SHENGYI ELECTRONICS CO.(688183)

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生益电子(688183) - 2024 Q4 - 年度业绩预告
2025-01-23 08:25
Financial Performance Forecast - The company expects a net profit attributable to shareholders of the parent company for 2024 to be between 299.50 million and 358.10 million CNY, compared to a loss of 24.99 million CNY in 2023[2][3]. - The net profit after deducting non-recurring gains and losses is projected to be between 294.30 million and 352.90 million CNY for 2024, compared to a loss of 43.66 million CNY in the previous year[2][3]. Factors Influencing Performance - The significant improvement in performance is attributed to the optimization of product structure and enhanced regional business layout, driven by increased market demand for high-layer, high-precision, high-density, and high-reliability multilayer printed circuit boards[4]. Uncertainties and Assumptions - The company has not identified any major uncertainties that could affect the accuracy of the performance forecast as of the announcement date[5]. - The performance forecast is based on preliminary calculations by the finance department and has not been audited by registered accountants[6].
生益电子:生益电子关于发起设立产业基金暨关联交易的进展公告
2024-12-25 07:38
证券代码:688183 证券简称:生益电子 公告编号:2024-058 生益电子股份有限公司 关于发起设立产业基金暨关联交易的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 一、 发起设立产业基金暨关联交易概述 生益电子股份有限公司(以下简称"公司"或"生益电子")于 2024 年 10 月 15 日召开第三届董事会第十四次会议,审议通过了《关于发起设立产业基金暨 关联交易的议案》。公司拟与东莞科技创新金融集团有限公司及其关联企业合作 发起设立规模 1 亿元的产业基金,基金名称是东莞科创生益电子产业投资合伙企 业(有限合伙)(暂定名,最终以工商注册为准)。 生益电子拟以自有资金认缴出资 0.50 亿元,东莞市科创资本投资管理有限 公司拟认缴出资 0.01 亿元,东莞市创新创业投资母基金合伙企业(有限合伙) 拟认缴出资 0.30 亿元,东莞市国弘投资有限公司拟认缴出资 0.19 亿元。上述事 宜具体情况详见公司于 2024 年 10 月 16 日披露的《生益电子股份有限公司关于 发起设立产业基金暨关联交易的公告》( ...
生益电子:生益电子关于变更证券事务代表的公告
2024-12-23 07:54
本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 生益电子股份有限公司(以下简称"公司")原证券事务代表朱宝玲女士因 工作内部调整,不再担任公司证券事务代表职务,调整后仍在公司担任其他职务。 朱宝玲女士在担任证券事务代表期间,勤勉尽责、恪尽职守,认真履行职责,为 公司发展做出了积极贡献,公司及董事会对其在任职期间为公司所做出的贡献表 示衷心的感谢! 公司于2024年12月23日召开了第三届董事会第十八次会议,审议通过了《关 于变更证券事务代表的议案》,同意杭海梅女士(简历详见附件)为公司证券事务 代表,协助董事会秘书开展工作,任期自本次董事会审议通过之日起至公司第三 届董事会届满之日止。 杭海梅女士具备担任证券事务代表所需的专业知识、工作经验和相关素养, 其任职资格符合《中华人民共和国公司法》《上海证券交易所科创板股票上市规 则》等相关法律法规和规范性文件的规定。 证券事务代表联系方式如下: 联系地址:广东省东莞市东城区(同沙)科技工业园同振路33号 电子邮箱:bo@sye.com.cn 生益电子股份有限公司 关于变更证券事 ...
