（文章来源：证券日报） 证券日报网讯 1月16日，华润微发布公告称，公司2026年第一次临时股东会审议通过《关于预计2026年 度日常关联交易的议案》《关于修订等三项制度的议案》。 ...

（文章来源：证券日报） 证券日报网讯 1月16日，华润微发布公告称，公司董事会收到马卫清先生提交的职务调整报告，其因工 作调整申请辞去公司副总裁，自送达董事会之日起生效，并将担任公司资深首席专家，仍为公司核心技 术人员。 ...

Core Viewpoint - The A-share market experienced a slight pullback on January 16, with the Shanghai Composite Index barely holding above the 4100-point mark, while the electronic sector showed resilience, leading gains in the market [1][4]. Market Performance - The Shanghai Composite Index closed down 0.26% at 4101.91 points, the Shenzhen Component Index fell 0.18%, and the ChiNext Index decreased by 0.20% [1]. - The total trading volume in the Shanghai, Shenzhen, and Beijing markets reached 30,568 billion yuan, an increase of 1,180 billion yuan compared to the previous day [1]. Sector Highlights - The electronic sector was the standout performer, with the electronic ETF (515260) rising by 2.7%, and the smart manufacturing ETF (516800) increasing by 2.42% [1][2]. - The new materials and new energy sectors also saw some individual stocks perform well, with the new materials ETF (516360) and the smart electric vehicle ETF (516380) both gaining over 1% [1]. Downward Trends - The AI medical concept continued to cool off, with the largest medical ETF (512170) dropping by 2.6% [1]. - AI application stocks experienced a broad pullback, with the ChiNext AI ETF (159363) declining by 1.81% [1]. Capital Inflows - The electronic sector attracted a net inflow of 30.511 billion yuan, leading all 31 first-level industries in terms of capital absorption [8]. - Key stocks within the electronic ETF, such as Zhaoyi Innovation and Changdian Technology, attracted significant capital inflows of 4.538 billion yuan and 3.181 billion yuan, respectively [8][9]. Policy Support - The central bank implemented a series of measures to support high-quality economic development, including a 0.25 percentage point reduction in re-lending and rediscount rates, and an increase in the re-lending quota for small and medium-sized enterprises by 500 billion yuan [2][3]. Future Outlook - Analysts predict that A-shares may see considerable incremental capital by 2026, potentially sustaining a slow bull market [3]. - The focus is expected to shift towards verifying economic conditions and performance, with active funds reinforcing a dual-line strategy of "technology + resource products" [3].

证券日报网讯1月16日，华润微在互动平台回答投资者提问时表示，公司具有新型铁电材料存储器技术 (VFRAM)，未来会结合公司发展战略，对于相关领域进行布局。 ...

Core Viewpoint - The electronic sector is leading the A-share market, with the electronic ETF (515260) showing strong performance, closing up 2.7% and achieving a premium rate of 0.93% at the end of the trading day, indicating strong buying interest [1] Group 1: Market Performance - The electronic sector received a net inflow of 30.511 billion, ranking first among all 31 Shenwan primary industries [2][3] - Major stocks in the electronic ETF, including Zhaoyi Innovation and Changdian Technology, attracted 4.538 billion and 3.181 billion respectively, topping the A-share inflow rankings [2][3] - Semiconductor leaders such as Changdian Technology, Zhaoyi Innovation, and Tongfu Microelectronics hit the daily limit, while Huazhong Microelectronics rose over 13% [4] Group 2: Industry Trends - TSMC's recent earnings report for Q4 2025 exceeded expectations, marking the seventh consecutive quarter of double-digit growth, and raised its 2026 capital expenditure guidance to 52-56 billion USD, reflecting strong and sustainable demand in the AI industry chain [5] - The U.S. government's recent imposition of a 25% tariff on specific semiconductors may create a stronger "accelerated replacement" window for domestic equipment amid increasing supply chain uncertainties [5] - The trend of "self-control and AI resonance" is expected to strengthen further in 2026, with a focus on domestic computing power and semiconductor equipment [5] Group 3: Investment Tools - The electronic ETF (515260) and its linked funds are designed to passively track the electronic 50 index, heavily investing in semiconductor and consumer electronics sectors, including AI chips, automotive electronics, and PCB [5] - The ETF serves as an efficient tool for investors to gain exposure to core assets in the electronic sector [5]

