Group 1 - The company announced a major asset restructuring plan on March 5, 2025, intending to acquire approximately 60% of the shares of Gaofeng (Beijing) Technology Co., Ltd. through cash payment [1] - The parties involved in the transaction could not reach an agreement on certain commercial terms, leading to a mutual decision to terminate the transaction [1] - A termination agreement for the equity acquisition intention agreement was signed recently, confirming the termination of the major asset restructuring matter [1] Group 2 - The company committed to not planning any major asset restructuring matters for at least one month from the date of this announcement [1]

Core Viewpoint - The global semiconductor industry is showing signs of recovery, but the recovery of semiconductor wafer production is lagging behind the overall market, with several A-share semiconductor wafer companies experiencing profit declines in Q1 2025 [1] Group 1: Market Trends - The semiconductor wafer industry entered a cyclical inventory adjustment phase since Q4 2022, with global wafer shipments expected to decline to 12.266 billion square inches in 2024, a year-on-year decrease of 2.67%, and sales expected to drop to $11.5 billion, a decline of 6.5% [2] - In Q1 2024, the semiconductor wafer market maintained a mild recovery, with global wafer shipment area increasing by 4.6% year-on-year, although there was a divergence in different sizes: 300mm wafer shipments grew by 5.7%, while 200mm shipments declined by 2.9% [2] Group 2: Company Performance - Shanghai Silicon Industry reported a revenue of approximately 3.388 billion yuan last year, with a net profit loss of about 971 million yuan, and a net profit loss of around 200 million yuan in Q1 this year [2] - Li Wei, the executive vice president of Shanghai Silicon Industry, indicated that sales and overall revenue are expected to rise in 2024 and Q1 2025, but price recovery depends on further market recovery [2] - Lian Microelectronics reported a revenue of 3.092 billion yuan last year, a year-on-year increase of nearly 15%, but a net profit loss of 266 million yuan due to cost pressures from capacity expansion and product price declines [3] Group 3: Capacity Expansion - The focus of capacity expansion is shifting towards 12-inch semiconductor wafers, with Lian Microelectronics' factories in Jiaxing and Quzhou currently in the ramp-up phase [4] - Lian Microelectronics plans to invest 1.23 billion yuan in a project to produce 960,000 pieces of 12-inch epitaxial wafers annually [4] - Shanghai Silicon Industry's 12-inch wafer capacity is expected to reach 600,000 pieces per month by the end of 2024, with ongoing capacity construction in Taiyuan [5] Group 4: Capital Operations - Semiconductor wafer companies are actively engaging in capital operations, with Shanghai Silicon Industry planning to acquire minority stakes in subsidiaries for 7.04 billion yuan to enhance its 300mm wafer business [6] - Yuyuan Silicon is expanding through acquisitions, including a plan to acquire 60% of High Frequency (Beijing) Technology Co., a supplier of ultra-pure water systems for chip manufacturing [7] - Yuyuan Silicon also plans to acquire 70% of DG Technologies for 11.91 billion yen, which will help enhance its manufacturing technology for etching equipment [7]

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 一、 本次重大资产重组的基本情况 有研半导体硅材料股份公司（以下简称"公司"）拟以支付现金的方式 收购高频（北京）科技股份有限公司(以下简称"标的公司")约 60%的股权（以 下简称"本次交易"），本次交易完成后公司将成为标的公司控股股东。 证券代码：688432 证券简称：有研硅 公告编号：2025-022 有研半导体硅材料股份公司 关于筹划重大资产重组的进展公告 截至本公告披露之日，公司及有关各方正在积极推进本次重大资产重组的相 关工作，具体方案仍在谨慎筹划论证中，公司将继续按照《上市公司重大资产重 组管理办法》及其他有关规定，及时履行信息披露义务。 1 三、 风险提示 本次交易尚处于筹划阶段，具体交易方案尚需进一步论证和沟通协商，并需 按照相关法律、法规及公司章程的规定履行必要的决策和审批程序，最终能否实 施及实施的具体进度均存在不确定性。 公司指定信息披露媒体为上海证券交易所网站（www.sse.com.cn），有关公 司的信息均以在上述指定信息披露媒体刊登的为准。公 ...

证券代码：688432 证券简称：有研硅 公告编号：2025-021 有研半导体硅材料股份公司 2024年年度股东会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （一） 股东会召开的时间：2025 年 4 月 25 日 （二） 股东会召开的地点：北京市西城区新街口外大街 2 号有研大厦 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 163 | | --- | --- | | 普通股股东人数 | 163 | | 2、出席会议的股东所持有的表决权数量 | 999,643,686 | | 普通股股东所持有表决权数量 | 999,643,686 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 80.3530 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 80.3530 | 注：截至本次股东会股权登 ...

