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丹麦第一家12英寸晶圆厂落成
半导体行业观察· 2025-11-21 00:58
公众号记得加星标⭐️,第一时间看推送不会错过。 来 源 : 内容来自半导体行业观察综合 。 近日,丹麦首个300毫米晶圆制造工厂的落成,标志着丹麦在迈向欧洲技术自主化道路上迈出了决定 性的一步。这座名为POEM技术中心的新设施,由诺和诺德基金会量子芯片项目(NQCP)与法国 Riber公司合作建立,位于哥本哈根大学尼尔斯·玻尔研究所内。该中心定位为光子和量子芯片制造枢 纽,引入了分子束外延等先进技术,旨在加速技术突破,并加强丹麦乃至欧洲在微芯片和量子技术领 域的生态系统建设。 "有了这个设施,我们就可以将材料生产转移到公司内部,这使我们能够更高效地进行研发,因为我 们不再需要依赖世界各地的其他公司为我们生产,"NQCP首席执行官兼尼尔斯·玻尔研究所教授彼得· 克罗格斯特鲁普表示。"此外,它还有助于我们将开发的技术直接转化为大规模生产——这有利于我 们自身、丹麦以及整个领域。" 他补充道:"我们看到欧洲对300毫米晶圆的需求巨大。我们将能够迅速地向拥有尖端300毫米设备的 大型代工厂以及小型晶圆厂提供我们的材料,因为我们可以从我们的晶圆上切割出适合他们较小尺寸 晶圆的部件。" POEM技术中心计划在一年内全面投 ...
台积电退出六英寸代工
半导体行业观察· 2025-08-13 01:38
Core Viewpoint - TSMC plans to gradually exit 6-inch wafer manufacturing by 2027, reallocating resources to advanced packaging, which reflects a strategic shift towards higher-margin businesses [2][3]. Group 1: TSMC's Strategic Shift - TSMC has verbally informed downstream clients about the closure of its last 6-inch plant by the end of 2027, transitioning production lines to advanced packaging [2]. - The decision to exit the 6-inch wafer business is based on market demand and TSMC's long-term business strategy, ensuring a smooth transition for clients [2][3]. - TSMC's stock price remained stable, unaffected by external news regarding the closure [2]. Group 2: Market Impact - The closure of TSMC's 6-inch plant is expected to trigger a shift in orders for power management ICs (PMICs) and other mature process ICs, potentially benefiting companies like World Advanced [2]. - The trend of major manufacturers moving away from 6-inch wafers is evident, as TSMC's decision follows its previous exit from the GaN market [3]. Group 3: Industry Trends - Siltronic AG plans to cease production of small-diameter wafers by July 2025, reflecting a broader industry trend towards larger, more efficient wafers [5][6]. - SUMCO has announced a restructuring plan to end production of 200mm and smaller wafers by 2026, indicating a shift in focus to larger wafer production [6][10]. - The semiconductor industry is witnessing a decline in demand for smaller diameter wafers, with a significant shift towards 300mm wafers for improved production efficiency [9][10].