如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体芯闻综合。 美光科技，作为美国最大的电脑内存芯片制造商，因人工智能设备需求带动，给出了乐观的季度业 绩预期，其指出，下一代HBM内存将与台积电合作生产基础逻辑芯片。 公司周二发布声明称，本财年第一季度营收预计约为125亿美元，高于分析师平均预期的119亿美 元。扣除部分项目后，每股利润预计约为3.75美元，而市场此前预估为3.05美元。 这一前景证明了美光已成为AI投资的主要受益者。其高带宽存储器（HBM）是开发人工智能模型 所需芯片与系统的关键组成部分，这也使得该技术成为总部位于爱达荷州博伊西的美光极具盈利性 的产品。 值得关注的是，美光在财报会议上表示其HBM4 12-Hi DRAM 解决方案进展顺利，为了满足近期 不断增长的性能需求，该公司已生产并交付了迄今为止速度最快的 HBM4 解决方案的首批样品， 该解决方案提供超过 11 Gbps 的引脚速度和 2.8 TB/s 的带宽。他们表示，新的 HBM4 产品在性 能和效率方面应该超越所有竞争对手。 除了 HBM4，美光还谈到了下一代 HBM4E 内存。与完全基于自主研发的先进 CMOS 基础 ...

Core Viewpoint - The article discusses the critical role of different types of DRAM in meeting the growing computational demands of artificial intelligence (AI), emphasizing the importance of memory bandwidth and access methods in system performance [1][4][10]. DRAM Types and Characteristics - Synchronous DRAM (SDRAM) is categorized into four types: DDR, LPDDR, GDDR, and HBM, each with distinct purposes and advantages [1][4]. - DDR memory is optimized for complex operations and is the most versatile architecture, featuring low latency and moderate bandwidth [1]. - Low Power DDR (LPDDR) includes features to reduce power consumption while maintaining performance, such as lower voltage and temperature compensation [2][3]. - GDDR is designed for graphics processing with higher bandwidth than DDR but higher latency [4][6]. - High Bandwidth Memory (HBM) provides extremely high bandwidth necessary for data-intensive computations, making it ideal for data centers [4][7]. Market Dynamics and Trends - HBM is primarily used in data centers due to its high cost and energy consumption, limiting its application in cost-sensitive edge devices [7][8]. - The trend is shifting towards hybrid memory solutions, combining HBM with LPDDR or GDDR to balance performance and cost [8][9]. - LPDDR is gaining traction in various systems, especially in battery-powered devices, due to its excellent bandwidth-to-power ratio [14][15]. - GDDR is less common in AI systems, often overlooked despite its high throughput, as it does not meet specific system requirements [16]. Future Developments - LPDDR6 is expected to launch soon, promising improvements in clock speed and error correction capabilities [18]. - HBM4 is anticipated to double the bandwidth and channel count compared to HBM3, with a release expected in 2026 [19]. - The development of custom HBM solutions is emerging, allowing bulk buyers to collaborate with manufacturers for optimized performance [8]. System Design Considerations - Ensuring high-quality access signals is crucial for system performance, as different suppliers may offer varying speeds for the same DRAM type [22]. - System designers must carefully select the appropriate memory type to meet specific performance needs while considering cost and power constraints [22].