Core Viewpoint - The company, Shengyi Electronics, is planning a private placement to raise up to 2.6 billion yuan to enhance its capabilities in AI and high-end PCB production, reflecting its strategic shift towards AI-driven technologies and products [2][3]. Group 1: Fundraising and Investment Plans - Shengyi Electronics intends to issue up to 125 million shares in a private placement, aiming to raise no more than 2.6 billion yuan, with net proceeds allocated to AI computing HDI production base, smart manufacturing of high-layer circuit boards, and debt repayment [3]. - This marks the first refinancing plan since the company's IPO in early 2021, indicating a strategic move to strengthen its technological and financial capabilities amid the AI wave [3]. - The company has a remaining balance of 475 million yuan from its previous fundraising, which will be utilized according to project progress [3]. Group 2: Financial Performance - For the first three quarters of 2025, Shengyi Electronics reported a revenue of 6.829 billion yuan, a year-on-year increase of 114.79%, and a net profit attributable to shareholders of 1.115 billion yuan, up 497.61% [6][7]. - The company's R&D investment reached 327 million yuan, reflecting a 64.26% increase year-on-year, constituting 4.78% of its revenue [5][6]. Group 3: Market and Industry Context - The AI server market is expected to see significant demand growth, with Shengyi Electronics poised to benefit from this trend through its strategic investments in high-value PCB products [4][5]. - The company has established a solid technical foundation with 1,759 technical personnel, representing 23.25% of its total workforce, which supports ongoing innovation [5][6]. - The PCB industry is experiencing an upward trend due to the rapid expansion of AI technologies, data centers, and electric vehicle advancements, presenting strategic opportunities for Shengyi Electronics [5][4]. Group 4: Future Outlook - Shengyi Electronics plans to invest 2.032 billion yuan in the AI computing HDI production base, targeting an annual production capacity of 167,200 square meters, and 1.937 billion yuan in smart manufacturing of high-layer circuit boards, aiming for 700,000 square meters of annual capacity [4]. - The company aims to leverage new technological revolutions and industry transformations to achieve high-quality development in the coming years [7].

Group 1 - Shengxin Lithium Energy signed a framework agreement with Huayou Cobalt for the procurement of 221,400 tons of lithium salt products over five years [1] - Wehua New Materials' subsidiary plans to acquire 70% of He Yutai for 154 million yuan [1] - Xiamen Tungsten plans to invest 600 million yuan to establish a wholly-owned subsidiary for a project with an annual production capacity of 50,000 tons of high-performance battery materials [1][2] Group 2 - *ST Songfa's subsidiary signed a shipbuilding contract worth approximately 200-300 million USD for two VLCCs [3] - Hailianxun's stock will resume trading on November 19 after the end of the acquisition request period [5] - Yunnan Energy Investment obtained the development rights for a 25,000 kW wind power project [7] Group 3 - China Resources Double Crane's subsidiary received a drug registration certificate for Oxcarbazepine tablets [8] - Jincheng Pharmaceutical's subsidiary received a CEP certificate for glutathione raw materials [9] - Jinkong Electric plans to transfer 51% of Tongying Thermal Power to an affiliate for 266 million yuan [9] Group 4 - Clean Technology's subsidiary won a bid for a waste incineration power generation project in Thailand with a total investment of up to 4.27 million USD [12] - Tonglian Precision's shareholders set the transfer price for shares at 43.67 yuan each [13] - Hu Nong Commercial Bank's executives collectively purchased 259,100 shares of the company [13] Group 5 - Huatai Medical's subsidiary obtained a medical device registration certificate for polyethylene embolization microspheres [13] - Fosun Pharma's subsidiary's drug registration application was accepted by the National Medical Products Administration [13] - Xianhui Technology signed contracts worth 796 million yuan with multiple subsidiaries of CATL [15] Group 6 - Ningbo Fangzheng signed a strategic cooperation agreement with Huaxiang Qiyuan for the development of various robotic technologies [15] - Ruida Futures' vice president resigned for personal reasons [16] - Samsung Medical is expected to win contracts worth approximately 125 million yuan from the State Grid [17] Group 7 - Tianjin Pharmaceutical's injectable methylprednisolone sodium succinate received registration from Panama's Ministry of Health [19] - Yaxing Anchor Chain plans to invest up to 300 million yuan in a project for deep-sea floating equipment [20] - Zejing Pharmaceutical's clinical trial for ZG006 was approved by the National Medical Products Administration [21] Group 8 - Weiye Co., Ltd. won a bid for a project worth approximately 2.086 billion yuan [23] - Ruimao Tong plans to sell 8.5794 million repurchased shares [25] - Guangge Technology's shareholders plan to reduce their holdings by up to 3.99% [26] Group 9 - Hongsheng Development signed a debt restructuring contract for a total of 2 billion yuan [27][28] - Yatai Co., Ltd. plans to reduce its holdings by up to 1% [30] - Dexin Technology's shareholder plans to reduce its holdings by up to 1% [31] Group 10 - Yaji International's shareholder plans to reduce its holdings by up to 1% [33] - Shenzhen New Star's subsidiary received approval for trial production of a boron trifluoride project [35] - Shengyi Electronics plans to raise up to 2.6 billion yuan through a private placement [36]

