Group 1 - The core viewpoint of the news is that Jucheng Semiconductor Co., Ltd. has officially submitted its application for the issuance of H-shares and listing on the Hong Kong Stock Exchange, marking a significant step in its "A+H" dual capital market strategy [1][2] - The primary decision for this H-share issuance is to expand international financing channels and enhance the company's global brand influence [1] - The subscription for this issuance will be limited to qualified foreign investors and domestic qualified investors authorized to conduct overseas investments [1] Group 2 - If the H-share issuance is successfully implemented, it will not only optimize the company's capital structure but also support its business development in the semiconductor storage, analog, and mixed-signal chip sectors [2] - This move provides a new case for domestic companies listed on the Sci-Tech Innovation Board to explore overseas financing and offers international investors an opportunity to participate in the growth of China's semiconductor industry [2] - The company is aware of the related approval risks and market risks and will continue to fulfill its information disclosure obligations in accordance with laws and regulations [2]

证券日报网讯1月26日，聚辰股份在互动平台回答投资者提问时表示，一个DDR5内存条必须配备1颗 SPD芯片，SPD芯片是DDR5内存模组的通信中枢，其内置一颗SPD EEPROM，用于存储内存模组的相 关信息以及内存颗粒和其他组件的配置参数，并集成了I2C/I3C总线集线器和高精度温度传感器。 I2C/I3C总线集线器是系统主控设备与内存模组组件之间的通信中心，能够实现高效率的数据交换，从 而确保内存模组平稳运行并发挥最佳性能，而高精度温度传感器则可以连续监测SPD芯片所在位置的温 度，以便系统主控设备对内存模组进行温度管理，进而提高内存模组工作的稳定性。2024年公司 EEPROM市场份额排名全球第三、国内第一。 ...

Company Overview - Jucheng Semiconductor Co., Ltd. is a leading global designer of high-performance non-volatile memory (NVM) chips, focusing on meeting the storage demands of the AI era with products such as SPD chips, EEPROM, NOR Flash, camera motor driver chips, and NFC chips [4] - The product portfolio includes storage chips for various applications, mixed-signal chips, and other products, with a strong emphasis on AI infrastructure, automotive electronics, industrial control, and consumer electronics [4] Market Position - The company holds over 40% of the global DDR5 SPD chip market and 14% of the global EEPROM market by revenue, ranking as the third-largest EEPROM supplier globally and the largest in China for 2023 and 2024 [5] - By the end of 2025, the company will be the only Chinese supplier capable of providing a full range of automotive-grade EEPROM chips, leveraging its first-mover advantage and the trend of localization among domestic automakers [5] Industry Overview - The global non-volatile memory chip market size decreased from $65.5 billion in 2022 to $40 billion in 2023 due to oversupply, but is expected to rebound to $70.4 billion in 2024, with a compound annual growth rate (CAGR) of 3.8% from 2020 to 2024 [6][13] - The market is projected to reach $109.7 billion by 2030, driven by explosive growth in downstream markets such as AI servers, automotive electronics, and consumer electronics [6][13] Financial Performance - The company reported revenues of approximately 703.5 million RMB for 2023, projected to increase to 1.028 billion RMB in 2024, with a nine-month revenue of 769.1 million RMB for 2024 and 932.8 million RMB for 2025 [7][10] - Net profit for 2023 was approximately 82.7 million RMB, expected to rise to about 276 million RMB in 2024, with nine-month profits of approximately 204.3 million RMB for 2024 and 310.2 million RMB for 2025 [8][10] Integrated Circuit Market - The global integrated circuit market is expected to grow from $361.2 billion in 2020 to $539.5 billion in 2024, with a CAGR of 10.5% [11] - By 2030, the market is projected to reach $981.3 billion, driven by digital transformation and high-performance computing demands [11]

