作者 | 弗雷迪 数据支持 | 勾股大数 据（www.gogudata.com） 上月末，由于难以解决巨额债务问题，全球 SiC （碳化硅）巨头 Wolfspeed 宣布准备在几周内申请破产。 先发优势并不代表企业护城河坚不可摧。在国产厂商的奋力追赶下，部分企业的市场份额已经能够望其项背。 最后一个靴子落地，随着供应链重新洗牌， SiC 衬底行业有望走出价格低迷的阴霾，竞争格局或将重塑。 对于技术工艺实力领先的国内企业如天岳先进、天科合达，随着产能供需逐渐走向平衡，争夺行业话语权的机会或在酝酿之中。 01 激进扩产埋下危机 Wolfspeed 的高光时刻发生在 2021 年，那年 10 月之前还叫做 Cree ，而 Wolfspeed 作为后者的三大部门之一，主要从事第三代半导体 业务。 成立于 1987 年的 Cree ，在上世纪 90 年代是全球最大的蓝光 LED 芯片制造商， 1991 年就已推出全球首片商业化碳化硅晶圆，一举奠定 行业鼻祖地位。 2011 年， Wolfspeed 率先推出全球第一款 SiC MOSFET ，在行业内树立起技术标杆。 但另外两个业务（ LED 芯片和组件、照明系统及灯具 ...

Group 1 - Tianyue Advanced's stock closed at 60.00 yuan, down 3.07%, currently below its issuance price of 82.79 yuan per share [1] - The company was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on January 12, 2022, with a total of 42.9711 million shares issued [1] - The total funds raised from the initial public offering amounted to 3.558 billion yuan, with a net amount of 3.203 billion yuan after deducting issuance costs, exceeding the original plan by 1.203 billion yuan [1] Group 2 - On March 4, 2025, Tianyue Advanced disclosed that its application for issuing overseas listed shares (H-shares) was accepted by the China Securities Regulatory Commission [2] - The company submitted its application for H-share listing on February 24, 2025, to the Hong Kong Stock Exchange [2] - The issuance is subject to approval from various regulatory bodies, including the China Securities Regulatory Commission and the Hong Kong Stock Exchange, indicating uncertainty in the process [2]

Investment Rating - The report assigns a "Buy" rating to SICC (688234.SS) with a 12-month price target of Rmb75.50, indicating an upside potential of 24.7% from the current price of Rmb60.55 [10]. Core Insights - The management of SICC is optimistic about market demand driven by the increasing launch of 800V electric vehicles (EVs) and the growing need for EV fast charging. Additionally, the demand for SiC substrates in augmented reality (AR) glasses is expected to rise significantly [1][3]. - SICC is positioned well within the AD/ADAS trend, enhancing SiC's penetration in the EV market. The company is a local leader in SiC substrates, benefiting from local car OEMs diversifying their supply chains amid geopolitical tensions [1][3]. Summary by Sections Capacity Expansion - SICC's production facilities are located in Shanghai and Jinan, China. The Shanghai plant has a capacity of 300k units per year for phase 1 (6-inch or 8-inch SiC substrate) and an additional 300k units per year in phase 2, primarily for 8-inch SiC substrate. The Jinan site has a capacity of 100-150k units per year for 6-inch SiC substrate. The company plans to expand its 8-inch capacity to non-China markets to increase its market share among global SiC device manufacturers [2]. SiC Penetration in EVs - Management anticipates that the penetration rate of SiC in mainstream EV models will continue to rise as more 800V EV models are introduced in the coming years. The localization trend of SiC substrates is expected to support the company's growth, as local suppliers offer more cost-effective products, allowing customers to diversify their supply chains [3]. SiC Application in AR Glasses - SiC is identified as the optimal solution for AR glasses due to its superior reflection control and lightweight properties. Management projects that the demand for SiC substrates from AR glasses may eventually surpass that from EVs in the long term, presenting significant upside potential for SICC [7].

