证券代码：688082 证券简称：盛美上海 公告编号：2025-051 盛美半导体设备（上海）股份有限公司 关于选举第二届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 根据《中华人民共和国公司法》（以下简称"《公司法》"）《上海证券交 易所科创板股票上市规则》《上海证券交易所科创板上市公司自律监管指引第1 号——规范运作》和《盛美半导体设备（上海）股份有限公司章程》（以下简称 "《公司章程》"）等相关规定，盛美半导体设备（上海）股份有限公司（以下 简称"公司"）于2025年7月15日召开了职工代表大会，会议经出席本次会议的 全体职工代表投票表决，一致同意选举杨霞云女士为公司第二届董事会职工代表 董事（简历详见附件），任期自本次职工代表大会审议通过之日起至公司第二届 董事会任期届满之日止。 上述职工代表董事符合《公司法》等法律法规和《公司章程》规定的任职条 件。董事会中兼任公司高级管理人员以及由职工代表担任的董事人数总计不超过 公司董事总数的二分之一。 特此公告。 盛美半导体设备（上海）股份有限公 ...

1. 经公司 2025 年第二次临时股东大会审议通过的《盛美半导体设备（上海） 股份有限公司章程》（以下简称《公司章程》）； 2. 公司第二届董事会第二十一次会议决议； 3. 公司第二届监事会第二十次会议决议； 4. 公司 2025 年 6 月 27 日刊登于上海证券交易所网站的《盛美半导体设备 （上海）股份有限公司关于召开 2025 年第三次临时股东大会的通知》 （以下简称《股东大会通知》）； 5. 公司本次股东大会股权登记日的股东名册； 6. 出席会议的股东及其他人员的到会登记记录及凭证资料； 北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 2025 年第三次临时股东大会之法律意见书 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》（以下简称《公司法》）、中国证券 监督管理委员会（以下简称中国证监会）《上市公司股东会规则》（以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-052 盛美半导体设备（上海）股份有限公司 2025年第三次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 7 月 15 日 （二） 股东大会召开的地点：中国（上海）自由贸易试验区丹桂路 999 弄 B2 栋会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 53 | | --- | --- | | 普通股股东人数 | 53 | | 2、出席会议的股东所持有的表决权数量 | 363,575,341 | | 普通股股东所持有表决权数量 | 363,575,341 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 82.4719 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 82.4719 | （四） 表决方 ...

Core Insights - The semiconductor electroplating copper industry is experiencing rapid growth driven by strong demand from emerging technologies such as AI, 5G, and HPC, with the market expected to reach 5.2 billion yuan in 2024 and exceed 9.7 billion yuan by 2028, reflecting a compound annual growth rate (CAGR) of 16.8% [1][12][10] - Domestic companies have made significant breakthroughs in key technologies, accelerating the process of domestic substitution, with notable advancements in electroplating solutions and equipment [1][16][18] - The industry is focusing on three main directions: technological autonomy, green manufacturing, and collaborative innovation across the industrial chain [1][20] Industry Overview - Semiconductor electroplating copper involves the electrochemical deposition of copper layers on semiconductor wafers, replacing traditional aluminum interconnects due to its high conductivity and low resistance [2][4] - The market structure shows that electroplating solutions dominate with a 65% share, with advanced packaging and wafer manufacturing being the primary growth engines [1][14] Market Dynamics - The advanced packaging sector is rapidly growing, with the market size increasing from 35.13 billion yuan in 2020 to an expected 110 billion yuan by 2025, driven by AI and HPC demands [10][12] - The industry is characterized by a dual structure where foreign companies dominate the high-end market while domestic firms focus on differentiated breakthroughs [18][20] Technological Developments - Significant technological advancements include the development of a "deposition rate reversal" patent by Nantong Saike, which achieves void-free filling in TSV applications, and the introduction of the first domestic 12-inch TSV electroplating equipment by Northern Huachuang [16][18] - The industry is also seeing a shift towards green manufacturing processes, with a focus on cyanide-free technologies and intelligent control systems to enhance production efficiency and product quality [22][21] Competitive Landscape - The competitive landscape is marked by international giants controlling over 75% of the high-end electroplating liquid and additive market, particularly in the sub-5nm advanced process area [18][20] - Domestic companies like Aisen and Shanghai Xinyang are making strides in the advanced packaging electroplating copper base liquid and achieving certifications for 28nm Damascus electroplating solutions [18][19] Future Trends - The industry is expected to continue its trajectory of high-end technology breakthroughs and domestic substitution, with a focus on green upgrades and application innovations [20][21] - The market for TSV electroplating solutions is projected to reach 5 billion yuan by 2028, with a CAGR of 18.92%, indicating strong growth potential [23][10]