证券代码：688123 证券简称：聚辰股份 公告编号：2026-009 鉴于本次 H 股发行上市的认购对象仅限于符合相关条件的境外投资者，以 及依据中国有关法律法规有权进行境外证券投资的境内合格投资者，公司将不会 在境内证券交易所的网站和符合监管机构规定条件的媒体上刊登该申请资料，但 为使境内投资者及时了解该等申请资料披露的本次 H 股发行上市以及公司的其 他相关信息，现提供该申请资料在香港联交所网站的查询链接以供投资者查阅： 中文： https://www1.hkexnews.hk/app/sehk/2026/108134/documents/sehk26012600718 _c.pdf 英文： https://www1.hkexnews.hk/app/sehk/2026/108134/documents/sehk26012600719. pdf 聚辰半导体股份有限公司 关于向香港联合交易所有限公司递交 H 股发行及 上市申请并刊发申请资料的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 聚辰半导体股份有限公司（以 ...

据港交所1月26日披露，聚辰半导体股份有限公司(简称：聚辰股份(688123.SH))向港交所主板递交上市申请书， 中金公司（601995）为独家保荐人。 招股书显示，聚辰股份是全球领先的高性能非易失性存储(NVM)芯片设计公司，致力于满足人工智能时代高速 迭代与扩容的存储需求，为客户研发及供应SPD芯片、EEPROM及NORFlash等关键存储类芯片、摄像头马达驱 动芯片等混合信号类芯片以及NFC芯片及配套解决方案。根据弗若斯特沙利文的资料，于2023年及2024年，按 收入计，该公司是中国排名第一的EEPROM供应商以及全球排名第二的DDR5SPD芯片供应商。 ...

聚辰股份公告，公司已于2026年1月26日向香港联交所递交了在境外发行外资股（H股）并在香港联交 所主板上市的申请，并于同日在香港联交所网站刊登了本次H股发行上市的申请资料。该申请资料系公 司按照香港证监会及香港联交所的要求编制和刊发，为草拟版本，其所载资料可能会适时作出更新和修 订。 ...

据港交所1月26日披露，聚辰半导体股份有限公司(简称：聚辰股份(688123.SH))向港交所主板递交上市申请书， 中金公司为独家保荐人。 招股书显示，聚辰股份是全球领先的高性能非易失性存储(NVM)芯片设计公司，致力于满足人工智能时代高速 迭代与扩容的存储需求，为客户研发及供应SPD芯片、EEPROM及NORFlash等关键存储类芯片、摄像头马达驱 动芯片等混合信号类芯片以及NFC芯片及配套解决方案。根据弗若斯特沙利文的资料，于2023年及2024年，按 收入计，该公司是中国排名第一的EEPROM供应商以及全球排名第二的DDR5SPD芯片供应商。 ...

智通财经APP获悉，据港交所1月26日披露，聚辰半导体股份有限公司(简称：聚辰股份(688123.SH))向港交所主 板递交上市申请书，中金公司为独家保荐人。 招股书显示，聚辰股份是全球领先的高性能非易失性存储(NVM)芯片设计公司，致力于满足人工智能时代高速 迭代与扩容的存储需求，为客户研发及供应SPD芯片、EEPROM及NORFlash等关键存储类芯片、摄像头马达驱 动芯片等混合信号类芯片以及NFC芯片及配套解决方案。根据弗若斯特沙利文的资料，于2023年及2024年，按 收入计，该公司是中国排名第一的EEPROM供应商以及全球排名第二的DDR5SPD芯片供应商。 ...

据港交所文件，聚辰半导体股份有限公司向港交所提交上市申请书。 本文源自：金融界AI电报 ...

Group 1 - The company, 聚辰半导体股份有限公司, has submitted a listing application to the Hong Kong Stock Exchange [1] - This move indicates the company's intention to enter the public market and potentially raise capital for future growth [1] - The semiconductor industry continues to attract interest from investors, reflecting the sector's ongoing expansion and demand [1]