Core Viewpoint - The company plans to raise up to 2.6 billion yuan through a private placement to fund the construction of AI computing HDI production base and smart manufacturing high-layer circuit board projects, as well as to supplement working capital and repay bank loans [1][2]. Group 1: Fundraising and Projects - The total investment for the AI computing HDI production base project is estimated at 2.032 billion yuan, with 1 billion yuan from the raised funds, a construction period of 36 months, and production expected to start in the third year, reaching full capacity by the fifth year, with an annual capacity of 167,200 square meters [1]. - The smart manufacturing high-layer circuit board project has a total investment of 1.937 billion yuan, with 1.1 billion yuan from the raised funds, divided into two phases over 30 months, with production starting in the second year and reaching full capacity by the fourth year, targeting an annual capacity of 700,000 square meters [1]. Group 2: Financial Performance - In Q3, the company reported a revenue of 3.06 billion yuan, a year-on-year increase of 153.71%, which is approximately 81% of the first half's revenue; net profit attributable to shareholders was 584 million yuan, up 545.95% year-on-year, exceeding the first half by 54 million yuan [2]. - The increase in high-value-added products has strengthened the company's competitive advantage in the mid-to-high-end market, contributing to significant growth in revenue and net profit compared to the previous year [2]. Group 3: Short-term Financial Pressure - Despite strong performance, the company faces short-term financial pressure, with cash increasing from 410 million yuan at the end of last year to 681 million yuan; accounts receivable rose from 1.747 billion yuan to 3.363 billion yuan [2]. - Short-term borrowings have also significantly increased from 1.073 billion yuan to 2 billion yuan since the end of last year [3].

【国产替代之光，科创自立自强】 科技摩擦背景下，信息安全、产业安全重要性凸显。AI作为核心技术，实现自主可控至关重要。科创 人工智能ETF（589520）及其联接基金（联接A：024560，联接C：024561）重点布局国产AI产业链、 具备较强国产替代特点，成份股均为细分环节收入最大或卡位最好的公司，受益于端侧芯片/软件AI化 进程提速。相较直接投资科创板个股，ETF能够低门槛布局，并且20%涨跌幅限制，在行情爆发时效率 更高。前十大重仓股权重占比超七成，第一大重仓行业半导体占比超一半，集中度高，具备较强进攻 性。 数据来源于沪深交易所、公开资料等。 风险提示：以上产品由基金管理人发行与管理，代销机构不承担产品的投资、兑付和风险管理责任。投 资人应当认真阅读《基金合同》、《招募说明书》、《基金产品资料概要》等基金法律文件，了解基金 的风险收益特征，选择与自身风险承受能力相适应的产品。基金过往业绩并不预示其未来表现，基金投 资须谨慎！销售机构（包括基金管理人直销机构和其他销售机构）根据相关法律法规对本基金进行风险 评价，投资者应及时关注基金管理人出具的适当性意见，各销售机构关于适当性的意见不必然一致，且 基金 ...

