证券代码：688082 证券简称：盛美上海 公告编号：2025-029 次修订稿）的议案》 盛美半导体设备（上海）股份有限公司 第二届董事会第二十次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、董事会会议召开情况 2025 年 5 月 20 日，盛美半导体设备（上海）股份有限公司（以下简称"公 司"）第二届董事会第二十次会议在中国（上海）自由贸易试验区丹桂路 999 弄 B2 栋会议室举行，本次会议应出席董事 6 名，实际出席会议的董事 6 名。全体 董事认可本次会议的通知时间、议案内容等事项。本次会议的召集和召开程序符 合《中华人民共和国公司法》《中华人民共和国证券法》等法律法规及《盛美半 导体设备（上海）股份有限公司章程》和《盛美半导体设备（上海）股份有限公 司董事会议事规则》的相关规定，合法有效。 会议由董事长 HUI WANG 先生主持。 二、董事会会议审议情况 （一）审议通过了《关于公司符合向特定对象发行 A 股股票条件的议案》 表决情况：6 票赞成，占全体董事人数的 100%；0 票弃权；0 ...

股票简称：盛美上海 股票代码：688082 盛 美 半 导 体 设 备 （ 上 海 ） 股 份 有 限 公 司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 202 4 年 度 向 特 定 对 象 发 行 A 股 股 票 预 案 （二次修订稿） 二〇二五年五月 盛美半导体设备（上海）股份有限公司 2024 年度向特定对象发行 A 股股票预案 公司声明 1、公司及董事会全体成员保证本预案内容真实、准确、完整，并确认不存 在虚假记载、误导性陈述或重大遗漏。 2、本预案按照《上市公司证券发行注册管理办法》等法规及规范性文件的 要求编制。 3、本次向特定对象发行股票完成后，公司经营与收益的变化由公司自行负 责；因本次向特定对象发行股票引致的投资风险，由投资者自行负责。 4、本预案是公司董事会对本次向特定对象发行股票的说明，任何与之相反 的声明均属不实陈述。 5、投资者如有任何疑问，应咨询自己的股票经纪人、律师、专业会计师或 其他专业顾问。 6、本预案所述事项并不代表审批机关对于本次向特定对象发行股票相关事 项的实质性判断、确认、批准 ...

2024 年 度 向 特 定 对 象 发 行 A 股 股 票 募 集 资 金 使 用 可 行 性 分 析 报 告 （ 修 订 稿 ） 二〇二五年五月 盛美半导体设备（上海）股份有限公司（以下简称"盛美上海"或"公司"）是 上海证券交易所科创板上市的公司。为满足公司业务发展的资金需求，增加公司 资本实力，提升盈利能力，根据《中华人民共和国公司法》（以下简称《公司法》 " "）、 《中华人民共和国证券法》（以下简称"《证券法》"）和《上市公司证券发行注 册管理办法》（以下简称"《注册管理办法》"）等有关法律法规和规范性文件的 规定，拟向特定对象发行股票不超过 44,129,118 股（含本数），募集资金总额不 超过 448,200.00 万元（含本数），扣除发行费用后的募集资金净额用于"研发和工 艺测试平台建设项目"、"高端半导体设备迭代研发项目"以及补充流动资金。公 司编制了 2024 年度向特定对象发行 A 股股票募集资金使用可行性分析报告。本 报告中如无特别说明，相关用语具有与《盛美半导体设备（上海）股份有限公司 2024 年度向特定对象发行 A 股股票预案》中的释义相同的含义。 股票简称：盛美上海 股票代 ...

