证券代码：605358 证券简称：立昂微 公告编号：2026-005 债券代码：111010 债券简称：立昂转债 杭州立昂微电子股份有限公司 关于部分募集资金投资项目延期的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 杭州立昂微电子股份有限公司（以下简称"公司"、"本公司"） 于2026年1月9日召开了第五届董事会第 十五次会议，会议审议通过《关于部分募集资金投资项目延期的议案》，结合公司募集资金投资项目的 实际情况及未来业务发展的规划，并经过谨慎的研讨论证，将"年产180万片12英寸半导体硅外延片项 目"达到预定可使用状态日期延期至2027年12月。具体情况如下： 登录新浪财经APP 搜索【信披】查看更多考评等级 一、募集资金基本情况 公司经中国证券监督管理委员会《关于核准杭州立昂微电子股份有限公司公开发行可转换公司债券的批 复》(证监许可[2022]2345号)核准，公开发行可转换公司债券3,390.00万张，每张面值100元，共计募集 资金人民币339,000.00万元，本次公开发行可转换公司债券发行承销保荐费及 ...

1月9日，立昂微连发两则公告，披露旗下"年产600万片6英寸集成电路用硅抛光片项目"结项及节余募集 资金使用安排，同时宣布"年产180万片12英寸半导体硅外延片项目"再次延期至2027年12月。 6英寸募投项目结项，节余1840.24万元划转至12英寸项目 根据公告，立昂微"年产600万片6英寸集成电路用硅抛光片项目"于2026年1月9日正式结项。该项目原承 诺募集资金投入125,000万元，实际使用金额为124,739.68万元，节余募集资金（含利息收入）1,840.24 万元。 与此同时，立昂微公告称，经2026年1月9日第五届董事会第十五次会议审议通过，将"年产180万片12英 寸半导体硅外延片项目"达到预定可使用状态的日期由2026年5月调整至2027年12月。这是该项目第二次 延期，此前曾于2024年4月首次延期至2026年5月。 据了解，该项目源于公司2022年公开发行可转换公司债券的募集资金投向，原拟投入募集资金113,000 万元。截至2025年12月31日，该项目累计投入62,263.61万元，投入进度为55.10%。 对于本次延期，公司表示主要受两方面因素影响：一方面，半导体硅片行业此前处 ...

（文章来源：证券日报） 证券日报网讯 1月9日，立昂微发布公告称，公司"年产600万片6英寸集成电路用硅抛光片项目"结项， 节余募集资金1840.24万元（含利息）全部转入在建的"年产180万片12英寸半导体硅外延片项目"，无需 董事会审议。 ...

证券日报网讯 1月9日，立昂微发布公告称，公司于2026年1月9日召开了第五届董事会第十五次会议， 审议通过《关于部分募集资金投资项目延期的议案》，结合公司募集资金投资项目的实际情况及未来业 务发展的规划，并经过谨慎的研讨论证，将"年产180万片12英寸半导体硅外延片项目"达到预定可使用 状态日期延期至2027年12月。 （文章来源：证券日报） ...

南财智讯1月9日电，立昂微公告，公司拟将"年产180万片12英寸半导体硅外延片项目"达到预定可使用 状态日期延期至2027年12月。该项目计划投入募集资金11.30亿元，资金来源为公开发行可转换公司债 券募集资金，用途为建设12英寸半导体硅外延片产能。延期原因为半导体硅片行业持续处于下行周期， 已投产产能利用率不足，盈利压力较大，公司因此放缓厂房建设与设备采购节奏。目前新建外延车间厂 房已结顶，预计2026年8月完成洁净车间建设，后续设备安装调试周期较长。此次延期系公司根据市场 环境变化作出的审慎决策，不改变项目实施主体、投资用途及规模，不会对公司主营业务和整体募资安 排造成实质性影响，亦不存在损害股东利益的情形。公司将动态调节建设进度，提高募集资金使用效 率。 ...

Core Viewpoint - The company is currently constructing a project for an annual production capacity of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers, which is expected to enhance its competitiveness by forming a complete industrial chain from single crystal to epitaxy [1] Group 1 - The 2022 convertible bond project is focused on the annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers [1] - The project is aligned with another project disclosed on November 18, 2025, which aims for an annual production of 1.8 million pieces of heavily doped substrate wafers [1] - Both projects will create upstream and downstream synergies, improving the company's production capacity for heavily doped silicon wafers and optimizing its product structure [1]

Core Viewpoint - The company is currently constructing a project for the annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers, which is part of its convertible bond project for 2022. This project is expected to complement another project disclosed on November 18, 2025, for the annual production of 1.8 million pieces of heavily doped substrate wafers, forming a complete industrial chain from single crystal to epitaxy, thereby enhancing the company's production capacity and overall competitiveness [1] Group 1 - The company is building a project for the annual production of 1.8 million pieces of 12-inch silicon epitaxial wafers [1] - The two projects will create a complete industrial chain from single crystal to epitaxy [1] - The projects aim to improve the company's production capacity of heavily doped silicon wafers and optimize product structure [1]

