北京市金杜律师事务所上海分所 关于 盛美半导体设备（上海）股份有限公司 2024 年度差异化分红事项 之 专项法律意见书 二〇二五年七月 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称"本所"或"金杜"）接受盛美半导 体设备（上海）股份有限公司（以下简称"公司"）的委托，根据《中华人民共和 国公司法（2023年修订）》（以下简称"《公司法》"）、《中华人民共和国证券法》 （以下简称"《证券法》"）、《上市公司股份回购规则》（以下简称"《回购规则》"）、 《上海证券交易所上市公司自律监管指引第7号——回购股份（2025年3月修订）》 （以下简称"《监管指引第7号》"）等法律、法规、部门规章及其他规范性文件 （以下简称"法律法规"）和《盛美半导体设备（上海）股份有限公司章程》（以下 简称"《公司章程》"）的有关规定，就公司2024年度利润分配所涉及的差异化分 红（以下简称"本次差异化分红"）相关事项，按照律师行业公认的业务标准、道 德规范和勤勉尽责精神，出具本法律意见书。 本法律意见书的出具已得到公司如下保证： 1、公司向本所提供的所有文件资料及所作出的所有陈述和说明均是真实、 准 ...

二、 分配方案 证券代码：688082 证券简称：盛美上海 公告编号：2025-054 盛美半导体设备（上海）股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 股权登记日 | 除权（息）日 | 现金红利发放日 | | --- | --- | --- | | 2025/7/31 | 2025/8/1 | 2025/8/1 | 一、 通过分配方案的股东会届次和日期 本次利润分配方案经公司2025 年 6 月 12 日的2024年年度股东大会审议通过。 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东 （公司回购专用证券账户中的股份除外）。 根据《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等有关 规定，公司回购专用证券账户中的股份不享有利润分配的权利。 是否涉及差异化分红送转：是 每股分配比例 每股现金红利0.65386元（含税） 相关日期 1. 发放年度：20 ...

Core Viewpoint - The company, ACM Research (Shanghai), Inc., is preparing for a specific stock issuance to raise funds for various projects, including high-end semiconductor equipment development and working capital replenishment. The issuance has received approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission. Group 1: Issuance Details - The company plans to issue no more than 44,129,118 shares, which will not exceed 10% of the total share capital prior to the issuance [4][5] - The issuance price will be set at no less than 80% of the average trading price over the 20 trading days preceding the pricing benchmark date [4] - The final issuance price will be determined by the board of directors in consultation with the underwriters after receiving regulatory approval [4][5] Group 2: Fund Utilization - The total amount intended for investment projects is approximately 450 million yuan, with 448.2 million yuan expected to be raised from the issuance [6] - The company may adjust the order and specific amounts of investment based on project progress and funding needs [6] - If the actual net amount raised is less than the planned investment total, the company will cover the shortfall with self-raised funds [6] Group 3: Company Overview - ACM Research (Shanghai) is engaged in the manufacturing of semiconductor equipment and related services, with a focus on high-end technology [1][2] - The company is headquartered in the Shanghai Free Trade Zone and was listed on the Shanghai Stock Exchange on November 18, 2021 [1][2] - The company’s stock code is 688082, and it has a total share capital of 44,129,118 shares [1][2] Group 4: Market Context - The semiconductor equipment industry is experiencing rapid growth, driven by increasing demand in various sectors, including 5G, computing, and consumer electronics [9][10] - The Chinese market is expected to become a competitive battleground for semiconductor equipment companies, facing challenges from both international giants and new domestic entrants [9][10] - The company’s products are in direct competition with established international firms, which possess stronger financial resources and technological advantages [9][10]

股票简称：盛美上海 股票代码：688082 盛美半导体设备（上海）股份有限公司 ACM Research（Shanghai）, Inc. （中国（上海）自由贸易试验区丹桂路 999 弄 5、6、7、8 号全幢） 2 0 2 4 年度向特定对象发行 A 股股票 募集说明书 （ 注 册 稿 ） 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 二〇二五年七月 盛美半导体设备（上海）股份有限公司 募集说明书 声 明 本公司及全体董事、高级管理人员承诺募集说明书及其他信息披露资料不存 在任何虚假记载、误导性陈述或重大遗漏，并对其真实性、准确性及完整性承担 相应的法律责任。 公司负责人、主管会计工作负责人及会计机构负责人保证募集说明书中财务 会计资料真实、完整。 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对申请 文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行人的 盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与之相反 的声明均属虚假不实陈述。根据《证券法》的规定，证券依法发行后，发行人经 营与收益的变化，由发行人自行负责。投资者自主判断发行人的投 ...