行情速递 ① 主板领涨， 格尔软件(+10.01%)/旭光电子(+8.33%)/宝明科技(+8.03%)/梦网科技(+3.68%)/ 金海通(+3.53%)/ ②创业板领涨， 东土科技(+13.22%)/富乐德(+10.67%)/弘景光电(+8.76%)/ ③科创板领涨， 映翰通 (+8.09%)/品高股份 (+7.26%)/艾森股份(+4.15%)/ ④活跃子行业， SW其他通信设备(+2.71%)/SW电子化学品Ⅲ (+0.06%)/ 国内新闻 ① 艾邦半导体网，株洲中车表示/株洲三期于2024年11月份启动建设/2025 年5月/主体厂房封顶/预计2025年下半年启动设备搬入/2025年底有望实现 产线拉通/该项目为8英寸SiC晶圆/ ② 半导体产业纵横，国科微发布公告称/公司正筹划通过发行股份及支付现 金等方式购买资产/并募集配套资金/交易标的为一家从事特种工艺半导体晶 圆代工及定制化芯片代工业务的企业/ ③ 半导体投资联盟，联想公布2025财年第四财季的销售额增长23%/达到约 170亿美元/增幅快于预期/但净利润却暴跌64%/至约9000万美元/低于预 期/这反映了衍生品业务的亏损以及依然低迷的P ...

Group 1 - The core viewpoint of the articles highlights the increasing trend of A-share companies, particularly in the semiconductor sector, pursuing dual listings in Hong Kong, driven by favorable regulatory policies and the need for global expansion [1][6][8] - The "A+H model" allows companies to access both domestic and international capital markets, enhancing their financial strength and market recognition [6][8] - Several semiconductor companies, including Zhaoyi Innovation, Unisoc, and others, have announced plans for Hong Kong listings, indicating a significant shift towards internationalization [2][4][5] Group 2 - The semiconductor companies aim to strengthen their global presence, with many explicitly stating that their Hong Kong listings are part of a strategy to enhance their international business operations and competitiveness [6][7] - The funds raised from these listings are primarily targeted at improving core technology capabilities, expanding product lines, and enhancing overseas sales networks [6][7] - Recent regulatory changes, such as the "Five Measures to Benefit Hong Kong" policy and adjustments to listing requirements, have made it easier for A-share companies to pursue dual listings in Hong Kong [7][8]

科创板融资余额环比前一日增加2.79亿元，其中，41股融资余额环比增加超1000万元，融资净买入居前 的有芯原股份、天岳先进、九号公司等股。 | 代码 | 简称 | 最新融资余额（万 | 环比增减金额（万 | 环比增减 | 当日涨跌幅 | | --- | --- | --- | --- | --- | --- | | | | 元） | 元） | （%） | （%） | | 688521 | 芯原股 份 | 94839.41 | 4483.92 | 4.96 | 1.98 | | 688234 | 天岳先 进 | 48652.88 | 3911.99 | 8.74 | 6.58 | | 689009 | 九号公 司 | 81941.80 | 3362.79 | 4.28 | 2.85 | | 688116 | 天奈科 技 | 90613.74 | 3229.85 | 3.70 | 2.25 | | 688326 | 经纬恒 润 | 16288.80 | 2766.78 | 20.46 | 11.51 | | 688278 | 特宝生 物 | 88081.73 | 2677.47 | 3.14 | -1.57 | ...

Group 1: Opportunities for Domestic Substitution - Domestic companies are making significant technological breakthroughs in the silicon carbide (SiC) sector, narrowing the gap with international leaders, particularly in the electric vehicle (EV) market [2] - In 2023, China's market share of SiC epitaxial wafers reached 38.8%, ranking first globally, driven by increased production capacity [3] - National policies are increasingly supportive of key semiconductor materials, with the "14th Five-Year Plan for Integrated Circuit Industry" emphasizing the need to overcome technological bottlenecks in third-generation semiconductor materials [4] Group 2: Restructuring Industry Landscape - The core competitiveness of the SiC industry chain lies in the self-sufficiency of upstream materials and equipment, with companies mastering key equipment and high-end materials poised for rapid growth [5] - Domestic companies are accelerating their catch-up in device manufacturing, especially in automotive-grade SiC power devices, benefiting from the continuous growth of the EV market [6] - The application scenarios for SiC are expanding beyond EVs to include photovoltaic power generation, rail transportation, and industrial power supplies, positioning domestic companies for significant global market presence [7] Group 3: Dual-Driven Growth of Domestic Breakthroughs - Chinese companies have established a significant cost advantage through continuous R&D and process innovation, with 6-inch substrate prices at only 30% of international levels [8] - The acceleration of equipment localization is exemplified by Northern Huachuang's new generation SiC crystal growth furnace, which reduces equipment prices by 50% and surpasses key performance indicators [9] Group 4: Market Opportunities for Domestic SiC - The EV market is the largest application for SiC, with projected production and sales of 12.888 million and 12.866 million units in China for 2024, reflecting year-on-year growth of 34.4% and 35.5% [12] - In the photovoltaic and energy storage sectors, SiC is a key technology for improving system efficiency, with China's new photovoltaic installations expected to reach 277.2 GW in 2024, a 27.8% increase [13] - Emerging technologies such as AI data centers and AR glasses present new growth opportunities for the SiC industry, with AI data centers requiring high-efficiency power modules [14] Group 5: Benefiting Companies - Tianyue Advanced is one of the few global participants capable of mass-producing 8-inch SiC substrates, with a projected global market share ranking second in conductive SiC substrate materials by 2024 [16] - Tianshuo He Da is the largest domestic supplier of power electronics SiC substrates, holding a 17.3% share in the global market, and is positioned to capture orders following Wolfspeed's bankruptcy [16] - Sinda Semiconductor is making progress in the SiC sector, with its SiC MOSFET modules for passenger vehicle motor controllers seeing increased volume [16] - Mind Electronics, through its subsidiary Guangxin Microelectronics, is expected to achieve an annual production capacity of 36,000 6-inch SiC wafers, with costs significantly lower than competitors [17]