股票简称：盛美上海 股票代码：688082 盛 美 半 导 体 设 备 （ 上 海 ） 股 份 有 限 公 司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 202 4 年 度 向 特 定 对 象 发 行 A 股 股 票 发 行 方 案 论 证 分 析 报 告 （二次修订稿） 二〇二五年五月 2024 年度向特定对象发行 A 股股票发行方案论证分析报告 盛美半导体设备（上海）股份有限公司（以下简称"盛美上海"或"公司"） 是上海证券交易所科创板上市的公司。为满足公司业务发展的资金需求，增强公 司的资本实力和盈利能力，根据《中华人民共和国公司法》（以下简称"《公司法》"） 《中华人民共和国证券法》（以下简称"《证券法》"）和《上市公司证券发行注册 管理办法》（以下简称"《注册管理办法》"）等有关法律、行政法规、部门规章或 规范性文件和《公司章程》的规定，公司编制了 2024 年度向特定对象发行 A 股 股票发行方案论证分析报告。 本论证分析报告中如无特别说明，相关用语具有与《盛美半导体设备（上海） 股份有限公司 2024 年度 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-031 盛美半导体设备（上海）股份有限公司 关于 2024 年度向特定对象发行 A 股股票 预案（二次修订稿）披露的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2025年5月 20日召开了第二届董事会第二十次会议及第二届监事会第十九次会议，审议通过 了《关于公司2024年度向特定对象发行A股股票预案（二次修订稿）的议案》等 相关议案，对本次向特定对象发行A股股票预案进行了修订。具体内容详见公司 同日在上海证券交易所网站（www.sse.com.cn）上披露的《盛美半导体设备（上 海）股份有限公司2024年度向特定对象发行A股股票预案（二次修订稿）》等相 关文件，敬请广大投资者注意查阅。 本次公司向特定对象发行A股股票预案（二次修订稿）的披露事项不代表审 核、注册部门对于本次向特定对象发行A股股票相关事项的实质性判断、确认、 批准或注册，预案所述本次向特定对象发行A股股票相关事项的生效和完成 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-033 盛美半导体设备（上海）股份有限公司 关于向特定对象发行 A 股股票摊薄即期回报 与公司采取填补措施及相关主体承诺 （二次修订稿）的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）第二届董事会 第八次会议、2024 年第一次临时股东大会、第二届董事会第十四次会议、第二 届董事会第十六次会议、2025 年第一次临时股东大会、第二届董事会第二十次 会议审议通过了公司 2024 年度向特定对象发行 A 股股票的相关议案。根据《国 务院关于进一步促进资本市场健康发展的若干意见》（国发[2014]17 号）、《国务 院办公厅关于进一步加强资本市场中小投资者合法权益保护工作的意见》（国办 发[2013]110 号）和《关于首发及再融资、重大资产重组摊薄即期回报有关事项 的指导意见》（证监会公告[2015]31 号）的相关要求及公司财务数据及经营情况， 公司就本次 2024 年度向特定对象发行 A 股股票（以 ...

盛美半导体设备（上海）股份有限公司 关于调整公司 2024 年度向特定对象发行 A 股股票方 案的公告 证券代码：688082 证券简称：盛美上海 公告编号：2025-032 单位：万元 | 序号 | 项目名称 | 拟投资总额 | 拟使用募集资金投资金额 | | --- | --- | --- | --- | | 1 | 研发和工艺测试平台建设项目 | 94,034.85 | 94,034.85 | | 2 | 高端半导体设备迭代研发项目 | 225,547.08 | 225,547.08 | | 3 | 补充流动资金 | 130,418.07 | 130,418.07 | | | | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"盛美上海"或"公司"） 于2025年5月20日召开第二届董事会第二十次会议，审议通过了《关于调整公司 2024年度向特定对象发行A股股票方案的议案》。公司根据《中华人民共和国公 司法》《中华人民共和国证券法》《上市公司证券发行注册管理办法》等法规、 ...

