上市保荐书 华泰联合证券有限责任公司 关于成都智明达电子股份有限公司 向不特定对象发行可转换公司债券并在科创板上市 之 上市保荐书 上海证券交易所： 作为成都智明达电子股份有限公司（以下简称"发行人"、"公司"）向不特 定对象发行可转换公司债券并在科创板上市的保荐机构，华泰联合证券有限责任 公司（以下简称"华泰联合证券""保荐机构"）及其保荐代表人已根据《中华人 民共和国公司法》（以下简称《公司法》）、《中华人民共和国证券法》（以下简称 《证券法》）、《证券发行上市保荐业务管理办法》《上市公司证券发行注册管理办 法》（以下简称"《管理办法》"）、《上海证券交易所上市公司证券发行上市审核规 则》等法律法规和中国证券监督管理委员会（以下简称"中国证监会"）及贵所 的有关规定，诚实守信，勤勉尽责，严格按照依法制定的业务规则和行业自律规 范出具上市保荐书，并保证所出具文件真实、准确、完整。 现将有关情况报告如下： 一、发行人基本情况 （一）发行人概况 发行人名称：成都智明达电子股份有限公司 注册地址：成都市青羊区敬业路 229 号 H3 栋 D 单元 注册时间：2002 年 3 月 28 日 联系方式：028-615 ...

关于成都智明达电子股份有限公司 向不特定对象发行可转换公司债券申请文件 第二轮审核问询函的回复报告 （修订稿） 保荐机构（主承销商） 二零二四年四月 7-1-2-1 成都智明达电子股份有限公司 与华泰联合证券有限责任公司 上海证券交易所： 贵所于 2023 年 11 月 14 日出具的《关于成都智明达电子股份有限公司向不 特定对象发行可转换公司债券申请文件的第二轮审核问询函》（上证科审（再融 资）[2023]233 号）（以下简称"审核问询函"）已收悉。成都智明达电子股份 有限公司（以下简称"智明达""发行人""公司"）与华泰联合证券有限责任 公司（以下简称"保荐机构""保荐人"）和北京环球律师事务所（以下简称"发 行人律师"）等相关方已就审核问询函中提到的问题进行了逐项落实并回复，并 对申请文件进行了相应的补充，请予审核。 | 审核问询函所列问题 | 黑体（不加粗） | | --- | --- | | 审核问询函所列问题的回复 | 宋体（不加粗） | | 涉及对募集说明书等申请文件的修改内容 | 楷体（加粗） | | 对审核问询函回复的修改、补充 | 楷体（加粗） | 如无特别说明，本回复报告中的简称或名词 ...

股票简称：智明达 股票代码：688636 成都智明达电子股份有限公司 （Chengdu Zhimingda Electronics Co.，Ltd.） （成都市青羊区敬业路 229 号 H3 栋 D 单元） 向不特定对象发行可转换公司债券 并在科创板上市 募集说明书 保荐机构（主承销商） （深圳市前海深港合作区南山街道桂湾五路128号前海深港基金小镇B7栋401） 公告日期：2024 年 4 月 成都智明达电子股份有限公司 向不特定对象发行可转换公司债券募集说明书 声 明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对申 请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其对发行 人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任何与 之相反的声明均属虚假不实陈述。 根据《证券法》的规定，证券依法发行后，发行人经营与收益的变化，由 发行人自行负责。投资者自主判断发行人的投资价值，自主作出投资决策，自 行承担证券依法发行后因发行人经营与收益变化或者证券价格变动引致的投资 风险。 1-1-2 成都智明达电子股份有限公司 向不特定对象发行可转换公司债券募集说明书 重大事项提示 ...

特此公告。 成都智明达电子股份有限公司董事会 2024 年 04 月 16 日 证券代码：688636 证券简称：智明达 公告编号：2024-018 1 成都智明达电子股份有限公司 关于向不特定对象发行可转换公司债券申请文件 审核问询函回复等申请文件更新的提示性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 成都智明达电子股份有限公司（以下简称"公司"）于 2023 年 11 月 14 日收 到上海证券交易所（以下简称"上交所"）出具的《关于成都智明达电子股份有 限公司向不特定对象发行可转换公司债券申请文件的第二轮审核问询函》（上证 科审（再融资）〔2023〕233 号）（以下简称"《问询函》"）。 根据本次发行项目进展，结合公司已披露的《2023 年年度报告》，公司会同 相关中介机构对募集说明书等申请文件涉及的财务数据进行了同步更新，具体内 容详见公司同日于上交所网站（www.sse.com.cn）披露的《成都智明达电子股份 有限公司向不特定对象发行可转换公司债券募集说明书(申报稿)(2023 年度财 务数据更新版 ...