Group 1 - The core index of state-owned enterprise reform (399974) closed at 1984.5 points, down 0.43%, with a trading volume of 254.11 billion yuan and a turnover rate of 1.24% [1] - Among the constituent stocks, 34 companies saw an increase, with China Resources Microelectronics leading with a 13.04% rise, while 64 companies experienced a decline, with Goldwind Technology leading the drop at 9.99% [1] Group 2 - The net outflow of main funds from the constituent stocks of the state-owned enterprise reform index totaled 5.94 billion yuan, while the net outflow of speculative funds was 430 million yuan [2] - Retail investors contributed a net inflow of 6.37 billion yuan into the constituent stocks [2]

北京市嘉源律师事务所 关于华润微电子有限公司 2026 年第一次临时股东会的 法律意见书 西城区复兴门内大街 158 号远洋大厦 4 楼 中国·北京 ARYE Un Entist Fr UAN LAW OFFICES 北京 BEIJING · 上海 SHANGHAI ·深圳 SHENZHEN · 香港 HONG KONG · 广州 GUANGZHOU · 西安 XI'AN 致:华润微电子有限公司 北京市嘉源律师事务所 关于华润微电子有限公司 2026年第一次临时股东会的 法律意见书 嘉源(2026)-04-022 本所认为,本次股东会的召集及召开程序符合《股东会规则》等法律法规及 《公司章程》的规定。 北京市嘉源律师事务所(以下简称"本所")接受华润微电子有限公司(以下 简称"公司")的委托,根据《上市公司股东会规则》(以下简称"《股东会规则》") 等现行有效的法律、行政法规、部门规章、规范性文件(以下简称"法律法规") 以及《China Resources Microelectronics Limited(华润微电子有限公司)经第九次 修订及重列的组织章程大纲和章程细则》(以下简称"《公司章程》")的有关规 ...

重要内容提示： 华润微电子有限公司（以下简称 "公司"）董事会于近日收到公司现任高级 管理人员马卫清先生提交的职务调整报告。马卫清先生因工作调整原因，申请辞 去公司副总裁，马卫清先生将担任公司资深首席专家，仍为公司核心技术人员， 马卫清先生递交的职务调整报告自送达董事会之日起生效。 一、高级管理人员职务调整情况 | 姓名 | 离任职务 | 离任时间 | | 原定任期到 期日 | | 离任原因 | 是否继续在上 市公司及其控 | 具体职务 | 是否存在未 履行完毕的 | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | | | | | | | 股子公司任职 | | 公开承诺 | | 马卫清 | 副总裁 | 年 2026 | 月 1 | 年 月 2028 | 5 | 工作调整 | 是 | 资深首席专家 | 无 | | | | 日 16 | | 日 22 | | | | | | （一）高级管理人员提前离任的基本情况 证券代码：688396 证券简称：华润微 公告编号：2026-003 华润微电子有限公司 关于公司高级管理人员职务调整的 ...

证券代码：688396 证券简称：华润微 公告编号：2026-002 华润微电子有限公司 | 1、出席会议的股东和代理人人数 | 359 | | --- | --- | | 普通股股东人数 | 359 | | 2、出席会议的股东所持有的表决权数量 | 928,003,831 | | 普通股股东所持有表决权数量 | 928,003,831 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比例（%） | 69.9045 | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 69.9045 | 2026年第一次临时股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： （四） 表决方式是否符合《公司法》及公司章程的规定，股东会主持情况等。 1、 公司在任董事9人，以现场结合通讯方式列席9人； 2、 公司董事、财务总监兼董事会秘书吴 ...

Core Insights - Recently, Beijing Xulun Technology Co., Ltd. completed a strategic financing round exceeding 100 million yuan in A4 round [1] - The financing was led by Northern Huachuang Industrial Investment Fund and Novartis Strategic Investment, with A3 round led by Beijing Electric Control Industrial Investment Fund and Qianhai Ark Fund [1] - The funds will be used for the second phase of expansion of UV Tape/DAF product lines, semiconductor packaging material R&D, and upgrading customer delivery systems [1] Company Overview - Xulun Technology has a core team from top domestic and international universities and research institutions, with rich experience in materials science and chemical engineering [1] - The company focuses on developing high-end semiconductor adhesive films and tapes, starting from basic resins such as acrylic, epoxy, and organic silicon [1] Infrastructure and Operations - Xulun Technology has a 5,000 square meter application R&D center in Beijing and a pilot base with a thousand-level clean coating facility in Hebei [2] - The company also has semiconductor-grade precision coating production lines with thousand-level and hundred-level clean standards in Jiangsu, and warehouses and technical support subsidiaries in Shanghai, Suzhou, Shenzhen, and Chengdu [2] Product Applications - The products of Xulun Technology are applied in critical process scenarios such as wafer thinning, cutting, chip mounting and stacking, substrate interlayer and line insulation, wafer-level packaging, and 2.5D/3D packaging [2] - The company serves various fields including RF chips, computing power chips, storage chips, and HBM [2]