Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

Group 1 - The hybrid bonding industry is entering a high-speed implementation phase, with equipment demand expected to grow several times before 2030, marking this technology as a key driver for the next generation of computing power [1][3] - Hybrid bonding technology is a critical enabling technology for breaking through computing power bottlenecks in the post-Moore era, driven by explosive growth in AI, high-performance computing (HPC), and high-bandwidth memory (HBM) [1][3] - The current market is dominated by overseas leaders, but there are clear opportunities for domestic alternatives [1] Group 2 - Hybrid bonding offers extreme interconnect density and performance breakthroughs, process compatibility, cost optimization potential, and flexibility in three-dimensional integration and heterogeneous design [2] - However, challenges such as defect control, alignment precision, thermal management, wafer warping, material compatibility, and process throughput must be addressed for successful mass production [2] Group 3 - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with significant applications in storage and logic integration [3] - Major manufacturers like TSMC are expanding production in advance, with HBM4/5 and high-end AI chips expected to be the first to scale, indicating a robust growth trajectory for related equipment [3] Group 4 - The hybrid bonding equipment market is characterized by a clear pattern of "overseas dominance and domestic breakthroughs," with Dutch company BESI holding about 70% of the global market share [4] - Chinese equipment manufacturers are accelerating their catch-up efforts, with companies like Tuojing Technology launching mass production-level hybrid bonding equipment and receiving repeat orders [4] - Domestic equipment is rapidly entering the key tracks of 3D integration and advanced packaging, with market share expected to continue increasing due to rising precision and stability [4] Group 5 - BESI is the absolute leader in the global hybrid bonding equipment market, establishing a core position in high-performance computing with a complete range of equipment from traditional packaging to cutting-edge 2.5D/3D integration [5] - Its flagship product, Datacon 8800 CHAMEO ultra plus AC, achieves 100nm alignment precision and a throughput of 2000 CPH, indicating a shift from laboratory to mass production [5] - BESI's advanced packaging business demonstrates strong technical premium capabilities with a gross margin exceeding 65%, reflecting a successful transition to an AI-driven growth model [5]

Investment Rating - The report suggests a positive investment outlook for the hybrid bonding technology, highlighting its critical role in the AI era and advanced packaging market [7]. Core Insights - Hybrid bonding is identified as a key enabling technology for overcoming performance bottlenecks in the post-Moore era, driven by explosive demand in AI and high-performance computing (HPC) [7]. - The market for hybrid bonding equipment is expected to experience significant growth, with demand projected to increase several times by 2030, particularly in high-performance computing and memory applications [5][44]. - The report emphasizes the competitive landscape, noting that while overseas companies like BESI dominate the market, domestic players in China are making significant strides [5][57]. Summary by Sections Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [14][28]. - The technology enables interconnect distances below 10μm, significantly enhancing data transmission bandwidth compared to traditional methods [29]. Market Demand and Growth - The demand for hybrid bonding technology is transitioning from an advanced option to a core infrastructure in the AI era, with major manufacturers like TSMC and Samsung adopting it for next-generation products [5][33]. - The global hybrid bonding equipment market is projected to exceed $600 million by 2030, with the Chinese market expected to surpass $400 million [48]. Key Players and Competitive Landscape - BESI holds a dominant position in the hybrid bonding equipment market, with a market share of approximately 67% in 2023, and is expected to maintain around 70% in 2024 [57]. - Domestic companies such as Tuojing Technology and Baiao Chemical are rapidly advancing, with Tuojing Technology launching its first mass-production hybrid bonding equipment [5][57]. Applications and Future Trends - Hybrid bonding is primarily applied in 3D NAND and is expanding into high-performance computing scenarios, including HBM4 and HBM5 technologies [25][44]. - The report indicates that the technology is becoming essential for various applications, including AI chips and advanced memory solutions, with significant investments being made in new packaging facilities globally [43][44].