北京德恒律师事务所 关于有研半导体硅材料股份公司 2024 年年度股东会的 法律意见 北京市西城区金融街 19 号富凯大厦 B 座 12 层 电话:010-52682888 传真:010-52682999 邮编:100033 北京德恒律师事务所 关于有研半导体硅材料股份公司 2024 年年度股东会的 法律意见 德恒 01G20250167-2 号 致：有研半导体硅材料股份公司 有研半导体硅材料股份公司（以下简称"公司"）2024 年年度股东会（以下 简称"本次会议"）于 2025 年 4 月 25 日（星期五）召开。北京德恒律师事务所 （以下简称"德恒"）受公司委托，指派黄卓颖、赵明宝律师（以下简称"德恒 律师"）出席了本次会议。根据《中华人民共和国公司法》（以下简称"《公司 法》"）、《中华人民共和国证券法》（以下简称"《证券法》"）、中国证券 监督管理委员会《上市公司股东会规则》（以下简称"《股东会规则》"）、《有 研半导体硅材料股份公司章程》（以下简称"《公司章程》"）的规定，德恒律 师就本次会议的召集、召开程序、现场出席会议人员资格、表决程序等相关事项 进行见证，并发表法律意见。 为出具本法律意见，德 ...

Financial Performance - The company's operating revenue for Q1 2025 was CNY 230,824,367.90, a decrease of 1.64% compared to CNY 234,682,549.22 in the same period last year[4] - Net profit attributable to shareholders was CNY 49,079,915.63, down 12.96% from CNY 56,384,833.25 year-on-year[4] - Total operating revenue for Q1 2025 was CNY 230,824,367.90, a decrease of 1.8% compared to CNY 234,682,549.22 in Q1 2024[19] - Net profit for Q1 2025 was CNY 58,156,436.17, a decrease of 8.8% from CNY 63,718,209.36 in Q1 2024[21] - Earnings per share for Q1 2025 was CNY 0.039, compared to CNY 0.045 in Q1 2024[21] Cash Flow and Liquidity - The net cash flow from operating activities increased significantly by 168.13%, reaching CNY 69,104,766.75 compared to CNY 25,772,581.76 in the previous year[4] - The total cash and cash equivalents at the end of the period reached 1,954,687,514.53, up from 1,322,161,758.61, indicating a strong liquidity position[27] - Cash inflow from investment activities totaled 1,926,185,900.14, compared to 2,491,441,257.69 in the prior period, indicating a decrease in investment returns[25] - The net cash flow from investment activities was 981,353,577.28, a turnaround from a negative cash flow of -144,742,977.46 in the previous period, showcasing improved investment management[25] - Cash outflow from financing activities was 2,055,690.69, a decrease from 37,188,965.37 in the previous period, reflecting reduced financing costs[27] Assets and Liabilities - Total assets at the end of the reporting period were CNY 5,346,652,897.59, a slight decrease of 0.39% from CNY 5,367,768,357.56 at the end of the previous year[5] - Non-current assets totaled CNY 2,149,851,249.59, an increase from CNY 1,779,566,059.30 year-over-year[17] - Total liabilities decreased to CNY 484,682,346.50 from CNY 570,823,719.82 in the previous period[17] - Total equity increased to CNY 4,861,970,551.09 from CNY 4,796,944,637.74 year-over-year[17] Research and Development - Research and development expenses totaled CNY 19,388,484.13, representing 8.40% of operating revenue, a decrease of 0.78 percentage points from 9.18%[5] - Research and development expenses for Q1 2025 were CNY 19,388,484.13, down from CNY 21,554,957.60 in Q1 2024[20] - The company plans to continue focusing on R&D and market expansion strategies to enhance its competitive position in the semiconductor industry[4] Shareholder Information - The total number of ordinary shareholders at the end of the reporting period was 22,331[8] - The largest shareholder, Beijing Youyan Ais Semiconductor Technology Co., Ltd., holds 30.84% of the shares, totaling 384,750,000 shares[9] - The company’s major shareholders include China Research Institute of Technology with 230,422,500 shares, representing a significant ownership stake[10] Strategic Initiatives - The company has signed a cooperation agreement with Fujian Cangyuan Investment Co., Ltd., indicating a strategic partnership[11] - The company plans to acquire 70% of DG Technologies for a total consideration of JPY 119,138.82 million (approximately RMB 5,846.97 million), which is not classified as a major asset restructuring[12] Investment and Market Conditions - The company emphasizes the importance of monitoring investment risks associated with ongoing acquisitions and market fluctuations[13] - The company’s total assets and liabilities will be further detailed in the upcoming financial reports, with ongoing assessments of market conditions[13] Other Financial Metrics - The weighted average return on equity was 1.12%, down 0.23 percentage points from 1.35%[4] - The company reported non-recurring gains of CNY 14,816,911.24 for the period, after accounting for tax and minority interests[7] - The company reported an investment loss of CNY 1,387,835.50 in Q1 2025, compared to a gain of CNY 2,782,495.92 in Q1 2024[20] - Cash received from sales of goods and services in Q1 2025 was CNY 169,111,416.25, slightly down from CNY 170,618,930.96 in Q1 2024[24] - The cash paid for purchasing goods and services was 42,365,067.68, significantly lower than 102,743,977.74 in the previous period, indicating cost control measures[25] - The cash paid for fixed assets and other long-term assets was 17,275,322.86, compared to 21,184,235.15 previously, reflecting a decrease in capital expenditures[25] - The impact of exchange rate changes on cash and cash equivalents was 435,925.29, an increase from 18,899.77, indicating favorable currency movements[27]