Core Viewpoint - The semiconductor equipment components industry is experiencing unprecedented growth opportunities due to increased market demand, accelerated localization processes, and significant investments, which are reshaping the industry landscape [3][10][12]. Group 1: Importance of Semiconductor Equipment Components - Semiconductor equipment components are critical to the performance and reliability of semiconductor devices, encompassing various parts such as O-Rings, EFEMs, RF Generators, and more [4][5]. - These components can be categorized based on functionality (mechanical, material transfer, electrical, vacuum, gas-liquid transport, optical, thermal management, and instrumentation) and standardization levels (precision machined parts and general purchased parts) [5][6]. Group 2: Market Growth and Domestic Demand - The semiconductor industry is witnessing a cyclical recovery, driven by demand from consumer electronics and emerging fields like AI and automotive electronics, leading to increased spending on semiconductor equipment [10]. - The global semiconductor manufacturing equipment sales are projected to reach $117 billion in 2024, a 10% increase from 2023, with Q1 2025 expected to see a 21% year-on-year growth [10][11]. - Domestic semiconductor equipment manufacturers are experiencing rapid growth, with companies like North Huachuang and Zhongwei reporting significant revenue increases of 37.9% and 35.4%, respectively [11][12]. Group 3: Capital Investment in Semiconductor Equipment Components - The semiconductor equipment components sector is attracting significant capital investment, with several companies successfully going public or securing funding [13][14]. - Companies like Blue Motion Precision and Naske have received substantial investments to support their focus on key components for the semiconductor industry [13][14]. Group 4: International Expansion of Component Manufacturers - Chinese semiconductor equipment component manufacturers are actively expanding into overseas markets, with exports expected to reach 37.08 billion yuan in 2024 [15]. - Companies like Fuchuang Precision are successfully increasing their international revenue, with significant growth in both domestic and overseas markets [15].

为维护全体股东的合法权利，确保股东大会的正常秩序和议事效率，保证大 会的顺利进行，根据《中华人民共和国公司法》 （以下简称"《公司法》"） 《中 华人民共和国证券法》 （以下简称"《证券法》"） 《上市公司股东会规则》以及 《盛美半导体设备（上海）股份有限公司章程》（以下简称 "《公司章程》"） 《盛美半导体设备（上海）股份有限公司股东大会议事规则》等相关规定，盛美 半导体设备（上海）股份有限公司（以下简称"公司"）特制定 2025 年第三次 临时股东大会会议须知： 证券代码：688082 证券简称：盛美上海 盛美半导体设备（上海）股份有限公司 盛美半导体设备（上海）股份有限公司 一、为确认出席大会的股东或其代理人或其他出席者的出席资格，会议工作 人员将对出席会议者的身份进行必要的核对工作，请被核对者予以配合。 二、为保证本次大会的严肃性和正常秩序，切实维护股东的合法权益，请出 席大会的股东或其代理人或其他出席者准时达到会场签到确认参会资格，在会议 主持人宣布现场出席会议的股东和代理人人数及所持有的表决权数量之前，会议 登记应当终止。 三、会议按照会议通知上所列顺序审议、表决议案。 四、股东及股东代理人参加股 ...

证券代码：688082 证券简称：盛美上海 盛美半导体设备（上海）股份有限公司 2025 年第三次临时股东大会会议资料 2025 年 7 月 盛美半导体设备（上海）股份有限公司 2025 年第三次临时股东大会会议须知 为维护全体股东的合法权利，确保股东大会的正常秩序和议事效率，保证大 会的顺利进行，根据《中华人民共和国公司法》（以下简称"《公司法》"）《中 华人民共和国证券法》（以下简称"《证券法》"）《上市公司股东会规则》以及 《盛美半导体设备（上海）股份有限公司章程》（以下简称 "《公司章程》"） 《盛美半导体设备（上海）股份有限公司股东大会议事规则》等相关规定，盛美 半导体设备（上海）股份有限公司（以下简称"公司"）特制定 2025 年第三次 临时股东大会会议须知： 一、为确认出席大会的股东或其代理人或其他出席者的出席资格，会议工作 人员将对出席会议者的身份进行必要的核对工作，请被核对者予以配合。 二、为保证本次大会的严肃性和正常秩序，切实维护股东的合法权益，请出 席大会的股东或其代理人或其他出席者准时达到会场签到确认参会资格，在会议 主持人宣布现场出席会议的股东和代理人人数及所持有的表决权数量之前，会 ...

