuan, a decrease of 16.67%, highlighting issues in cost management [4] Revenue and Profitability - Despite a slight increase in revenue, the company struggled with a significant drop in net profits and net profits excluding non-recurring items, suggesting ineffective cost management and operational efficiency [4][5] - The fourth quarter showed particularly poor performance, with revenue declining by 39.9% year-on-year and a net loss of 630,000 yuan, a decrease of 102.3% [4] Research and Development - The company increased its R&D expenditure to 44.25 million yuan in 2024, a growth of 16.39%, accounting for 10.41% of total revenue [5] - The company and its subsidiaries obtained a total of 95 domestic patents during the reporting period, including 38 invention patents and 57 utility model patents, enhancing its competitiveness in the semiconductor crystal growth equipment sector [5] Talent and Governance - The company made significant progress in talent acquisition and development, with a total of 210 employees by the end of 2024, of which 85 were R&D personnel, representing 40.48% of the workforce, an increase of 19.72% year-on-year [6] - The company is enhancing its internal governance by improving operational compliance and internal control management systems, which is expected to strengthen management efficiency and support long-term stable development [6]