证券代码：688636 证券简称：智明达 公告编号：2024-017 成都智明达电子股份有限公司 关于召开 2024 年第一季度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 联席董事长、总经理：江虎 董事会秘书、副总经理：秦音 重要内容提示： 投资者可于 2024 年 04 月 12 日(星期五) 至 04 月 16 日(星期二)16:00 前登 录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 688636zmd@zmdde.com 进行提问。公司将在说明会上对投资者普遍关注的问题进 行回答。 成都智明达电子股份有限公司（以下简称"公司"）将于 2024 年 4 月 17 日 发布公司 2024 年第一季度报告，为便于广大投资者更全面深入地了解公司 2024 年第一季度经营成果、财务状况，公司计划于 2024 年 04 月 17 日下午 15:00- 16:00 举行 2024 年第一季度业绩说明会，就投资者关心的问题进行交流。 一、 说明会类型 本次投资者说明会以网络互动形式召开，公司将针对 ...

| --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | |--------------------------------------------------------------------------|---------|---------|---------|---------|---------|---------------------------------|--------|--------|--------|---------|---------| | [Table_FinanceDetail 财务预测表 ] \n资产负债表 单位：百万元 \n会计年度 | \n2022 | 2023 | 2024E | 2025E | \n2026E | 利润表 单位：百万元 \n会计年度 | 2022 | 2023 | 2024E | 2025E | 2026E | | 流动资产 | 1122.05 | 1164.26 | 1269.60 | 1451.00 | 1688.41 | 营业收入 | 540.87 | ...

成都智明达电子股份有限公司 2023 年年度股东大会 会 议 材 料 2024 年 4 月 8 日 成都智明达电子股份有限公司 2023 年年度股东大会会议资料 目录 | 2023 | 年年度股东大会会议须知 | | 3 | | --- | --- | --- | --- | | 2023 | 年年度股东大会议程 | | 5 | | 2023 | 年年度股东大会会议议案 | | 7 | | 议案一 《关于 | 年度董事会工作报告的议案》 | 2023 | 8 | | 议案二 《关于 | 年度监事会工作报告议案》 | 2023 | 9 | | 议案三 《关于 | 年度财务决算报告的议案》 | 2023 | 10 | | 议案四 | 《关于公司 2023 年年度报告及其摘要的议案》 | | 11 | | 议案五 | 《关于公司 2023 年度利润分配及资本公积转增股本方案的议案》 | | 12 | | 议案六 | 《关于续聘信永中和会计师事务所（特殊普通合伙）为公司 2024 年度审计机构的议 | | | | 案》 | | | 13 | | 议案七 《关于 | 年度公司董事及监事薪酬方案的议案》 | 2024 | ...

证券研究报告·公司点评报告·军工电子Ⅱ 2023 年年报点评：营收稳健增长，募投扩产 强研，国防信息化建设提供强劲支撑 2024 年 04 月 02 日 | --- | --- | --- | --- | --- | --- | |------------------------------|---------|--------|--------|----------|----------| | 盈利预测与估值 [Table_EPS] | 2022A | 2023A | 2024E | 2025E | 2026E | | 营业总收入（百万元） | 540.87 | 663.00 | 817.61 | 1,010.23 | 1,239.66 | | 同比 | 20.35% | 22.58% | 23.32% | 23.56% | 22.71% | | 归母净利润（百万元） | 75.36 | 96.26 | 135.12 | 177.47 | 233.83 | | 同比 | -32.42% | 27.73% | 40.38% | 31.34% | 31.76% | | EPS- 最新摊薄（元 / 股） | 1. ...

