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欣锐科技:公司积极拓展海外市场,推进业务全球化发展
Zheng Quan Ri Bao Wang· 2025-10-23 11:40
证券日报网讯欣锐科技(300745)10月23日在互动平台回答投资者提问时表示,公司不仅是国内市场的 先行者,也较早地开始接触和服务海外客户。公司积极拓展海外市场,推进业务全球化发展,公司在 2018年就结合自身能力与技术产品实力提出了"品牌向上"战略,进入海外主机厂供应链体系,与本田、 现代、沃尔沃等国际整车厂商建立合作,近年已获得德国制造商的OBC和DC/DC项目委托开发。公司 已建立起稳定、高效的供应链体系,具备为全球客户交付产品的能力。公司相信海外市场的竞争核心是 技术、品质和品牌,公司致力于通过领先的技术方案和稳定的产品可靠性,为客户创造更高的价值,成 为其值得信赖的战略合作伙伴。 ...
欣锐科技:公司近年已获得德国制造商的OBC和DC/DC项目委托开发
Mei Ri Jing Ji Xin Wen· 2025-10-23 01:32
每经AI快讯,有投资者在投资者互动平台提问:请问公司在国家化市场动作频频,就海外市场而言, 公司相较同行貌似优势明显,且老板有也是日企工作过,请问就海外市场这一块公司有什么信心和独到 见解? 欣锐科技(300745.SZ)10月23日在投资者互动平台表示,公司不仅是国内市场的先行者,也较早地开 始接触和服务海外客户。公司积极拓展海外市场,推进业务全球化发展,公司在2018年就结合自身能力 与技术产品实力提出了"品牌向上"战略,进入海外主机厂供应链体系,与本田、现代、沃尔沃等国际整 车厂商建立合作,近年已获得德国制造商的OBC和DC/DC项目委托开发。公司已建立起稳定、高效的 供应链体系,具备为全球客户交付产品的能力。我们相信海外市场的竞争核心是技术、品质和品牌,我 们致力于通过领先的技术方案和稳定的产品可靠性,为客户创造更高的价值,成为其值得信赖的战略合 作伙伴。 (文章来源:每日经济新闻) ...
科陆电子(002121.SZ):未涉及储能电芯生产
Ge Long Hui· 2025-10-20 07:16
Core Viewpoint - The company, Kelu Electronics (002121.SZ), has clarified that it is not involved in the production of energy storage cells, but has successfully developed and produced core control units for energy storage systems, including PCS, BMS, EMS, DC/DC converters, and O&MS in-house [1] Group 1 - The company does not engage in the production of energy storage cells [1] - The company has achieved self-research and production of key components for energy storage systems [1] - The core control units developed include PCS, BMS, EMS, DC/DC converters, and O&MS [1]
国金证券:海外大厂引领高压直流革命 800V产业化进程有望加速
Mei Ri Jing Ji Xin Wen· 2025-08-05 00:39
Group 1 - The core viewpoint is that the surge in AI computing power demand is driving a revolutionary change in data center power supply efficiency, highlighting the emergence of the third-generation HVDC architecture [1] - Companies are advised to focus on the AC/DC power supply segment that benefits from the increase in unit value, as well as power manufacturers that are expected to enter the HVDC and DC/DC markets leveraging their technological platforms and customer resources [1]
国金证券:海外大厂引领高压直流革命,800V产业化进程有望加速
Xin Lang Cai Jing· 2025-08-05 00:22
Group 1 - The core viewpoint is that the surge in AI computing power demand is driving a revolutionary change in data center power supply efficiency, with the third-generation HVDC architecture emerging as a key player [1] - Companies are advised to focus on the AC/DC power supply segment that benefits from unit value enhancement [1] - There is potential for power supply manufacturers to enter the HVDC and DC/DC markets leveraging their technological platforms and customer resource advantages in the future [1]
气派科技业绩会:行业温和复苏 在手订单稳中有升
Zheng Quan Shi Bao Wang· 2025-05-21 09:50
Group 1 - The semiconductor industry is experiencing a mild recovery in demand in 2024 after significant adjustments in 2022 and 2023, leading to an increase in company orders and improved operating performance year-on-year [1] - Company achieved a revenue of 667 million yuan in 2024, representing a year-on-year growth of 20.25%, while the net profit attributable to shareholders was a loss of 102 million yuan, showing a reduction in losses [1] - In Q1 2025, the company reported a revenue of 132 million yuan, a year-on-year increase of 6.5%, with a net profit attributable to shareholders of a loss of 32.17 million yuan [1] Group 2 - The company has completed testing and mass production of various product series in wafer testing, including third-generation semiconductors and power management [2] - The company is expanding its product coverage in high-density matrix lead frame packaging technology, with significant progress in mass production of SOP and TSSOP products [2] - The first quarter losses were attributed to reduced other income, increased financial expenses, and higher depreciation and amortization compared to the previous year [2] Group 3 - The semiconductor industry is foundational for electronic information and IoT sectors, with long-term growth prospects despite short-term challenges [3] - Future profit drivers for the company include increased capacity utilization, development of third-generation semiconductor packaging, rapid ramp-up of power device production lines, and enhanced market expansion efforts [3]