生益电子等在东莞成立产投合伙企业
Zheng Quan Shi Bao Wang· 2024-12-16 01:59
Group 1 - Dongguan Kechuang Shengyi Industrial Investment Partnership (Limited Partnership) has been established with a capital contribution of 100 million RMB, focusing on private equity investment, investment management, and asset management activities [1] - The enterprise is co-held by Shengyi Electronics (688183) and other stakeholders [2]
生益电子(688183) - 生益电子投资者关系活动记录
2024-12-13 08:21
Group 1: Company Overview - The company, Shengyi Electronics, reported a revenue of 3.179 billion yuan for the first three quarters of 2024, representing a year-on-year growth of 32.97% [2] - The net profit for the same period was 187 million yuan, marking a turnaround from a loss to profitability [2] Group 2: Performance Drivers - The increase in revenue and profit is attributed to the optimization of product structure and the expansion of business areas, driven by rising market demand for high-layer, high-precision, high-density, and high-reliability printed circuit boards [2] - The company's gross profit growth significantly contributed to the improvement in net profit [2] Group 3: R&D Investment - Shengyi Electronics increased its R&D investment to 199 million yuan in the first three quarters of 2024, a year-on-year increase of 41.69% [2] - R&D expenditure accounted for 6.26% of revenue, an increase of 0.39 percentage points compared to the previous year [2] - The main focus areas for R&D include communication networks, computers/servers, and automotive electronics [2]
生益电子拟约14亿元投建 智能算力中心电路板项目
Zheng Quan Shi Bao Wang· 2024-12-06 17:24
Investment Project - The company plans to invest approximately 1.4 billion yuan in the construction of a high-density interconnect circuit board project for smart computing power at its Dongguan manufacturing base [1] - The project will be implemented in two phases with a total construction period of 6 years, with the first phase expected to start trial production in 2025 and the second phase in 2027 [1] - The project aims to produce 250,000 square meters of high-density interconnect printed circuit boards annually, with 150,000 square meters in the first phase and 100,000 square meters in the second phase [1] - The dynamic investment payback period is 7 years after tax for the first phase and 5 years after tax for the second phase [1] Strategic Positioning and Market Prospects - The investment aligns with the company's focus on high-end printed circuit boards and will enhance its technological innovation capabilities in the smart computing power field [2] - The project is expected to expand the company's operational scale, improve specialized production lines, optimize product structure, and enhance core competitiveness [2] - The company believes the project has good market development prospects and will meet the medium- and long-term demand for high-end printed circuit boards in emerging fields [2] Financial Performance - In the first three quarters of 2024, the company achieved operating revenue of 3.179 billion yuan, a year-on-year increase of 32.97%, and a net profit of 187 million yuan, turning a loss into a profit [2] - The growth in performance is attributed to the optimization of product structure, improvement in regional business layout, and increased demand for high-layer, high-precision, high-density, and high-reliability multilayer printed circuit boards [2] Market Adaptation and Product Development - The company has actively responded to fluctuations in the communications industry by optimizing product structure and increasing efforts to develop new customers [3] - In the network sector, the company has secured batch orders for 800G high-speed switch products and is cooperating with customers on the development of next-generation products [3] - The company is leveraging opportunities brought by AI technology, with multiple AI server product projects achieving batch production and ongoing development of next-generation products [3] - Server products accounted for 42.45% of revenue in the first three quarters of 2024, a year-on-year increase of 20.87 percentage points [3]
斥资14亿元!生益电子拟投建智算中心高多层高密互连PCB项目 首期预计明年试生产
Cai Lian She· 2024-12-06 11:00AI Processing
《科创板日报》12月6日讯(记者 郭辉) 生益电子今日(12月6日)盘后公告14亿元的PCB项目投资计划。 生益电子在公告中表示,为更好地满足公司业务发展需要,该公司董事会充分调研并评估印制线路板行 业以及智能算力等领域市场需求、技术需求,决议在公司东莞制造基地现有厂房,投资智能算力中心高 多层高密互连电路板项目。 该项目计划投资金额约14亿元,资金将来自公司自有资金或自筹资金。 据了解,上述项目总建设期计划为6年,计划分两阶段实施。其中第一阶段预计在2025年试生产;第二 阶段预计在2027年试生产。 同时项目计划年产25万平方米的高多层高密互连印制线路板,其中第一期 计划年产15万平方米,第二期计划年产10万平方米。 项目第一阶段的动态投资回收期为税后7年,项目第二阶段的动态投资回收期为税后5年。生益电子表 示,从项目投资价值分析角度考虑,本项目具备可行性,且有助于提高公司经济效益。 生益电子称,项目建设投产能进一步扩大公司的高端产品产能,提升公司在智能算力领域的技术创新能 力,满足新兴领域对高端印制电路板的中长期需求。 本项目的实施将进一步完善专业化生产线,优化 产品结构,增强公司核心竞争力,提高经济效 ...
生益电子:生益电子关于投资智能算力中心高多层高密互连电路板项目的公告
2024-12-06 07:58
证券代码:688183 证券简称: 生益电子 公告编号:2024-056 生益电子股份有限公司 关于投资智能算力中心高多层高密互连电路板项目的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示: 敬请广大投资者理性投资,注意投资风险。 项目名称:智能算力中心高多层高密互连电路板项目。 投资金额:约14亿元人民币。 资金来源:公司自有资金或自筹资金。 建设周期:本项目计划分两阶段实施,本项目总建设期计划为6年。 相关风险提示: 1. 本项目投资总额较高,且资金来源为公司自有资金或自筹资金,因此本 项目的资金保障可能会受到公司经营情况的影响。 2. 本项目实施尚需政府立项核准及报备等工作,如因有关政策调整、项目 核准等实施条件因素发生变化,本项目的实施可能存在变更、延期、中 止或终止的风险。 3. 本项目建设期长,由于市场本身具有不确定因素,如果未来市场需求增 长不及预期,或业务推广进度、产品价格波动等与公司预期产生较大偏 差,本项目的实施也可能存在变更、延期、中止或终止的风险,同时也 有可能存在本项目全部实施 ...