Financial Performance - The company's operating revenue for 2023 reached ¥663,000,263.14, representing a year-on-year increase of 22.58% compared to ¥540,866,425.49 in 2022[20]. - The net profit attributable to shareholders for 2023 was ¥96,255,954.07, up 27.73% from ¥75,357,268.40 in 2022[20]. - The basic earnings per share for 2023 was ¥1.2815, reflecting a 27.13% increase from ¥1.0080 in 2022[21]. - The total assets at the end of 2023 amounted to ¥1,533,626,960.36, a 1.73% increase from ¥1,507,487,640.71 at the end of 2022[20]. - The net cash flow from operating activities for 2023 was ¥5,888,438.34, a significant recovery from a negative cash flow of -¥106,254,221.19 in 2022[20]. - The company reported a net profit of ¥34,614,303.12 in Q4 2023, contributing to a total annual net profit of ¥96,255,954.07[25]. - The net profit attributable to the parent company was 96.26 million RMB, up 27.73% year-on-year; however, the net profit excluding non-recurring gains and losses decreased by 13.13% to 61.77 million RMB[35]. - The gross margin for embedded products decreased by 8.25 percentage points to 43.70%[128]. - The company achieved operating revenue of ¥663,000,263.14, an increase of 22.58% compared to the previous year[122]. - Net profit attributable to shareholders reached ¥96,255,954.07, reflecting a growth of 27.73% year-on-year[122]. Dividend and Capital Increase - The company plans to distribute a cash dividend of 2.10 CNY per 10 shares (including tax) and to increase capital by 4.9 shares for every 10 shares held[5]. - The company’s board of directors has approved the profit distribution plan for the 2023 fiscal year[5]. - The proposed cash dividend is CNY 2.10 per 10 shares (including tax), totaling CNY 15,800,924.37, which accounts for 18.24% of the distributable profit[195]. - The company plans to increase its total share capital by 4.9 shares for every 10 shares held, resulting in a total share capital of 112,111,321 shares post-issue[195]. Research and Development - The company secured 190 new R&D projects during the reporting period[35]. - The company reported a total R&D expenditure of ¥123,278,944.97 in the current year, representing an increase of 8.02% compared to ¥114,126,542.87 in the previous year[94]. - The total R&D expenditure accounted for 18.20% of the operating revenue, a decrease of 2.51 percentage points from 21.10% in the previous year[94]. - The company has established a dedicated R&D center to focus on new technologies and maintain its competitive edge in the embedded computing module sector[49]. - The company is focused on developing embedded computing solutions for defense technology, emphasizing low power consumption, miniaturization, and high reliability in its products[102]. - The company is currently developing high-performance, low-power, domestically produced image processing computers for various applications, including infrared and laser guidance systems[101]. - The company has implemented a management mechanism to enhance R&D capabilities, ensuring alignment with market needs and improving product quality[103]. - The company has successfully produced and delivered products utilizing new technologies, enhancing production efficiency and reliability[94]. Market and Industry Trends - The demand for embedded computers in defense equipment is expected to rise as the value of electronic products in various defense systems continues to increase, with avionics systems accounting for 30-40% of advanced combat aircraft development costs[55]. - The shift towards informationization in China's defense sector is crucial, as modern warfare increasingly relies on information superiority, necessitating upgrades in defense equipment[53]. - The overall growth in the defense sector is expected to create a robust market for embedded computing solutions, driven by both modernization and new technology integration[60]. - The embedded computer market is experiencing rapid growth due to the increasing demand for intelligent equipment across various industries, including defense[76]. - The embedded systems market in China is expected to benefit from the integration of information technology and traditional industries, as well as government support and policies[80]. Risks and Challenges - The company has not reported any significant risks that could materially affect its operations during the reporting period[4]. - The company has outlined potential risks associated with forward-looking statements in the report[6]. - The company faces risks related to the procurement of core raw materials, which are critical for maintaining product stability and reliability[108]. - The company faces risks from intensified market competition, particularly from large state-owned enterprises in the same sector[118]. - The company has not experienced major quality disputes, but product quality risks remain a concern due to high customer expectations[110]. Governance and Management - The company’s board of directors held a total of 13 meetings during the reporting period, with all resolutions passed unanimously[179]. - The term for the current board members and senior management extends until November 2025, ensuring stability in leadership[172]. - The company has a structured remuneration policy for directors and senior management, aligning with market standards for independent directors[176]. - The company has maintained a consistent governance structure with no rejected proposals in board meetings throughout the reporting period[179]. - The company has implemented a competitive compensation system, including fixed salaries, performance bonuses, and stock incentives for management and key technical staff[191]. Strategic Initiatives - The company aims to deepen cooperation in the fields of UAVs, commercial satellites, and aerospace launch support, focusing on technology innovation and product development[155]. - The company is actively expanding its product categories and developing new technologies to improve market share and core competitiveness[155]. - The company is focusing on developing new platforms and technologies based on embedded computer modules, enhancing product performance and maintaining its advantage in the military embedded computer sector[157]. - The company plans to deepen its involvement in airborne, missile, vehicle-mounted, and ship-mounted equipment projects to increase market share and customer collaboration[158].