Group 1 - The semiconductor packaging equipment industry is experiencing robust growth in China, driven by strong demand in emerging applications such as smartphones, AI, IoT, and automotive electronics. The sales revenue for semiconductor packaging equipment in China is projected to reach 28.27 billion yuan in 2024, representing a year-on-year increase of 18.93% [1][18] - The industry is expected to continue evolving towards high-density, high-performance, and high-reliability equipment due to rapid advancements in technologies like 5G, IoT, and AI [1][18] - The global semiconductor equipment market is also witnessing significant growth, with sales expected to reach 117.1 billion USD in 2024, a 10.16% increase from 2023 [15][17] Group 2 - Key players in the semiconductor packaging equipment market include both international leaders such as ASM Pacific Technology, Kulicke & Soffa, and local Chinese companies like North Huachuang, Shengmei Semiconductor, and Xinyi Chang [21][23] - North Huachuang's revenue from electronic process equipment is projected to be 27.707 billion yuan in 2024, marking a 41.28% increase [23] - Shengmei Semiconductor's revenue is expected to reach 5.44 billion yuan in 2024, reflecting a 46.43% growth [25] Group 3 - The semiconductor packaging equipment industry is supported by various policies aimed at promoting domestic production and technological breakthroughs, including the implementation of national standards and talent cultivation initiatives [8][10] - The industry is characterized by a complex supply chain, with upstream components including sensors and subsystems, midstream manufacturing, and downstream applications serving OSATs, IDMs, and foundries [11][13] Group 4 - The industry is witnessing a shift towards high precision and intelligent equipment, with advancements in packaging technologies such as Chiplet and 3D IC driving innovation [27] - New application scenarios, particularly in electric vehicles and AI chips, are creating additional market opportunities for specialized packaging equipment [28] - The construction of digital factories is transforming traditional equipment operation and maintenance, enhancing efficiency through real-time data collection and predictive maintenance [29]

Core Viewpoint - Shengmei Shanghai has evolved into a platform company in the semiconductor equipment industry, aiming to become a leading global player by leveraging its innovative technologies and expanding its product offerings [1][3]. Group 1: Company Development and Achievements - Shengmei Shanghai was founded in 2005 and developed the world's first SAPS technology in 2008, achieving profitability since 2013 and experiencing exponential growth in equipment sales since 2017 [1]. - The company has successfully maintained a profitable status and has seen rapid growth in financial metrics since its listing on the Sci-Tech Innovation Board [1][2]. - As of 2024, Shengmei Shanghai's cleaning equipment covers 95% of cleaning process steps, ranking fourth globally with an 8% market share [2]. Group 2: Technological Innovations - The company has developed proprietary technologies such as SAPS and TEBO, addressing global challenges in the application of megasonic technology in semiconductor cleaning equipment [2]. - Shengmei Shanghai has filed a total of 1,526 patents by the end of 2024, with 470 granted patents, showcasing its commitment to original innovation [4]. - The Tahoe cleaning equipment, developed by the company, reduces sulfuric acid consumption by up to 75%, aligning with national energy-saving policies [5]. Group 3: Strategic Expansion - The company aims to expand its product portfolio beyond cleaning equipment to include electroplating, advanced packaging, and other semiconductor manufacturing equipment [3]. - Shengmei Shanghai is actively pursuing a global market strategy, targeting a balanced order volume from domestic and international clients [6]. - The company has established a local presence in South Korea to enhance service and support for its clients in that market [7]. Group 4: Future Outlook - The company is focused on continuing its path of differentiation and innovation, aiming to transition from an industry innovator to a standard setter in the semiconductor equipment sector [7]. - Shengmei Shanghai plans to leverage its dual capital market presence to enhance its competitive advantage and expand its global footprint [6].

