证券代码：688082 证券简称：盛美上海 公告编号：2025-050 盛美半导体设备（上海）股份有限公司 关于调整 2024 年度利润分配方案每股分红金额的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 公司于2025年2月25日召开第二届董事会第十七次会议、第二届监事会第十 六次会议，于2025年6月12日召开了2024年年度股东大会，审议通过《关于2024 年度利润分配预案的议案》。公司2024年度拟以实施权益分派股权登记日登记的 总股本扣除公司回购专用账户持有公司股份后的股本总额为基数进行利润分配。 截至2024年12月31日，公司总股本为438,740,753股，以剔除已回购股份0股后的 总股本为基准，拟每10股派发现金红利6.57元（含税），共计派发现金红利 288,252,674.72元（含税），本次利润分配现金分红金额占2024年合并报表归属 于母公司股东净利润的25.00%。本次利润分配不送红股，不进行资本公积转增股 本。 2024年度以现金为对价，采用集中竞价方式已实施的股份回购金 ...

Investment Rating - The report initiates coverage with a "Buy" rating for the company, setting a target price of 136.08 CNY based on a 42x PE ratio for 2025 [2][5]. Core Insights - The company is a leading player in the domestic semiconductor cleaning and plating equipment market, with a strong focus on platformization and differentiation to drive growth [1][9]. - The company is expected to achieve revenue between 6.5 billion to 7.1 billion CNY in 2025, reflecting a year-on-year growth of approximately 16% to 26% [9]. - The semiconductor equipment industry is experiencing significant growth, with China's semiconductor equipment spending projected to reach 49.6 billion USD in 2024, a 35% increase year-on-year [9]. Financial Forecast and Investment Recommendations - The company is projected to have earnings per share of 3.24 CNY, 4.04 CNY, and 4.63 CNY for the years 2025, 2026, and 2027 respectively [2]. - Revenue forecasts for 2023 to 2027 show a consistent upward trend, with total revenue expected to grow from 3.888 billion CNY in 2023 to 9.156 billion CNY in 2027 [4]. - The company’s net profit is anticipated to increase from 911 million CNY in 2023 to 2.045 billion CNY in 2027, indicating a robust growth trajectory [4]. Company Overview - The company has established itself as a leader in the semiconductor equipment sector, with a comprehensive product range that includes cleaning, plating, and advanced packaging equipment [19][24]. - The company has a strong focus on R&D, with a significant increase in R&D expenditure from 141 million CNY in 2020 to 729 million CNY in 2024, supporting its innovation-driven strategy [33][49]. - The company has a well-defined strategic roadmap, transitioning from a single-product focus to a diversified platform strategy that includes six major product lines [23][48]. Market Position and Competitive Advantage - The company aims to capture 55% to 60% of the domestic semiconductor cleaning equipment market, leveraging its technological differentiation and strong R&D capabilities [10]. - The company has developed proprietary technologies such as SAPS and TEBO, which enhance its competitive edge in the cleaning equipment market [46][47]. - The company has established stable relationships with major semiconductor manufacturers, enhancing its market presence and customer base [36][37]. Growth Drivers - The ongoing shift towards high-end semiconductor equipment and the increasing domestic demand for advanced packaging solutions are key growth drivers for the company [9][10]. - The company’s platformization strategy is expected to open new revenue streams and enhance its market competitiveness across various semiconductor equipment segments [11][12]. - The anticipated growth in global semiconductor production capacity and the increasing trend of localization in semiconductor manufacturing will further benefit the company [9][19].

Core Viewpoint - The company, Shengmei Semiconductor Equipment (Shanghai) Co., Ltd., is undergoing significant governance changes, including the cancellation of the supervisory board and an increase in the number of directors, which may impact its operational structure and strategic direction [2][7]. Group 1: Stock Performance - As of June 27, 2025, Shengmei Shanghai's stock closed at 112.9 yuan, reflecting a 3.11% increase from the previous week [1]. - The stock reached a peak price of 115.5 yuan and a low of 108.45 yuan during the week [1]. - The company's current total market capitalization is 49.822 billion yuan, ranking 16th out of 161 in the semiconductor sector and 273rd out of 5,151 in the A-share market [1]. Group 2: Corporate Governance Changes - The second supervisory board's twentieth meeting approved three key resolutions: the cancellation of the supervisory board, an increase in the number of directors, and adjustments to the share repurchase price limit [2]. - The company plans to hold its third extraordinary general meeting on July 15, 2025, to discuss the cancellation of the supervisory board and the increase in the number of directors [3]. - The board intends to increase its size from 6 to 8 members, adding independent director Jiang Shoule [5]. Group 3: Financial Management - The company approved the temporary use of up to 250 million yuan of idle raised funds to supplement working capital, with a validity period of 12 months from the board's approval [6][7]. - The share repurchase price limit has been adjusted from 99.02 yuan per share to 120.00 yuan per share to ensure the smooth implementation of the repurchase plan [8].

