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展台直击!36家械企亮点速览 | 2025医学装备大会
思宇MedTech· 2025-03-18 10:14
合作伙伴征集:2025全球手术机器人大会 报名:首届全球眼科大会 | 暂定议程 报名:首届全球心血管大会 | 奖项报名倒计时 报名:首届全球骨科大会 | 奖项报名倒计时 2025年3月15日上午,2025中国医学装备大会在重庆悦来国际会议中心成功召开。相关政府部门领导、知名院士、医疗机构专家,研发生产企业、高校、科 研院所、投融资机构负责人等嘉宾出席大会。 中国医学装备协会理事长 侯岩介绍, 2024年中国医学装备市场规模达到 1.35万亿 元,同比增长 6% 左右 。据了解,目前我国已形成22个大类1100多个 品类的产品体系,是世界上产品类别和品种最齐全的国家之一,产品广泛服务于临床应用,覆盖卫生健康各个领域。 目前大会已圆满落幕。本届展会中,哪些企业凭借创新亮相引起了行业关注?又有哪些前沿产品和技术成为焦点?思宇将全面回顾展会精彩亮点,供各位读 者参考。 # 美敦力 美敦力在本届大会上展出 近80款 全球创新产品, 包括 全球首发的PulseSelect一次性心脏脉冲场消融导管 ,以及多款前沿技术产品, 其中不乏首次展出及近 期获批的产品和技术。 其中包括中国首款获批的 PulseSelect一次性心脏 ...
神工股份业绩快报:2024年净利润4136.39万元 同比扭亏
Core Insights - The company reported a significant increase in total operating revenue and net profit for the fiscal year 2024, indicating a strong recovery and growth in its financial performance [1] Financial Performance - The total operating revenue for 2024 reached 303 million yuan, representing a year-on-year growth of 124.17% [1] - The net profit attributable to the parent company was 41.36 million yuan, a turnaround from a loss of 69.11 million yuan in the previous year [1] - The basic earnings per share stood at 0.24 yuan [1] Market Dynamics - The company capitalized on the recovery in demand for large-diameter silicon materials and the increased demand for silicon components, leading to a strategic adjustment in its product structure [1]
神工股份(688233) - 2024 Q4 - 年度业绩
2025-02-21 07:50
Financial Performance - The company achieved a total operating revenue of 30,270.01 million RMB, representing a year-on-year increase of 124.17%[3] - The net profit attributable to the parent company was 4,136.39 million RMB, a significant turnaround from a loss of 6,910.98 million RMB in the previous year[5] - The net profit attributable to the parent company after deducting non-recurring gains and losses was 3,885.61 million RMB, compared to a loss of 7,155.53 million RMB last year[5] - Basic earnings per share increased to 0.24 RMB from a loss of 0.43 RMB per share in the previous year[3] - The weighted average return on equity improved to 0.02%, an increase of 4.33 percentage points from -4.31%[3] Assets and Equity - Total assets at the end of the reporting period were 198,877.98 million RMB, a year-on-year growth of 2.86%[5] - Equity attributable to the parent company reached 179,317.46 million RMB, reflecting a year-on-year increase of 1.78%[5] - The net asset value per share attributable to the parent company was 10.53 RMB, up 1.78% from the previous year[4] Market Strategy - The company adjusted its product structure to capture the recovering demand in the downstream market for large-diameter silicon materials, contributing to significant revenue and profit growth[5] Audit Status - The financial data presented is preliminary and has not been audited, with final results to be confirmed in the annual report[8]
神工股份(688233) - 2024 Q4 - 年度业绩预告
2025-01-24 10:05
Financial Projections - The company expects to achieve an annual revenue of between 270 million to 300 million yuan in 2024, representing a year-on-year increase of 134.97 million to 164.97 million yuan, or a growth of 100% to 122%[3]. - The projected net profit attributable to the parent company for 2024 is between 30 million to 36 million yuan, marking a turnaround from a loss in the previous year, with an increase of 99.11 million to 105.11 million yuan compared to the last year[4]. - The net profit attributable to the parent company, excluding non-recurring gains and losses, is expected to be between 27 million to 33 million yuan, an increase of 98.55 million to 104.55 million yuan year-on-year[5]. Previous Year Performance - In the previous year, the company reported a revenue of 135.03 million yuan and a net loss attributable to the parent company of 69.11 million yuan[6]. Performance Improvement Factors - The significant improvement in performance is attributed to the recovery of downstream market demand and the enhancement of new demand, leveraging the company's technological advantages[7]. Forecast Accuracy and Disclosure - The earnings forecast has not been audited by a registered accountant, and the company confirms there are no significant uncertainties affecting the accuracy of this forecast[8]. - Investors are advised to note that the forecast data is preliminary and the final audited financial data will be disclosed in the official annual report for 2024[9].