生益电子20241130
电子商务和信息化司· 2024-12-02 06:51
Company and Industry Summary Company Overview - The company specializes in high-speed PCB manufacturing and was established in 1985, transitioning from a construction phase (1985-1989) to a development and expansion phase (1990-2007), and currently is in a high-quality development phase with production capacity increasing from 35,000 square meters to 350,000 square meters annually [1] Product Positioning - The company focuses on mid-to-high-end applications, with key products used in communication base stations, signal transmission devices, routers, switches, and servers [2] - The product structure includes various types of PCBs such as multi-layer boards, backplanes, and HDI boards, with applications in telecommunications, computing, consumer electronics, and automotive sectors [4][5] Financial Performance - In the first three quarters, the company reported a revenue growth of 33% year-over-year, with profits increasing significantly, achieving a gross margin of 11.7% and a net margin of 5.9% [3] Industry Insights - The PCB industry serves as a critical connector for electronic circuits, with a market size of approximately $9.9 billion [8] - The demand for PCBs is driven by sectors such as AI, big data, and the automotive industry, particularly with the rise of electric and smart vehicles [6][11] Market Trends - The AI server market is projected to exceed $11 billion by 2026, indicating a robust growth trend in the sector [8] - The telecommunications sector accounts for over 30% of PCB applications, with significant contributions from computing and consumer electronics [5] Competitive Landscape - The company has a competitive edge due to its 30 years of R&D experience, with over 200 patents and 19 industry standards established [13] - Key clients include major players like Huawei, ZTE, and Nokia, indicating strong market positioning [14] Future Outlook - The company anticipates continued growth in AI server demand and is well-positioned to expand its production capabilities, particularly with the upcoming launch of new facilities [15] - The automotive sector is expected to see increased demand for high-end PCBs, driven by advancements in electronic systems [12] Additional Considerations - The company has a strong focus on high-layer count PCBs, with capabilities to produce boards with up to 46 layers for high-end servers [7] - The market for switches is expected to reach $91.5 billion by 2025, with Cisco and Huawei being dominant players [10]
生益电子:深耕数通,蓄势待发
Changjiang Securities· 2024-11-29 03:25
Investment Rating - Buy rating, first coverage [5] Core Views - The company, established in 1985, has grown into a leading enterprise in China's PCB industry, focusing on communication networks, computer/server, and automotive electronics sectors, while also catering to high-difficulty and high-demand special products [3][5] - According to Prismark's Q1 2024 PCB industry report, the company ranked 45th in global PCB industry revenue in 2023 [3][5] - The company has a strong technical capability, equipment configuration, and customer resources, positioning it well in the high-end PCB market [3][5] PCB Industry Overview - PCB is a critical interconnect component in electronic devices, widely used in communication electronics, consumer electronics, computers, automotive electronics, industrial control, medical devices, and aerospace [6] - Global PCB output value has shown a steady upward trend, with a CAGR of around 5% from 2017 to 2022 [6] - The trend towards thinner, smaller, and higher-frequency electronic products is driving the PCB industry towards higher density and performance [6] Automotive Electronics - The automotive industry is moving towards electrification, intelligence, and connectivity, increasing the demand for high-reliability PCBs in automotive electronics [6] - Automotive PCBs require rigorous testing and certification, often taking 1-3 years to pass supplier qualification [6] - With the rise of autonomous driving and new energy vehicles, automotive PCBs are evolving towards multi-layer, high-density interconnect (HDI), and high-frequency high-speed directions [6] Data Communication and AI Servers - The AI industry is experiencing rapid growth, driving demand for AI servers and high-speed network systems, which in turn increases the demand for large-size, high-speed, and multi-layer PCBs [7] - High-end servers typically require PCBs with 46 layers, high aspect ratios, high density, and high transmission speeds [7] - The company has developed AI-related products, including motherboards and accelerator cards, which have entered mass production, with key customers such as Amazon [7] Company's Technological Leadership - The company has over 30 years of R&D investment and technical accumulation, with leading technology in the PCB industry [7] - It can produce backplanes with 2-56 layers and server boards with 20-40 layers, and has the capability to produce HDI boards with 4-30 layers [7] - The company has successfully developed server customers, including Amazon, and its AI-related projects are in mass production [7] Financial Performance - In the first three quarters of 2024, the company achieved revenue of 3.179 billion yuan, a year-on-year increase of 32.97%, and net profit of 187 million yuan, a year-on-year increase of 1156.98% [51] - The gross profit margin and net profit margin were 21.68% and 5.87%, respectively, showing significant improvement in profitability [51] Future Outlook - The company is focusing on AI and high-performance computing, with ongoing projects in advanced data communication fields [141] - With the expansion of production capacity, the company is expected to further increase its market share in AI-related products [141] - The company's AI server projects are expected to continue growing in 2024, driven by increasing demand for AI products [141]