智通财经APP讯，聚辰股份(688123.SH)发布2025年半年度报告，报告期内，公司实现营业收入5.75亿 元，同比增长11.69%。实现归属于上市公司股东的净利润2.05亿元，同比增长43.50%。实现归属于上市 公司股东的扣除非经常性损益的净利润1.77亿元，同比增长22.47%。基本每股收益1.3元。 ...

格隆汇8月22日丨聚辰股份(688123.SH)公布半年度报告，报告期内，公司实现营业收入57,485.54万元， 归属于上市公司股东的净利润为20,515.06万元，归属于上市公司股东的扣除非经常性损益的净利润为 17,736.03万元，分别较上年同期增长11.69%、43.50%和22.47%，再创历史同期最好成绩。与此同时， 公司持续提升企业研发水平，不断完善技术储备和产品布局，上半年的研发投入达10,267.08万元，较上 年同期增加2,051.13万元，创历史同期最高水平，为进一步丰富公司的业务结构、提升公司的盈利能力 和综合竞争力奠定了坚实基础。 ...

Core Viewpoint - The company, 聚辰股份, reported strong financial performance in the first half of 2025, achieving record-high revenues and profits, driven by growth in various product segments, particularly in memory module supporting chips and automotive EEPROMs [1][2][5]. Financial Performance - In the first half of 2025, the company achieved operating revenue of 575 million yuan and a net profit attributable to shareholders of 205 million yuan, marking year-on-year growth of 11.69% and 43.50% respectively [1]. - The second quarter revenue reached 314 million yuan, exceeding 300 million yuan for the first time, with a quarter-on-quarter growth of over 20% [1]. Product Development and Market Position - The company has established itself as one of the few suppliers qualified to directly provide memory module supporting chips to major manufacturers, with a comprehensive product lineup covering DDR2/3/4/5 SPD and TS chips [2]. - Rapid growth in DDR5 SPD revenue has been a significant driver for the company's revenue expansion and profitability improvement [2]. AI and High-Performance Computing - The demand for AI servers has led to significant upgrades in memory configurations, with mainstream AI servers requiring over 20 DDR5 memory modules, creating new growth opportunities for SPD and TS chips [3]. - The rise of AI PCs and the introduction of LPCAMM2 memory modules are expected to further increase demand for DDR5 SPD chips [3]. Consumer Electronics and Automotive Market - The company holds a leading market share in EEPROM chips for consumer electronics, with successful applications in AI glasses and other smart devices [4]. - As the only domestic supplier of a full range of automotive EEPROM chips, the company has successfully penetrated key overseas markets and expanded its market share among leading automotive electronics Tier 1 suppliers [5]. Industrial Applications - The company has a strong presence in the industrial applications market, with its high-performance industrial-grade EEPROM chips widely used in automation, digital energy, and communication sectors [6]. - The demand for high-performance storage chips is expected to grow as the manufacturing industry undergoes digital transformation [6]. R&D Investment - The company significantly increased its R&D investment, exceeding 100 million yuan in the first half of 2025, accounting for nearly 18% of operating revenue, with a notable increase in R&D personnel [8]. - The second quarter R&D investment reached 62 million yuan, reflecting a more than 50% quarter-on-quarter growth [8].

北京市中伦（上海）律师事务所 关于聚辰半导体股份有限公司 事项的 法律意见书 二〇二五年八月 法律意见书 北京市中伦（上海）律师事务所 关于聚辰半导体股份有限公司 法律意见书 致：聚辰半导体股份有限公司 、《聚辰半 北京市中伦（上海）律师事务所（以下简称"本所"）接受聚辰半导体股份 有限公司（以下简称"聚辰股份"或"公司"）的委托，担任公司 2021 年限制性 股票激励计划（以下简称"2021 年激励计划"） 、2022 年限制性股票激励计划（以 下简称"2022 年激励计划"）以及 2023 年限制性股票激励计划（以下简称"2023 年激励计划"）的专项法律顾问，并就公司 2021 年激励计划首次授予部分第四个 归属期归属条件成就（以下简称"2021 年激励计划首次授予部分归属"）、2021 年激励计划预留授予部分第一批次第四个归属期归属条件成就（以下简称"2021 年激励计划预留授予部分归属"）、2022 年激励计划预留授予部分第三个归属期 、2023 年激励计 归属条件成就（以下简称"2022 年激励计划预留授予部分归属"） 划预留授予部分第二批次第一个归属期归属条件成就（以下简称"2023 年激励计 ...

证券代码：688123 证券简称：聚辰股份 公告编号：2025-039 聚辰半导体股份有限公司 关于调整 2021 年、2022 年、2023 年限制性股票激励 计划授予价格及作废处理部分限制性股票的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 鉴于自 2021 年、2022 年、2023 年限制性股票激励计划草案公告之日起至激 励对象完成限制性股票归属登记前，聚辰半导体股份有限公司（以下简称"公 司"）实施有 2024 年年度权益分派事项，且部分激励对象因个人原因离职，根 据中国证监会《上市公司股权激励管理办法》、 《上海证券交易所科创板股票上市 《聚辰股份 2021 年限制性股票激励计划（草案）》、《聚辰股份 2022 年限 规则》、 制性股票激励计划（草案）》以及《聚辰股份 2023 年限制性股票激励计划（草案）》 的有关规定，经 2020 年年度股东大会、2022 年第一次临时股东大会以及 2023 年第二次临时股东大会授权，公司董事会决议将 2021 年限制性股票激励计划的 限制性股票授予价格由 16.0 ...