神工股份:锦州神工半导体股份有限公司关于部分募集资金账户注销的公告
2024-12-13 08:25
证券代码:688233 证券简称:神工股份 公告编号:2024-062 锦州神工半导体股份有限公司 关于部分募集资金账户注销的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 (www.sse.com.cn)的《锦州神工半导体股份有限公司关于开设募集资金专项账 1 户并签订募集资金专户监管协议的公告》。前述协议与上海证券交易所《募集资 金专户存储三方监管协议(范本)》不存在重大差异。 一、募集资金基本情况 经中国证券监督管理委员会出具的《关于同意锦州神工半导体股份有限公司 向特定对象发行股票注册的批复》(证监许可[2023]2051号),锦州神工半导体 股份有限公司(以下简称"公司"或"神工股份"),向特定对象非公开发行 10,305,736股股票,募集资金总额为人民币299,999,974.96元,扣除各项不含税 发行费用人民币3,943,396.22元后,实际募集资金净额为人民币296,056,578.74 元,上述资金已全部到位。容诚会计师事务所(特殊普通合伙)对公司本次公开 发行新股的资金到位情况进行了审验,并 ...
神工股份:国泰君安证券股份有限公司关于锦州神工半导体股份有限公司2024年度持续督导定期现场检查报告
2024-12-13 07:35
国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 2024 年度持续督导定期现场检查报告 国泰君安证券股份有限公司(以下简称"保荐机构")作为正在履行锦州神 工半导体股份有限公司(以下简称"神工股份"或"公司")持续督导工作的保 荐机构,根据《上海证券交易所科创板股票上市规则》、《上海证券交易所上市公 司自律监管指引第 11 号——持续督导》等有关法律、法规的规定,对公司 2024 年 1 月 1 日至本次现场检查期间(以下简称"本持续督导期间")的规范运作情 况进行了现场检查,现就现场检查的有关情况报告如下: 一、本次现场检查的基本情况 (一)保荐机构 国泰君安证券股份有限公司 (二)保荐代表人 姚巍巍、陈海 (三)现场检查时间 2024 年 12 月 9 日 (六)现场检查手段 1、查看公司主要生产经营场所; 2、与公司董事、监事、高级管理人员及相关人员进行访谈; 3、查阅公司本持续督导期间召开的历次三会文件; 4、查阅公司募集资金台账、募集资金使用凭证、募集资金专户银行对账单 等资料; (四)现场检查人员 姚巍巍 (五)现场检查内容 公司治理和内部控制、信息披露、独立性、与大股东及其他关联方的资 ...
神工股份(688233) - 锦州神工半导体股份有限公司2024年11月第二场投资者关系活动记录表
2024-11-27 07:35
编号:2024-004 证券代码:688233 证券简称:神工股份 锦州神工半导体股份有限公司投资者关系活动记录表 | --- | --- | --- | --- | |-----------------|------------------------------|--------------------------------------|--------------------------------------------------------------------------------| | | | | | | | √ | 特定对象调研 □分析师会议 | | | 投资者关系 | | □媒体采访 □业绩说明会 | | | | □ | 新闻发布会 □路演活动 | | | 活动类别 | √ | 现场参观 □一对一沟通 | | | | □其他 (电话会议) | | | | 参与单位 及人员 | UBS-Jimmy Yu | | GaoTeng Global Asset Management Limited -Junjie Zhang | | | UG Investment-Kevin Yang | | ...