Group 1 - The core viewpoint of the news is that Tongxiao Investment has conducted research on Shengmei Shanghai, highlighting the company's advancements in three-dimensional stacking electroplating equipment, high-temperature sulfuric acid cleaning equipment, and ALD furnace tube equipment [1] - Shengmei Shanghai's three-dimensional stacking electroplating equipment has achieved commercial validation in most clients in mainland China, while the high-temperature sulfuric acid cleaning equipment offers advantages such as reduced sulfuric acid consumption and elimination of acid mist splashing [1] - The ALD furnace tube equipment can handle temperatures up to 1250°C and has attracted interest from clients in China and Europe, with the company projecting revenue of 6.5 to 7.1 billion by 2025 [1] Group 2 - The company expects strong delivery in the second and third quarters, following a robust first quarter [1] - The overseas market is primarily focused on mainland China, with the panel-level horizontal electroplating equipment winning international awards, and product sales are set to expand globally [1] - The first PECVD equipment verification is progressing well, with more clients expected to validate it by 2025, and the company is open to acquisition opportunities while prioritizing organic growth and technological advantages [1]

Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]

Summary of Shengmei Shanghai Conference Call Company Overview - **Company**: Shengmei Shanghai - **Industry**: Semiconductor Equipment Manufacturing Key Points Financial Performance - In Q1 2025, Shengmei Shanghai achieved revenue of 1.306 billion RMB, a year-on-year increase of 41.73% [3] - Gross profit reached 664 million RMB with a gross margin of 50.87% [3] - Net profit attributable to shareholders was 246 million RMB, a significant increase of 207.21% year-on-year [3] - Cash flow from operating activities remained positive for the fourth consecutive quarter, with total assets of 12.638 billion RMB [3] Revenue Growth by Segment - **Cleaning Equipment**: Revenue grew by 28% to 920 million RMB, accounting for over 70% of total revenue, driven by ultrasonic cleaning equipment and stable performance of backside cleaning equipment [2][5] - **Electroplating Technology**: Revenue surged by 110% to over 200 million RMB, representing nearly 20% of total revenue, with the Ultra ECPAP device winning the US 3D Packaging Award [2][6] - **Furnace Tube Products**: The vertical furnace tube equipment, with a unique quartz structure, can handle temperatures up to 1,250 degrees Celsius, maintaining wafer surface flatness [2][7][8] - **Advanced Packaging and Backend Processing**: Revenue increased by 60% to over 100 million RMB, accounting for nearly 10% of total revenue, currently in the technology validation and market expansion phase [2][9] Product Development and Innovation - New products ETCH and PECVD are designed with differentiated technology to enhance process flexibility and output efficiency, with plans for beta testing in mid-2025 [2][10] - The company is focusing on expanding its product lines, including panel-level packaging and PCBL, to support long-term growth [2][11] Strategic Initiatives - The construction of the Lingang Semiconductor R&D and Manufacturing Center is nearing completion, supporting an annual output value of approximately 3 billion USD [4][13] - The company aims for 2025 revenue between 6.5 billion to 7.1 billion RMB, with a long-term goal of 3 billion USD, targeting equal market share from mainland China and overseas [4][12] Market Expansion and Future Outlook - Shengmei Shanghai is actively expanding its market share in China while also targeting global markets [5] - The company has established a research lab in South Korea and plans to set up a production base in the US to navigate trade policy changes [29] - The company anticipates significant growth in the STM and aluminum tube series starting in 2025, with a focus on maintaining a dual-engine strategy for business expansion [11][12] Environmental and Technological Innovations - The company is committed to reducing environmental pollution and optimizing automatic cleaning technologies, which have received positive feedback from clients [25][26] - Innovations in high-temperature sulfuric acid cleaning technology are expected to enhance wafer manufacturing processes [24] M&A and Industry Trends - The company acknowledges the trend of mergers and acquisitions in the semiconductor equipment sector and is open to opportunities that align with its strategic goals [34][35] R&D Investments - In Q1 2025, R&D expenditures totaled 252 million RMB, representing 19.31% of revenue, with a focus on new product development and manufacturing process upgrades [17] Conclusion - Shengmei Shanghai is positioned for robust growth driven by innovative product offerings, strategic market expansion, and a commitment to sustainability and technological advancement. The company aims to leverage its unique technologies to capture a larger share of both domestic and international markets.