Core Insights - The Sci-Tech Innovation Board (STAR Market) has become a key indicator of the performance and development trends of "hard technology" enterprises in China, with significant growth in R&D investment and net profit [1][2]. Group 1: Performance Metrics - As of November 13, 592 companies on the STAR Market reported a total R&D investment of nearly 120 billion yuan and total revenue exceeding 1.1 trillion yuan for the first three quarters, with a net profit growth of 75% year-on-year in Q3 [1]. - For the first three quarters of 2025, STAR Market companies achieved a revenue of 1,105 billion yuan, a year-on-year increase of 7.9%, and a net profit of 49.27 billion yuan, up 8.9% year-on-year [2]. - Over 70% of STAR Market companies reported revenue growth, and nearly 60% reported net profit growth, with 158 companies seeing net profit increases exceeding 50% [2]. Group 2: R&D Investment - The total R&D investment for STAR Market companies reached 119.75 billion yuan, which is 2.4 times the net profit, with a median R&D intensity of 12.4%, leading all A-share sectors [4]. - The "1+6" reform initiated in June aims to support unprofitable tech companies, with 35 such companies showing promising development by prioritizing R&D [4]. Group 3: Sector Performance - The integrated circuit sector saw 121 related companies on the STAR Market achieve a revenue growth of 25% and a net profit growth of 67% in the first three quarters [6]. - The artificial intelligence sector has emerged as a new growth pillar, with companies like Cambrian and Haiguang Information reporting revenue increases of nearly 24 times and 55%, respectively [6]. - The biopharmaceutical sector experienced a revenue growth of 11% and a net profit growth of 48%, with nine new drugs approved for market and significant international business development [7].

Core Viewpoint - Shengyi Electronics (688183.SH) has announced a plan to issue A-shares to specific investors in 2025, aiming to raise up to RMB 260 million for various projects and working capital [1][2]. Group 1: Share Issuance Details - The issuance will target no more than 35 specific investors, including various financial institutions and qualified investors, with all subscriptions made in RMB cash at the same price [1]. - The shares will be RMB ordinary shares with a par value of RMB 1.00, and the total number of shares issued will not exceed 15% of the company's total share capital prior to the issuance, amounting to a maximum of 124,773,176 shares [2][3]. - The issuance price will be no less than 80% of the average trading price over the 20 trading days prior to the pricing date [1]. Group 2: Fund Utilization - The total investment for the projects funded by the issuance is estimated at RMB 446.93 million, with the following allocations: - RMB 100 million for the AI computing HDI production base project [3]. - RMB 110 million for the smart manufacturing high-layer computing circuit board project [3]. - RMB 50 million for working capital and bank loan repayment [3]. - The net proceeds after deducting issuance costs will be used for the above projects and to supplement working capital [2]. Group 3: Financial Performance - For the third quarter of 2025, the company reported a revenue of RMB 3.06 billion, a year-on-year increase of 153.71%, and a net profit attributable to shareholders of RMB 584 million, up 545.95% [5][6]. - Year-to-date revenue reached RMB 6.83 billion, reflecting a growth of 114.79%, with a net profit of RMB 1.11 billion, an increase of 497.61% [6][7].

抓住AI浪潮、加码布局高端产能，正成为PCB（印制电路板）行业头部企业的共同举措。 11月17日晚间，生益电子（SH688183，股价93.40元，市值776.92亿元）公告宣布，拟定增不超过26亿 元投向人工智能计算HDI生产基地建设项目、智能制造高多层算力电路板项目等。 《每日经济新闻》记者注意到，生益电子是一家印制电路板（PCB）企业，于2021年2月上市，这是该 企业上市以来的首次股权再融资。此外，生益电子股价在今年取得较大增长，截至11月17日收盘，其年 内涨幅约140%。 PCB被誉为"电子产品之母"，主要由覆铜板（CCL）、铜箔、玻纤布、树脂等化学材料构成，伴随着AI 算力需求的井喷，PCB产业也搭上了AI的快车，相关公司业绩、股价大幅增长。 生益电子宣布定增扩产的背后，是不可忽视的行业扩产热潮，头部企业们纷纷宣布加码产能建设。据万 联证券统计，包括胜宏科技、深南电路、东山精密等公司均抛出扩产计划。 宣布定增26亿元扩产 市值超过700亿元的PCB行业龙头生益电子，在11月17日晚间抛出定增预案，拟向特定对象发行股票募 集资金总额不超过26亿元，扣除发行费用后的募集资金净额拟投资于人工智能计算H ...