证券代码：688082 证券简称：盛美上海 公告编号：2025-046 盛美半导体设备（上海）股份有限公司 □用于转换公司可转债 □为维护公司价值及股东权益 累计已回购股数 44.34万股 累计已回购股数占总股本比例 0.10% 累计已回购金额 5,001.23万元 实际回购价格区间 110.81元/股~115.49元/股 一、 回购股份的基本情况 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于2024年8月6 日召开第二届董事会第十二次会议及第二届监事会第十二次会议，审议通过了《关 于以集中竞价交易方式回购公司股份方案的议案》，同意公司使用首次公开发行 人民币普通股取得的部分超募资金及公司自有资金通过集中竞价交易方式进行股 份回购。回购股份将在未来适宜时机用于股权激励或员工持股计划。回购价格不 超过90元/股（含），回购资金总额不低于人民币5,000万元（含），不超过人民 币10,000万元（含），回购期限为自董事会审议通过本次回购方案之日起12个月 内。具体内容详见公司于2024年8月8日在上海证券交易所网站（www.sse.com.cn） 上披露的《关于以集中竞价交易方式回购公司股份方案的公告 ...

Core Points - The company has received approval from the China Securities Regulatory Commission for the issuance of A-shares to specific investors [1][2] - The approval is valid for 12 months from the date of registration [1] - The company is required to follow the submitted documents and issuance plan strictly [1] Summary by Sections Approval Details - The company has been granted permission to issue shares to specific investors as per the regulatory approval [1] - The approval document specifies that the issuance must adhere to the submitted application and plan [1] Compliance and Reporting - The company must report any significant events to the Shanghai Stock Exchange from the date of approval until the issuance is completed [1] - The board of directors will handle the issuance matters within the stipulated timeframe and ensure timely information disclosure [2]

证券代码：688082 证券简称：盛美上海 公告编号：2025-047 一、募集资金基本情况 经中国证券监督管理委员会《关于同意盛美半导体设备（上海）股份有限公 司首次公开发行股票注册的批复》（证监许可[2021]2689号）批准，公司向社会 公开发行人民币普通股（A股）43,355,753股，发行价格为85.00元/股，募集资 金总额为人民币3,685,239,005.00元，扣除发行费用后，募集资金净额为人民币 3,481,258,520.34元。上述募集资金到位情况已经立信会计师事务所（特殊普通 合伙）审验并出具信会师报字[2021]第ZI10561号《验资报告》。 为规范公司募集资金管理和使用、保护投资者权益，公司设立了募集资金专 项账户，并与保荐机构、存放募集资金的商业银行签署了《募集资金专户存储三 方监管协议》。募集资金到账后，已全部存放于经公司董事会批准开设的募集资 金专项账户内。 二、募集资金投资项目情况 根据《盛美半导体设备（上海）股份有限公司首次公开发行股票并在科创板 上 市 招 股 说 明 书 》 以 及 公 司 于 2022 年 8 月 8 日 在 上 海 证 券 交 易 所 网 站 ...

证券代码：688082 证券简称：盛美上海 公告编号：2025-046 盛美半导体设备（上海）股份有限公司 公司于2025年4月10日召开第二届董事会第十八次会议及第二届监事会第十 七次会议，审议通过了《关于调整回购股份价格上限的议案》，同意将回购股份 价格上限由人民币90元/股（含）调整为人民币99.02元/股（含）。具体内容详见 公司于2025年4月12日在上海证券交易所网站（www.sse.com.cn）上披露的《关于 调整回购股份价格上限的公告》（公告编号：2025-025）。 公司于2025年6月26日召开第二届董事会第二十一次会议及第二届监事会第 二十次会议，审议通过了《关于调整回购股份价格上限的议案》，同意将回购股 份价格上限由人民币99.02元/股（含）调整为人民币120.00元/股（含）。具体内 容详见公司于2025年6月27日在上海证券交易所网站（www.sse.com.cn）上披露的 《关于调整回购股份价格上限的公告》（公告编号：2025-043）。除上述调整外， 回购股份方案的其他内容不变。 二、回购股份的进展情况 关于以集中竞价交易方式首次回购公司股份的公告 本公司董事会及全体董事保 ...