Group 1 - The global N-type SiC substrate industry revenue is projected to decline by 9% in 2024, reaching $1.04 billion, primarily due to weakened demand in the automotive and industrial sectors, along with intensified market competition leading to significant price drops [2][3] - SiC, as a representative third-generation compound semiconductor material, is crucial in power electronic devices and is widely used in electric vehicles, photovoltaics, energy storage, industrial power supplies, and rail transportation [2] - The price of 6-inch SiC substrates has fallen below $500, approaching the manufacturers' cost line, due to the entry of Chinese companies into the market [2] Group 2 - Wolfspeed remains the most significant supplier in the SiC materials market with a 33.7% market share in 2024, while Chinese companies TanKeBlue and SICC hold the second and third positions with 17.3% and 17.1% market shares, respectively [5] - The aggressive pricing strategies of Chinese companies are disrupting the existing market structure, leading to concerns about increased internal competition and potential impacts on product quality [6][7] - The entire SiC device-related ecosystem is experiencing continuous capacity growth, raising concerns about the sustainability of the market dynamics [7] Group 3 - Silan Microelectronics has achieved a monthly production capacity of 9,000 pieces of 6-inch SiC MOS chips, with 50,000 units shipped to four domestic automotive manufacturers [9] - As the ecosystem improves, domestic companies are focusing on quality enhancement alongside competitive pricing, with Silan's 8-inch mini line achieving higher yield rates compared to the 6-inch line [9]

| 插播： | | 天科合达、天岳先进、同光股份、烁科晶 | | --- | --- | --- | | 体、合盛新材料、三安半导体、东尼电子、中电化合物、芯聚能、安海半导体、凌锐半导体、士兰微、泰 | | | | 坦未来、恒普技术、华卓精科、快克芯装备、京航特碳、奥亿达半导体及成都炭材等已确认参编《2025 | | | | 碳化硅衬底与外延产业调研白皮书》及《2025碳化硅器件与 模块产业调 | | | | 研白皮》， | 参编咨询 | 请联系许若冰 | | （hangjiashuo999）。 | | | 自2024年Meta宣布其AR眼镜采用碳化硅光波导镜片以来，这一动向迅速成为行业焦点，一场由材料革 新驱动的AR眼镜升级潮已然爆发。 值得关注的是，XREAL、雷鸟创新、慕德微纳、广纳四维等AR眼镜及硬件厂商已在加速碳化硅光波导布 局，与此同时，天岳先进、天科合达、烁科晶体、同光半导体、浙江晶瑞、山西天成、乾晶半导体等碳化硅 衬底企业也在迅速跟进，整个行业呈现出极高的技术热情与市场活力。 然而，碳化硅光波导的规模化应用仍面临关键掣肘——衬底成本。为破解这一难题，本期【产业透视】深 度对话 天岳先进、天科合 ...

本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 证券代码：688234 证券简称：天岳先进 公告编号：2025-040 山东天岳先进科技股份有限公司 2024年年度股东大会决议公告 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东大会召开的时间：2025 年 5 月 16 日 （二） 股东大会召开的地点：山东省济南市槐荫区天岳南路 99 号天岳先进公司 会议室 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 108 | | --- | --- | | 普通股股东人数 | 108 | | 2、出席会议的股东所持有的表决权数量 | 265,802,332 | | 普通股股东所持有表决权数量 | 265,802,332 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比例（%） | 62.1462 | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 62.1462 | （四） 表 ...