Group 1 - The Shanghai Stock Exchange Sci-Tech Innovation Board Semiconductor Materials and Equipment Theme Index decreased by 0.30% as of July 21, 2025, with mixed performance among constituent stocks [1] - Hanbo Semiconductor signed a counseling agreement with CITIC Securities on July 11, 2025, to officially start its A-share IPO process, focusing on high-end GPU chip solutions for AI core computing power and graphics rendering [1] - Shanxi Securities highlights the urgent need for domestic lithography machine production due to the construction boom of wafer fabs in China and increased U.S. export controls on semiconductor equipment [1] Group 2 - The Sci-Tech Innovation Board Semiconductor ETF (588170) tracks the Semiconductor Materials and Equipment Theme Index, encompassing hard-tech companies in the semiconductor equipment and materials sectors [2] - The semiconductor equipment and materials industry is a crucial area for domestic substitution, characterized by low domestic substitution rates and high potential for domestic replacement, benefiting from the expansion of semiconductor demand driven by the AI revolution [2]

Group 1 - UBTECH Technology has secured the largest procurement order in the humanoid robot industry, amounting to approximately 90.51 million yuan, marking a significant milestone for the company [1] - UBTECH plans to deliver 500 units of its industrial humanoid robot Walker S2, which features autonomous battery swapping capabilities, by the end of the year [1] - The company has also announced that it has received over 100 orders for its Tian Gong Xing Zhe robot aimed at research and education, with expectations to deliver more than 300 units this year [1] Group 2 - Anyang Iron and Steel has successfully delivered its first advanced high-manganese wear-resistant steel from its Anyang base, marking a breakthrough in high-end material development [2] - The Mn13 series of high-manganese wear-resistant steel is primarily used in mining machinery, metallurgical equipment, construction machinery, and coal machinery, indicating strong demand in the mining and metallurgy sectors [2] Group 3 - Shanghai Semiconductor Equipment Co., Ltd. and East China University of Science and Technology have signed an agreement to establish a joint technology innovation transfer center for high-end semiconductor equipment [3] - The collaboration will focus on technical breakthroughs, achievement transformation, and talent cultivation, indicating a commitment to advancing semiconductor technology [3] Group 4 - Shanghai Electric's subsidiary, Shanghai Heavy Machinery Works, has successfully passed the expert review for its first high-end intelligent equipment project, which addresses the technical challenges of high-performance requirements for main equipment forgings in high-temperature gas-cooled reactors [4] - This project represents a significant achievement in the manufacturing of pressure vessels and components for nuclear island applications [4]

证券代码：688082 证券简称：盛美上海 公告编号：2025-053 盛美半导体设备（上海）股份有限公司 关于召开 2025 年第一季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 会议召开时间：2025 年 07 月 25 日（星期五）15:00-16:00 会 议 召 开 地 点 ： 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网 址 ： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心视频录播和网络互动 投资者可于 2025 年 07 月 18 日（星期五）至 07 月 24 日（星期四）16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 （ir@acmrcsh.com）进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 盛美半导体设备（上海）股份有限公司（以下简称"公司"）已于2025年4 月30日发布公司2025年第一季度报告，为便于广大投资者更全面深入地了解公司 2025年第一季度经营成果 ...

北京市金杜律师事务所上海分所 关于盛美半导体设备（上海）股份有限公司 致：盛美半导体设备（上海）股份有限公司 北京市金杜律师事务所上海分所（以下简称本所）接受盛美半导体设备（上 海）股份有限公司（以下简称公司）委托，根据《中华人民共和国证券法》（以 下简称《证券法》）、《中华人民共和国公司法》 （以下简称《公司法》 ）、中国证券 监督管理委员会（以下简称中国证监会） 《上市公司股东会规则》 （以下简称《股 东会规则》）等中华人民共和国境内（以下简称中国境内，为本法律意见书之目 的，不包括中国香港特别行政区、中国澳门特别行政区和中国台湾省）现行有效 的法律、行政法规、规章和规范性文件和现行有效的公司章程有关规定，指派律 师出席了公司于 2025 年 7 月 15 日召开的 2025 年第三次临时股东大会（以下简 称本次股东大会），并就本次股东大会相关事项出具本法律意见书。 为出具本法律意见书，本所律师审查了公司提供的以下文件，包括但不限于： 股份有限公司章程》（以下简称《公司章程》）； （上海）股份有限公司关于召开 2025 年第三次临时股东大会的通知》 （以下简称《股东大会通知》）； 公司已向本所保证，公司已 ...