二、你公司本次发行应严格按照报送上海证券交易所的申报文件和发行方案 实施。 三、本批复自同意注册之日起12个月内有效。 证券代码：688082 证券简称：盛美上海 公告编号：2025-048 盛美半导体设备（上海）股份有限公司 关于 2024 年度向特定对象发行 A 股股票申请 获得中国证券监督管理委员会同意注册批复的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）于近日收到中 国证券监督管理委员会出具的《关于同意盛美半导体设备（上海）股份有限公司 向特定对象发行股票注册的批复》（证监许可〔2025〕1338号）（以下简称"批 复文件"），批复文件内容如下： 一、同意你公司向特定对象发行股票的注册申请。 四、自同意注册之日起至本次发行结束前，你公司如发生重大事项，应及时 报告上海证券交易所并按有关规定处理。 公司董事会将按照上述批复文件和相关法律法规的要求以及公司股东大会 的授权，在规定期限内办理本次向特定对象发行股票的相关事项，并及时履行信 息披露义务，敬请广大 ...

盛美上海公告，公司于2025年6月27日通过上海证券交易所交易系统以集中竞价交易方式首次回购股份 44.34万股，占公司总股本4.41亿股的0.10%，回购价格区间为110.81元/股至115.49元/股，累计使用资金 5001.23万元(不含交易费用)。本次回购符合相关法律法规及公司回购方案，后续将继续根据市场情况实 施回购并及时披露进展。 ...

Core Insights - The semiconductor CVD equipment is a critical component in the semiconductor industry, directly influencing chip performance, yield, and manufacturing costs [1][17] - The market for semiconductor CVD equipment in China is projected to grow from 4.532 billion yuan in 2015 to 52.456 billion yuan by 2024, with a compound annual growth rate (CAGR) of 31.27% [1][17] - The demand for chips is surging due to the rapid rise of technologies such as 5G, IoT, and AI, driving the growth of the semiconductor CVD equipment industry in China [1][17] Industry Overview - Semiconductor equipment is essential for manufacturing semiconductor devices and is a cornerstone of the semiconductor industry [4] - The semiconductor CVD equipment market is categorized into various types, including APCVD, LPCVD, PECVD, ALD, VPE, MOCVD, and HDPCVD, each with distinct characteristics and applications [6][7] - The semiconductor CVD equipment industry is part of a broader supply chain that includes raw materials, manufacturing, and application in semiconductor production [8] Market Dynamics - The global semiconductor equipment sales are expected to reach $117.1 billion in 2024, with a year-on-year growth of 10.16% [11] - The semiconductor CVD equipment market is expected to account for approximately 75% of the overall thin film deposition equipment market, with PECVD being the largest segment [14][12] - China is projected to become the largest semiconductor equipment market globally, with sales expected to reach 353.236 billion yuan in 2024, reflecting a year-on-year growth of 36.96% [16] Competitive Landscape - The global semiconductor CVD equipment market is dominated by major players such as AMAT, LAM, and TEL, which collectively hold over 80% market share [20] - Domestic companies like Tuojing Technology, North Huachuang, and Micro Nano are emerging as key competitors in the CVD equipment market, focusing on innovation and market expansion [22][20] - The competition in the semiconductor CVD equipment industry is characterized by both international and local players, with a trend towards diversification and localized production [22] Future Trends - The semiconductor CVD equipment industry is expected to accelerate technological upgrades to meet advanced process requirements, particularly as chip manufacturing moves towards 3nm nodes [30] - There is a growing demand for CVD equipment across diverse applications, including third-generation semiconductors and advanced packaging technologies [31] - Domestic manufacturers are likely to increase their market share through localized production and collaboration with wafer fabs and material suppliers, enhancing the overall competitiveness of the industry [32]