证券代码：002815 证券简称：崇达技术 公告编号：2025-036 崇达技术股份有限公司 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、公司担保事项概述 崇达技术股份有限公司（以下简称"公司"）因子公司深圳崇达多层线路板 有限公司（以下简称"深圳崇达"）、江门崇达电路技术有限公司（以下简称"江 门崇达"）日常生产经营需要，于 2025 年 8 月 12 日与汇丰银行(中国)有限公司 深圳分行（以下简称"汇丰银行深圳分行"）签署了《保证书》。 汇丰银行深圳分行分别为深圳崇达、江门崇达提供综合授信额度 15,000 万 元、20,000 万元，公司为这两家全资子公司本次授信业务提供全额信用保证。 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了 《关于公司 2025 年度对子公司担保额度预计的议案》，同意公司分别为深圳崇 达、江门崇达提供不超过 147,000 万元、130,000 万元担保额度，该担保额度使 用有效期为股东会审议通过之日起十二个月内。 具体内容详见公司披露在巨潮资讯网上的《关于 2025 年度对 ...

证券日报网讯8月13日晚间，崇达技术（002815）发布公告称，截至目前，公司已审批的有效担保额度 总金额为585，610万元(含合并报表范围内子公司的有效担保额度542，000万元，对参股子公司三德冠 及其子公司的有效担保额度43，610万元)，占最近一期经审计归属于母公司净资产的比例为81.65%；公 司为子公司授信相关业务签署的担保合同总金额为501，770万元，占最近一期经审计归属于母公司净资 产的比例为69.96%。公司无逾期担保事项和担保诉讼事项。 ...

一、公司担保事项概述 1、本次担保基本情况 崇达技术股份有限公司（以下简称"公司"）因子公司深圳崇达多层线路板 有限公司（以下简称"深圳崇达"）、江门崇达电路技术有限公司（以下简称"江 门崇达"）日常生产经营需要，于 2025 年 8 月 12 日与汇丰银行(中国)有限公司 深圳分行（以下简称"汇丰银行深圳分行"）签署了《保证书》。 汇丰银行深圳分行分别为深圳崇达、江门崇达提供综合授信额度 15,000 万 元、20,000 万元，公司为这两家全资子公司本次授信业务提供全额信用保证。 2、公司本次担保额度的审议情况 证券代码：002815 证券简称：崇达技术 公告编号：2025-036 崇达技术股份有限公司 关于为子公司提供担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 2025 年 4 月 15 日，公司召开的第五届董事会第二十二次会议、第五届监事 会第十五次会议，以及 2025 年 5 月 9 日召开的 2024 年度股东会，审议通过了 《关于公司 2025 年度对子公司担保额度预计的议案》，同意公司分别为深圳崇 达、江门崇达提供不超过 1 ...

格隆汇8月13日丨崇达技术(002815.SZ)在互动平台表示，公司目前批量交付的HDI板以1-4阶为主，具备 5阶HDI板样品的制作能力。 ...

证券日报网讯崇达技术（002815）8月11日在互动平台回答投资者提问时表示，截至2025年8月8日，公 司股东人数为50，244户。 ...

2025年8月11日，崇达技术(002815.SZ)在互动平台上对投资者表示，新建产能的投产节奏是公司基于市 场需求、战略规划及产能优化综合考量的结果，并非单纯由订单不足导致。珠海崇达二期项目中，珠海 二厂已于 2024 年 6 月试产，今年继续新增了高多层 PCB 板产能 6 万平米 / 月，主要应用于服务器等领 域，目前处于产能爬坡阶段。珠海三厂基建工程已完成，后续将根据市场需求适时启动生产。公司始终 坚持 "以销定产" 原则，新厂投产需经历设备调试、工艺优化及客户认证等流程，目前公司高多层板和 HDI板订单交期和产能较为紧张，公司将持续关注市场动态，灵活调整产能释放节奏，确保产能与订单 需求高效匹配。 ...

Group 1 - The core viewpoint of the article is that the relocation of Shenzhen Chongda's factory and the transfer of production personnel to Zhuhai is progressing smoothly and has not significantly impacted the company's overall production capacity [2] - The Shenzhen base continues normal production, indicating that the transition is being managed effectively without disruption to current operations [2] - The Zhuhai production base is equipped with high multi-layer product manufacturing capabilities and is gradually taking on high-tech demand orders, which enhances the company's competitiveness in the market [2] Group 2 - The capacity layout adjustment is part of the company's long-term strategic optimization aimed at better matching high-end market demands through the technological and efficiency advantages of the Zhuhai base [2] - The transition work is proceeding smoothly, which is expected to further solidify the company's capacity foundation in high value-added sectors [2]

Core Viewpoint - Chongda Technology is actively collaborating with multiple domestic clients to develop GPU accelerator cards using PCBs, indicating a strategic focus on the AI service PCB sector [2] Group 1: Company Developments - The company is working with major clients such as H3C, Cloud Top, Baode, Inspur, Guoxin, Tongtaiyi, and ZTE to create PCB products primarily for server motherboards, storage devices, and GPUs [2] - Chongda Technology plans to increase R&D investment and optimize production capacity to enhance the performance and reliability of its PCB products for AI servers [2] Group 2: Market Outlook - The company aims to expand its customer base in the AI service PCB field, reflecting a commitment to growth in this high-demand sector [2]

Market Outlook - The global printed circuit board (PCB) market is expected to grow by 6.8% in value and 7.0% in shipment volume in 2025, driven by increased demand in mobile, server, and communication sectors [2][3] - The company anticipates a significant increase in sales orders in high-demand areas such as mobile and automotive sectors, supported by a recovery in market prices for high-layer boards and HDI products [2][3] Capacity and Production - Current overall capacity utilization is approximately 85% [3] - The company is accelerating the release of high-layer PCB capacity in its Zhuhai plants and planning to establish a new HDI factory in Jiangmen to meet growing customer demand [3][5] Profitability Improvement Measures - The company is focusing on high-value customers and optimizing its sales structure to improve profit margins, with initial positive results observed in early 2025 [4] - Strategies include enhancing the sales team's capabilities, managing costs effectively, and improving order delivery and customer service levels [4][5] Cost Management - The company is implementing detailed cost control measures to address rising raw material costs, including dynamic monitoring of costs and optimizing material usage [7][8] - A structural price adjustment strategy is being considered to ensure the feasibility of price changes in response to market conditions [7] U.S. Market Exposure - Currently, approximately 10% of the company's revenue comes from the U.S. market [9] - The company is diversifying its market strategy to reduce reliance on the U.S. market, with domestic sales now exceeding 50% of total revenue [9][10] Response to Tariffs - The company is negotiating with overseas clients regarding pricing and delivery terms to mitigate the impact of U.S. tariffs [10] - Plans to accelerate the establishment of overseas production bases, such as in Thailand, are underway to localize supply and reduce tariff costs [10]

Group 1 - The company is currently collaborating with several domestic clients to develop GPU accelerated card PCBs, including major clients such as H3C, Cloud Top, Baode, Inspur, Guoxin, Tongtaiyi, and ZTE [1] - The PCB products are primarily used in server motherboards, storage devices, and GPUs [1] - Looking ahead, the company plans to deepen its focus on the AI service PCB sector, increase R&D investment, optimize production capacity, and expand customer resources to provide higher performance and more reliable PCB products for AI servers and related fields [1]