士兰微 20250825 摘要 士兰微坚持 IDM 模式，通过先进产线和创新产品驱动增长。公司在功率 器件市场竞争激烈，但 IPM 和汽车 IGBT 领域表现突出，2025 年 IPM 营收预计增长近 30%。 士兰微在 MEMS 传感器领域扭转颓势，成为国内少数进入所有品牌手机 厂家的供应商。公司正积极拓展汽车和工业应用，下半年新机型放量将 进一步改善业务。 士兰微在模拟电路和碳化硅业务上取得突破，12 寸平台车规级模拟电路 已推向客户。公司是国内少数自主品牌销售碳化硅产品的企业之一，并 计划完成 8 寸线通线。 士兰微已涉足服务器市场，并重点开发算力市场，推出 Doctor Moss、 氮化镓和碳化硅器件，已应用于算力服务器。算力服务器市场仍处于初 期阶段，需要时间发展。 半导体行业周期性复苏由 AI 驱动，美国已超过中国成为最大半导体消费 市场。士兰微服务众多领域，算力是重点之一，但成熟产线产能投放导 致价格压力增大。 Q&A 士兰微 2025 年上半年财务表现如何？ 2025 年上半年，士兰微的营业收入为 63.35 亿元，同比增长约 20%。净利润 扣除非经常性损益后为 2.7 亿元，同比大幅增长 ...

Investment Rating - The report assigns a "Buy" rating to the company, indicating a potential upside in the stock price [6][8]. Core Insights - The company is positioned as one of the few private IDM (Integrated Device Manufacturer) semiconductor firms in China, with strong competitiveness in its IPM (Intelligent Power Module) products, particularly benefiting from demand growth in the home appliance and industrial sectors due to national subsidies and economic recovery [6][8]. - The company is expected to achieve significant net profit growth from 2025 to 2027, with projected net profits of 640 million RMB, 880 million RMB, and 1.16 billion RMB, representing year-on-year growth rates of 192%, 38%, and 31% respectively [6][8]. - The stock is currently trading at a price-to-earnings (P/E) ratio of 65, 47, and 36 for the years 2025, 2026, and 2027, respectively, which supports the "Buy" rating [6][8]. Financial Summary - The company anticipates a net profit of 24 million to 28 million RMB in the first half of 2025, marking a turnaround from losses in the previous year, with a year-on-year growth of 90% to 122% [8]. - Revenue is projected to grow from 9.34 billion RMB in 2023 to 14.03 billion RMB in 2025, with a steady increase in operating profit expected [11]. - The company’s gross margin is expected to remain stable due to cost reduction measures and increased production capacity, particularly in its 12-inch wafer production lines [8][11].

Core Viewpoint - The power semiconductor market is expanding significantly due to the global trend of automotive electrification and the "dual carbon" strategy, with leading domestic company SIDA Semiconductor (603290.SH) planning to issue convertible bonds totaling up to 1.5 billion yuan [1][6]. Summary by Sections Fundraising Purpose - The funds raised from the convertible bonds will be primarily allocated to four areas, focusing on three industrialization projects related to core components for new energy vehicles (NEVs) [2]. - The largest portion, 600 million yuan, will be invested in the manufacturing project for automotive-grade SiC MOSFET modules, which are critical for the main drive system control modules in NEVs due to their high voltage, high frequency, and high efficiency characteristics [2]. - The IPM (Intelligent Power Module) manufacturing project targets high-frequency medium-voltage applications such as NEV air conditioning and electric compressors, with a projected demand of 440 million units in 2024, reflecting a year-on-year growth of 20.8% [2]. - The automotive-grade GaN module industrialization project aims to establish a complete process platform for GaN chip packaging, testing, and system integration, focusing on next-generation semiconductor technologies [2]. Company Performance - Since its IPO in 2020, the company's revenue has surged from 963 million yuan to 3.663 billion yuan by 2023, while net profit increased from 181 million yuan to 911 million yuan [5]. - However, in 2024, the company experienced its first simultaneous decline in revenue and net profit since 2016, with revenue dropping to 3.391 billion yuan (a 7.43% decrease) and net profit falling to 508 million yuan (a 44.24% decrease) [5]. Competitive Landscape - The global power semiconductor market is dominated by international giants like Infineon and ON Semiconductor, indicating that domestic companies still face challenges in technology accumulation and production capacity [8]. - The domestic SiC industry is rapidly developing, with companies like Shanxi Tiancheng achieving mass production of 8-inch SiC single crystal substrates, and Jie Square Semiconductor's first 8-inch SiC wafer factory expected to be operational by 2027 [8]. - The ability of SIDA Semiconductor to maintain its competitive edge amidst fierce competition will depend on its future technology transformation and mass production capabilities [8].