证券代码：688123 证券简称：聚辰股份 公告编号：2025-040 聚辰半导体股份有限公司 第四个归属期符合归属条件的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 限制性股票拟归属数量：67,600 股 ● 归属股票来源：聚辰半导体股份有限公司（以下简称"公司"）向激励对 象定向发行公司 A 股普通股股票 一、本次股权激励计划的批准及实施情况 （一）本次股权激励计划的方案及履行的程序 （1）股权激励方式：第二类限制性股票。 （2）授予数量：公司 2021 年限制性股票激励计划授予的限制性股票总量为 万股的 0.74%。其中首次授予 72 万股（调整前），约占本次股权激励计划草案公 告日公司股本总额的 0.60%，占授予权益总额的 80.00%；预留授予 18 万股（调 整前），约占本次股权激励计划草案公告日公司股本总额的 0.15%，占授予权益 总额的 20.00%。 （3）授予价格：本次股权激励计划限制性股票调整后的授予价格为 15.72 元/股（调整后），即满足授予条件和归属条件后，激励 ...

证券代码：688123 证券简称：聚辰股份 公告编号：2025-043 聚辰半导体股份有限公司 第二批次第一个归属期符合归属条件的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 限制性股票拟归属数量：6,700 股 ● 归属股票来源：聚辰半导体股份有限公司（以下简称"公司"）向激励对 象定向发行公司 A 股普通股股票 一、本次股权激励计划的批准及实施情况 （一）本次股权激励计划的方案及履行的程序 （1）股权激励方式：第二类限制性股票。 （2）授予数量：公司 2023 年限制性股票激励计划授予的限制性股票总量为 总额的 0.72%，占授予权益总额的 94.85%；预留授予 6.18 万股，约占本次股权 激励计划草案公告日公司股本总额的 0.04%，占授予权益总额的 5.15%。 （3）授予价格：本次股权激励计划限制性股票调整后的授予价格为 27.10 元/股（调整后），即满足授予条件和归属条件后，激励对象可以每股 27.10 元的 价格购买公司向激励对象增发的公司 A 股普通股股票。 | （4）激励 ...

证券代码：688123 证券简称：聚辰股份 公告编号：2025-042 聚辰半导体股份有限公司 第三个归属期符合归属条件的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： ● 限制性股票拟归属数量：67,925 股 ● 归属股票来源：聚辰半导体股份有限公司（以下简称"公司"）向激励对 象定向发行公司 A 股普通股股票 一、本次股权激励计划的批准及实施情况 （一）本次股权激励计划的方案及履行的程序 （1）股权激励方式：第二类限制性股票。 （2）授予数量：公司 2022 年限制性股票激励计划授予的限制性股票总量为 万股的 1.49%。其中首次授予 158.40 万股（调整前），约占本次股权激励计划草 案公告日公司股本总额的 1.31%，占授予权益总额的 88.00%；预留授予 21.6 万 股（调整前），约占本次股权激励计划草案公告日公司股本总额的 0.18%，占授 予权益总额的 12.00%。 （3）授予价格：本次股权激励计划限制性股票调整后的授予价格为 16.03 元/股（调整后），即满足授予条件和归属 ...

Group 1 - The board of directors of Juchen Semiconductor Co., Ltd. held its sixth meeting of the third session, where all resolutions were deemed legal and effective [1] - The meeting approved the 2025 semi-annual report, which accurately reflects the company's financial status as of June 30, 2025, and its operational results for the first half of 2025 [1][2] - The board also approved a special report on the storage and actual use of raised funds for the first half of 2025, confirming compliance with relevant regulations [2] Group 2 - The company is actively implementing the "Quality Improvement and Efficiency Enhancement" action plan for 2025, aimed at promoting high-quality development and boosting investor confidence [3] - The board approved adjustments to the grant prices of restricted stock incentive plans for 2021, 2022, and 2023, reflecting changes due to the company's profit distribution plan [4] - The board resolved to void a portion of the 2022 restricted stock incentive plan due to the departure of an incentive object before stock vesting [4][5] Group 3 - The board approved the fulfillment of vesting conditions for the fourth vesting period of the 2021 restricted stock incentive plan, allowing 67,600 shares to vest for eligible participants [6] - The board also approved the vesting of 13,000 shares for the first batch of the 2021 restricted stock incentive plan's reserved grant portion [6] - The board confirmed the vesting of 67,925 shares for the third vesting period of the 2022 restricted stock incentive plan for eligible participants [8] Group 4 - The board approved the vesting of 6,700 shares for the second batch of the 2023 restricted stock incentive plan's first vesting period for eligible participants [9]

Meeting Overview - The third meeting of the Supervisory Board of Jucheng Semiconductor Co., Ltd. was held with all three supervisors present, ensuring compliance with legal and procedural requirements [1] Financial Reporting - The Supervisory Board approved the 2025 Half-Year Report, which accurately reflects the company's financial status as of June 30, 2025, and its operational results and cash flow for the first half of 2025 [2] Fund Management - The Supervisory Board approved the Special Report on the storage and actual use of raised funds for the first half of 2025, confirming compliance with relevant regulations and accurate disclosure of the fund's status [2] Stock Incentive Plans - The Supervisory Board approved the adjustment of the grant price for restricted stock incentive plans from 2021, 2022, and 2023, in accordance with regulatory requirements [3][4] - The Board agreed to void 1,300 shares of restricted stock from the 2022 incentive plan due to the departure of one incentive object before the vesting registration [4] - The Board confirmed that the conditions for the fourth vesting period of the 2021 incentive plan were met, allowing for the vesting of 67,600 shares for seven eligible participants [5] - The Board approved the vesting of 13,000 shares for three eligible participants from the first batch of the 2021 incentive plan [6] - The Board confirmed the vesting conditions for the third vesting period of the 2022 incentive plan, allowing for the vesting of 67,925 shares for 19 eligible participants [6] - The Board approved the vesting of 6,700 shares for five eligible participants from the second batch of the 2023 incentive plan [7]