Core Viewpoint - The PCB industry is experiencing a significant expansion driven by the AI wave, with leading companies like Shengyi Electronics planning substantial investments in high-end production capacity to meet the growing demand for AI-related products [1][2]. Group 1: Company Actions - Shengyi Electronics announced a plan to raise up to 2.6 billion yuan through a private placement to fund the construction of an AI computing HDI production base and a smart manufacturing high-layer circuit board project [2]. - The AI computing HDI production base project has a total investment of 2.032 billion yuan, with 1 billion yuan allocated from the raised funds, aiming for an annual production capacity of 167,200 square meters [2]. - The smart manufacturing high-layer circuit board project has a total investment of 1.937 billion yuan, with 1.1 billion yuan from the raised funds, targeting an annual production capacity of 700,000 square meters [2]. Group 2: Industry Trends - The demand for HDI boards is expected to grow rapidly, with AI-related HDI boards projected to be one of the fastest-growing segments in the PCB market over the next five years [3]. - The PCB industry is becoming increasingly competitive, with major players like Shenghong Technology and Dongshan Precision also announcing expansion plans to enhance their production capabilities [4][5]. - The industry is shifting towards larger and more concentrated market structures, with leading companies leveraging technological innovation and scale expansion to strengthen their market influence [5].

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688183 证券简称：生益电子 公告编号：2025-074 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性承担法律责任。 根据中国证券监督管理委员会印发的《监管规则适用指引——发行类第7号》，生益电子股份有限公司 （以下简称"公司"、"本公司"或"生益电子"）编制了截至2025年9月30日止前次募集资金使用情况的报 告。 注2：广发银行股份有限公司东莞城区支行银行账户9550881681686868836系吉安生益电子有限公司于 2022年1月27日开立用于"吉安工厂（二期）多层印制电路板建设项目"的募集资金专项账户。2025年3月 26日经第三届董事会第二十一次会议及第三届监事会第十二次会议审议同意，2025年5月12日经2024年 年度股东大会审议同意，"吉安工厂（二期）多层印制电路板建设项目"的募集资金全部变更用于"智能 算力中心高多层高密互连电路板项目一期"。因涉及募集资金投资项目变更和项目实施主体变更，于 2025年6月20日公司、公司全资子公司吉安生益电子有限公司、保 ...

| | | | 里位: | | --- | --- | --- | --- | | 序号 | 项目名称 | 项目总投资金额 | 拟投入募集资金金额 | | | 人工智能计算 HDI 生产基地建设项目 | 203,204.47 | 100,000.00 | | 2 | 智能制造高多层第力电路板项目 | 193,724.64 | 110,000.00 | | ਤੇ | 补充流动资金和偿还银行贷款 | 50,000.00 | 50,000.00 | | | 合计 | 446,929.11 | 260.000.00 | 智能制造高多层算力电路板项目预计总投资19.37亿元 ，拟使用募集资金11亿元，项目分两阶段建设，规划建设期合计30个月，第一阶段于第二年开始试生 产，至第三年达产；第二阶段于第三年开始试生产，至第四年达产。实施主体为吉安生益，地点位于江西省吉安市，拟建设生产高多层板，计划年产能70万平 方米。 据悉，AI算力需求的指数级增长有力地带动了AI服务器与数据中心市场规模的急剧扩张。其中，对HDI板的需求将格外突出。预计在未来五年，AI用HDI板将成 为PCB市场中增长最快的细分品类之一，尤其是4阶及以上的 ...