有研硅公告，2025年第一季度营收为2.31亿元，同比下降1.64%；净利润为4907.99万元，同比下降 12.96%。 ...

登录新浪财经APP 搜索【信披】查看更多考评等级 证券代码：688432 证券简称：有研硅 公告编号：2025-020 有研半导体硅材料股份公司 关于2024年股票期权激励计划 预留授予完成登记的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大遗漏，并对其内容 的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据有研半导体硅材料股份公司（以下简称"公司"）2024年第二次临时股东大会授权，公司于2025年3 月14日召开第二届董事会第七次会议、第二届监事会第七次会议，审议通过了《关于向2024年股票期权 激励计划激励对象授予预留部分股票期权的议案》。根据《上市公司股权激励管理办法》及上海证券交 易所、中国证券登记结算有限责任公司上海分公司的有关规定，公司已完成2024年股票期权激励计划 （以下简称"本次激励计划"）预留授予登记工作，现将有关情况公告如下： 一、本激励计划已履行的决策程序和信息披露情况 1、2024年9月10日，公司第二届董事会第三次会议审议通过了《关于〈有研半导体硅材料股份公司2024 年股票期权激励计划（草案）〉及其摘要的议案》《关于〈有研半导体硅 ...

证券代码：688432 证券简称：有研硅 公告编号：2025-020 有研半导体硅材料股份公司 关于 2024 年股票期权激励计划 预留授予完成登记的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据有研半导体硅材料股份公司（以下简称"公司"）2024 年第二次临时股 东大会授权，公司于 2025 年 3 月 14 日召开第二届董事会第七次会议、第二届监 事会第七次会议，审议通过了《关于向 2024 年股票期权激励计划激励对象授予 预留部分股票期权的议案》。根据《上市公司股权激励管理办法》及上海证券交 易所、中国证券登记结算有限责任公司上海分公司的有关规定，公司已完成 2024 年股票期权激励计划（以下简称"本次激励计划"）预留授予登记工作，现将有 关情况公告如下： 一、本激励计划已履行的决策程序和信息披露情况 1、2024年9月10日，公司第二届董事会第三次会议审议通过了《关于<有研 半导体硅材料股份公司2024年股票期权激励计划（草案）>及其摘要的议案》《关 于<有研半导体硅材料股份公司2024 ...

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 投资者可于 2024 年 04 月 21 日(星期一) 至 04 月 25 日(星期 五)16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或 通过公司邮箱 gritekipo@gritek.com 进行提问。公司将在说明会上 对投资者普遍关注的问题进行回答。 有研半导体硅材料股份公司（以下简称"公司"）已于 2025 年 03 月 31 日在上海证券交易所网站（www.sse.com.cn）披露了《2024 年年度报告》及其摘要，并将于 2025 年 04 月 24 日披露《2025 年第 一季度报告》。为便于广大投资者更全面深入地了解公司经营成果、 财务状况、利润分配方案等情况，公司计划于 2025 年 04 月 28 日上 午 09:00-10:00 举行 2024 年度暨 2025 年第一季度业绩说明会，就投 会议召开时间：2025 年 04 月 28 日(星期一) 上午 09:00-10:00 会议 召开地点： 上海证券 交易所 上证路演 中心 ...