神工股份(688233) - 锦州神工半导体股份有限公司2024年11月投资者关系活动记录表
2024-11-15 09:22
证券代码:688233 证券简称:神工股份 编号:2024-003 锦州神工半导体股份有限公司投资者关系活动记录表 | --- | --- | --- | --- | |------------|----------------------|--------------------------------|--------------------------------------------------------------------| | | √ | 特定对象调研 □分析师会议 | | | 投资者关系 | | □媒体采访 □业绩说明会 | | | | □ | 新闻发布会 □路演活动 | | | 活动类别 | □ | 现场参观 √一对一沟通 | | | | √ 其他 (电话会议) | | | | | 诺安基金-周小琪 | | 富国基金-孙权 | | | | | | | | 千禾基金-孙柯 | | 富国基金-王帅 | | | | | | | | 民生加银-李君海 | | 兴业基金-刘体劲 | | | 泰康资产 - 段中喆 | | 中庾基金-陆伟成 | | | 银华基金-张晏铭 | | 永盈基金-任思儒 | ...
神工股份:锦州神工半导体股份有限公司关于股份回购实施结果暨股份变动的公告
2024-10-31 14:20
证券代码:688233 证券简称:神工股份 公告编号:2024-061 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示: | 回购方案首次披露日 | 2023/8/18,由董事长潘连胜先生提议 | | --- | --- | | 回购方案实施期限 | 待第二届董事会第十五次会议审议通过后 12 个月 | | 预计回购金额 | 1,500.00 万元~3,000.00 万元 | | 回购价格上限 | 44.00 元/股 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 实际回购股数 | 95.0416 万股 | | 实际回购股数占总股本比例 | 0.5579% | | 实际回购金额 | 2,859.54 万元 | | 实际回购价格区间 | 14.70 元/股~35.12 元/股 | 一、 回购审批情况和回购方案内容 公司于 2023 年 10 月 27 日召开第二届董事会第十五次 ...
神工股份(688233) - 锦州神工半导体股份有限公司2024年第三季度报告投资者关系活动记录表
2024-10-30 10:19
Group 1: Financial Performance - The company's Q3 2024 revenue reached 88.89 million yuan, a year-on-year increase of approximately 120.32% and a quarter-on-quarter increase of about 32.87% [2] - Cumulative revenue for the first three quarters of 2024 amounted to approximately 214 million yuan, reflecting a year-on-year increase of about 79.65% [2] - The net profit attributable to shareholders for Q3 2024 was 22.72 million yuan, marking the third consecutive quarter of profitability, with a total net profit of approximately 27.49 million yuan for the first three quarters [2] Group 2: Market and Industry Trends - The semiconductor industry is gradually recovering from a low point, driven by increasing customer demand and a growing domestic semiconductor supply chain [2] - The current market competition is characterized by high capital, technical, and market barriers, with no significant changes in the number of domestic manufacturers of semiconductor-grade large-diameter silicon materials and silicon components [3] - The semiconductor industry's upward trend is primarily driven by substantial investments from downstream enterprises rather than traditional consumer electronics [3] Group 3: Business Growth and Strategy - The growth in the silicon components business is attributed to sales to domestic markets, particularly to plasma etching machine manufacturers and integrated circuit manufacturers [2] - The company has a unique integrated capability in "materials + processing," providing strong control over quality, cost, and R&D, which contributes to its long-term competitive advantage [3] - The management will closely monitor downstream demand changes to consolidate its existing advantages in the current structural market conditions [4] Group 4: Future Outlook - The global semiconductor sales are projected to grow by 20% in 2024, with a more modest growth of 10% when excluding bulk memory chips, and only 3% when excluding AI-related products [3] - The company is expected to benefit from both domestic and international investment drivers, with its large-diameter silicon materials business tapping into overseas markets and its silicon components business focusing on local market expansion [3]