Core Viewpoint - Lianmicro announced an investment of approximately 2.262 billion yuan to expand production capacity for 12-inch heavily doped substrate wafers, which is expected to meet the growing demand for high-end power devices in various applications [1][3]. Group 1: Investment and Project Details - The project will be implemented in the existing factory of Jinruihong Microelectronics and aims to produce 1.8 million pieces of 12-inch heavily doped substrate wafers annually [1][3]. - The total investment for the project is around 2.262 billion yuan, with an estimated construction period of 60 months and an annual investment of about 350 million yuan [1][3]. Group 2: Market Demand and Product Applications - The new production capacity will support the existing 1.8 million pieces per year of 12-inch semiconductor silicon epitaxial wafers, catering to high-end power device needs [3]. - The produced wafers will be used in applications such as AI server uninterruptible power supplies, energy storage inverters, charging piles, industrial electronics, servo drivers, consumer electronics, automotive electronics, home appliances, embedded systems, and industrial control [3]. Group 3: Company Performance and Market Position - Lianmicro reported a revenue of approximately 2.64 billion yuan for the first three quarters of 2025, representing a year-on-year increase of 15.94%, while net losses reached 108 million yuan, an increase of 53.61 million yuan compared to the previous year [3]. - The semiconductor silicon wafer segment generated a main business income of 1.976 billion yuan, up 19.66% year-on-year [3]. - The company has a monthly production capacity of 150,000 pieces of 12-inch silicon wafers at its Chuzhou base, with a current strong market demand for low-resistance products [6]. Group 4: Industry Context - The production of large-size silicon wafers is technically challenging, with high barriers in technology and production equipment, while domestic capacity is primarily focused on smaller sizes [6]. - The demand for 12-inch silicon wafers is expected to continue rising due to developments in 5G, smartphones, and data centers, indicating significant potential for domestic import substitution [6].

Core Viewpoint - Lianmicro plans to invest approximately 2.262 billion yuan to construct a project with an annual production capacity of 1.8 million pieces of 12-inch heavily doped substrate wafers, with a construction period of about 60 months [2][4]. Group 1: Investment and Project Details - The investment by Lianmicro's subsidiary, Jinruihong Microelectronics, will be implemented within the existing factory and aims to expand production capacity [4]. - The project will complement the existing annual production of 1.8 million pieces of 12-inch semiconductor silicon epitaxial wafers, targeting high-end power device demands [4]. - The new production capacity will focus on heavily doped arsenic and phosphorus silicon epitaxial wafers, which are essential for various applications including AI server uninterruptible power supplies, energy storage inverters, and automotive electronics [4]. Group 2: Financial Performance - For the first three quarters of 2025, Lianmicro reported revenue of approximately 2.64 billion yuan, a year-on-year increase of 15.94%, but incurred a net loss of 108 million yuan, which is an increase in loss of 53.61 million yuan compared to the previous year [5]. - The semiconductor silicon wafer segment generated a main business revenue of 1.976 billion yuan, reflecting a year-on-year growth of 19.66% [5]. Group 3: Market Demand and Sales - The sales volume of 6-inch equivalent wafers reached 14.5339 million pieces, marking a year-on-year increase of 32.54%, with 12-inch silicon wafer sales at 1.2779 million pieces (equivalent to 5.1117 million pieces of 6-inch), a growth of 69.70% year-on-year [8]. - The current market demand for low-resistance products is strong, particularly for applications in AI server uninterruptible power supplies, with the company’s production capacity for 12-inch silicon wafers at the Chuzhou base being 150,000 pieces per month [8]. - The domestic market for 12-inch silicon wafers is expected to grow due to the increasing demand from sectors such as 5G, smartphones, and data centers, indicating significant potential for domestic production to replace imports [8]. Group 4: Company Overview - Lianmicro was established in 2002 and was listed on the Shanghai Stock Exchange in 2020, with its main business covering semiconductor silicon wafers, semiconductor power device chips, and compound semiconductor RF and optoelectronic chips [4].

Group 1 - The company, Hangzhou Lion Microelectronics Co., Ltd, has issued convertible bonds totaling 339 million RMB, with 3.39 million bonds at a face value of 100 RMB each [3][4][15] - The bonds have a maturity period of up to 6 years, with an interest rate that increases from 0.3% in the first year to 2.0% in the sixth year [4][6] - The initial conversion price for the bonds is set at 45.38 RMB per share, subject to adjustments based on various corporate actions [6][8] Group 2 - The company reported a significant decline in net profit for 2024, with a loss of 26.58 million RMB, a decrease of 504.18% compared to the previous year [18] - The total revenue for 2024 was 309.23 million RMB, reflecting a 14.97% increase from 2023 [18] - The company's total assets increased by 5.73% year-on-year, reaching 1.93 billion RMB by the end of 2024 [18] Group 3 - The company is engaged in the semiconductor industry, focusing on the research, production, and sales of semiconductor silicon wafers and power device chips [18] - The main applications of the company's products include 5G communication, automotive electronics, and artificial intelligence [18] - The company has faced challenges in project timelines due to external economic conditions, leading to delays in the construction of certain projects [21][22]