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微软甩出3nm自研AI芯片!算力超10PFLOPS,干翻AWS谷歌
美股研究社· 2026-01-27 10:44
以下文章来源于芯东西 ,作者ZeR0 芯东西 . 芯东西专注报道芯片、半导体产业创新,尤其是以芯片设计创新引领的计算新革命和国产替代浪潮;我们是一群追"芯"人,带你一起遨游"芯"辰大海。 来源 | 芯东西 芯东西1月27日报道,今日,微软宣布推出自研AI推理芯片 Maia 200 ,并称该芯片是"目前所有超大规模数据中心中性能最高的自研芯 片",旨在显著提升AI token生成的经济效益。 Maia 200采用 台积电3nm 工艺制造,拥有超过 1400亿颗 晶体管,配备原生 FP8/FP4 张量核心,重新设计的内存子系统包含 216GB HBM3e (读写速度高达 7TB/s )和 272MB片上SRAM ,以及能确保海量模型快速高效运行的数据传输引擎。 Maia 200专为使用低精度计算的最新模型而设计,每块芯片在FP4精度下可提供超过 10PFLOPS 的性能,在FP8精度下可提供超过 5PFLOPS 的性能,所有这些都控制在 750W 的SoC TDP范围内。 其FP4性能是亚马逊自研AI芯片AWS Trainium3的 3倍多 ,FP8性能 超过 了谷歌TPU v7。 | Peak specific ...
全球存储技术-DRAM 现货市场暴跌、AWS 的 AI 芯片、存储指标-Global Memory Tech-Weekly theme DRAM spot hard-landing,AWS’s AI chip, memory indicator
2025-12-08 02:30
Accessible version Global Memory Tech Refer to "Other Important Disclosures" for information on certain BofA Securities entities that take responsibility for the information herein in particular jurisdictions. Weekly theme: DRAM spot hard-landing, AWS's AI chip, memory indicator Industry Overview DDR5 price slightly muted, but no hard-landing signal Prices for 16Gb DDR5, a DRAM mainstream (vs legacy DDR4/3), have slightly declined this week (down 1%) – the first drop since Aug after a 300%+ rally over Sept- ...
Counterpoint:需求强劲 台积电(TSM.US)3nm制程成为其史上最快达成全面利用的技术节点
智通财经网· 2025-05-15 12:39
Group 1 - TSMC has solidified its leading position in the global foundry market after inventory adjustments at the end of 2022, with high utilization rates in advanced process technologies [1] - The 3nm process has achieved full capacity utilization in its fifth quarter of mass production, driven by strong demand for Apple A17 Pro/A18 Pro chips and other application processors, setting a new record for initial market demand [1] - Future growth is expected to continue due to the introduction of NVIDIA Rubin GPUs and specialized AI chips from Google and AWS, driven by increasing demand in AI and high-performance computing (HPC) applications [1] Group 2 - In contrast, the smartphone market has seen slower initial capacity growth for existing processes like 7/6nm and 5/4nm, with the latter experiencing a resurgence in 2023 due to surging demand for AI acceleration chips [2] - The demand for AI computing chips is accelerating the construction of AI data centers and significantly enhancing the overall capacity of the 5/4nm process [2] Group 3 - The 2nm process is projected to achieve full capacity utilization in its fourth quarter of mass production, driven by dual demand from smartphones and AI applications, aligning with TSMC's strategic outlook [5] - Potential customers for the 2nm technology include Qualcomm, MediaTek, Intel, and AMD, which is expected to maintain high utilization rates for the 2nm process [5] Group 4 - TSMC is investing $165 billion in its Arizona facility to meet growing U.S. consumer demand and mitigate geopolitical risks, with the facility covering 4nm, 3nm, and 2nm processes [11] - The dual-layout strategy enhances TSMC's geopolitical resilience and ensures capacity meets customer demand, particularly in AI and HPC, while maintaining high utilization rates for advanced processes beyond 2030 [11]
TSMC 先进制程产能利用率持续保持强劲
Counterpoint Research· 2025-05-15 09:50
Core Viewpoint - TSMC has solidified its leading position in the global foundry market following inventory adjustments at the end of 2022, with high utilization rates in advanced process nodes showcasing its technological superiority [1][4]. Group 1: Advanced Process Utilization - The 3nm process node has achieved full utilization within five quarters of mass production, driven by strong demand for Apple A17 Pro/A18 Pro chips and other application processors, setting a new record for initial market demand in advanced processes [1]. - TSMC's 5/4nm process is experiencing a resurgence in demand, particularly due to the surge in AI accelerator chips like NVIDIA's H100 and B100, which has significantly boosted overall capacity [2][4]. - TSMC's advanced process utilization rates are projected to remain high, with expectations that the 2nm process will reach full capacity within four quarters of mass production, driven by dual demand from smartphones and AI applications [7]. Group 2: Future Developments and Investments - TSMC plans to allocate 30% of its 2nm process capacity to its Arizona facility, enhancing geopolitical resilience while ensuring capacity meets customer demand, especially in AI and high-performance computing [9]. - The company anticipates that the diverse customer base for the 2nm technology, including major players like Qualcomm, MediaTek, Intel, and AMD, will help maintain high utilization rates [7]. - TSMC's investment of $165 billion in its Arizona plant will support advanced process technologies, including 4nm, 3nm, and 2nm, ensuring the company remains at the forefront of the semiconductor industry [9].