Summary of Conference Call Records Company and Industry Overview - **Company**: 盛美上海 (ACMR) - **Industry**: Semiconductor Equipment Key Points and Arguments Industry Insights - Global semiconductor equipment spending is projected to reach **$117.1 billion** in 2024, with China leading at **$49.6 billion**, a **35%** year-on-year increase [2][4] - By 2026, China's **300mm wafer capacity** is expected to account for **26%** of global capacity, with domestic self-sufficiency projected to reach **26.6%** by 2027 [2][5] - The semiconductor cleaning process is critical, accounting for over **30%** of all chip manufacturing steps, with increasing complexity driving demand for advanced cleaning technologies [15] Company Performance - 盛美上海 is a leading domestic player in semiconductor cleaning and plating equipment, with a **7%** global market share, ranking fifth worldwide [3][17] - Revenue for 2024 is projected at **5.6 billion yuan**, a **49%** increase year-on-year, with a compound annual growth rate (CAGR) of **54%** from 2020 to 2024 [12] - The company aims for revenue between **6.5 billion to 7.1 billion yuan** in 2025, reflecting a **16% to 26%** growth [3] Technological Innovations - The company has developed the **SUBS Tibo ultrasonic cleaning technology**, suitable for processes at **28nm** and below, aiming to cover over **95%** of cleaning needs [2][6] - New product lines include high-temperature single wafer SPM and single wafer slot combination cleaning technologies [2][6] - The introduction of **plasma-enhanced chemical vapor deposition (PECVD)** equipment is expected to enhance processing capabilities while reducing footprint [11] Market Strategy - 盛美上海 is expanding its product portfolio to include five major series: cleaning, plating, advanced packaging wet processes, vertical furnace tubes, and coating development [2][7] - The company plans to capture **55% to 60%** of the domestic machine equipment market [4][17] - Continuous investment in R&D has increased from **140 million yuan** in 2020 to **729 million yuan** in 2024, enhancing its competitive edge [14] Financial Projections - Revenue forecasts for cleaning equipment are **4.8 billion**, **5.3 billion**, and **5.7 billion yuan** for 2025-2027, respectively [26] - Other semiconductor equipment revenues are projected at **1.6 billion**, **2.2 billion**, and **2.8 billion yuan** for the same period [26] - Advanced packaging wet process equipment is expected to generate revenues of **320 million**, **380 million**, and **460 million yuan** [26] Important but Overlooked Content - The company has a strong leadership team, with founder Dr. Wang Hui holding an **81%** stake in ACMR, providing stability and direction for technological advancements [8] - The company has successfully reduced reliance on major clients from over **80%** in 2020 to around **50%** in 2024, indicating improved supply chain stability [13] - Risks include potential downturns in downstream demand, increased domestic competition, and the impact of policy changes on operations [27][28] This summary encapsulates the key insights from the conference call, highlighting the company's strategic positioning, financial performance, and market dynamics within the semiconductor equipment industry.

Core Viewpoint - The company has adjusted its profit distribution plan for 2024, reducing the cash dividend per share from 0.65700 yuan to 0.65386 yuan due to an increase in the total number of shares outstanding following the completion of a stock incentive plan and share buybacks [1][5][6] Summary by Sections Adjusted Profit Distribution Plan - The cash dividend per share is adjusted to 0.65386 yuan (including tax) from the previous 0.65700 yuan (including tax) [1][5] - The total profit distribution amount remains unchanged at 288,252,674.72 yuan (including tax), which accounts for 25.00% of the net profit attributable to shareholders for the year 2024 [3][6] Background of Adjustments - The adjustment is due to the completion of the first vesting period for the stock incentive plan, resulting in an increase of 2,550,435 shares, raising the total issued shares from 438,740,753 to 441,291,188 [2][4] - The company repurchased 443,400 shares, which do not participate in profit distribution, leading to a revised total of 440,847,788 shares eligible for dividend distribution [5][6] Calculation of Adjusted Dividend - The adjusted cash dividend per share is calculated as 288,252,674.72 yuan divided by 440,847,788 shares, resulting in approximately 0.65386 yuan (including tax) [6]

证券代码：688082 证券简称：盛美上海 公告编号：2025-049 盛美半导体设备（上海）股份有限公司 关于以集中竞价交易方式回购公司股份的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/8/8 | | | | | --- | --- | --- | --- | --- | | 回购方案实施期限 | 2024 年 8 6 8 月 5 日 | 月 | 日~2025 | 年 | | 预计回购金额 | 5,000万元~10,000万元 | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | | | | □用于转换公司可转债 | | | | | | □为维护公司价值及股东权益 | | | | | 累计已回购股数 | 44.34万股 | | | | | 累计已回购股数占总股本比例 | 0.10% | | | | | 累计已回购金额 | 5,001.23万元 | | | | | 实际回购价格区间 | 110.81元/股~115.49 ...