Core Viewpoint - The China Securities Central Enterprise New Momentum Theme Index has shown a mixed performance, with a recent increase in value but a year-to-date decline, reflecting the overall market dynamics and the performance of selected central enterprise stocks [1][2]. Group 1: Index Performance - The China Securities Central Enterprise New Momentum Theme Index opened high and fluctuated, rising by 0.5% to 1629.68 points, with a trading volume of 19.58 billion yuan [1]. - Over the past month, the index has increased by 3.32%, while it has risen by 4.02% over the last three months, but has decreased by 0.88% year-to-date [1]. Group 2: Index Composition - The index comprises 45 representative listed companies from central enterprises under the State-owned Assets Supervision and Administration Commission, focusing on manufacturing, technology, and modern service industries [1]. - The top ten weighted stocks in the index include Hikvision (9.61%), Changan Automobile (8.91%), AVIC Optoelectronics (7.0%), and others, indicating a concentration in specific companies [1]. Group 3: Market Segmentation - The index's holdings are primarily concentrated in the Shenzhen Stock Exchange (62.23%), followed by the Shanghai Stock Exchange (37.40%) and a minimal presence in the Beijing Stock Exchange (0.37%) [1]. - In terms of industry distribution, the index shows a significant allocation to industrials (45.87%) and information technology (37.72%), with smaller allocations to consumer discretionary (9.36%), communication services (4.62%), financials (1.60%), and materials (0.84%) [2]. Group 4: Index Adjustment Mechanism - The index samples are adjusted semi-annually, with changes implemented on the next trading day following the second Friday of June and December [2]. - Weight factors are generally fixed until the next scheduled adjustment, with provisions for temporary adjustments in special circumstances, such as delisting or corporate restructuring [2].

Group 1 - The core viewpoint of the news is that Shenzhen Sunnan Circuit Co., Ltd. has applied for a patent for a manufacturing method of a packaging substrate, which aims to enhance the reliability of the packaging substrate by reducing the risk of damage to the internal conductive layer [1] - The patent application was filed on March 2025, and the public announcement number is CN120280345A [1] - The manufacturing method includes several steps, such as providing a packaging core board, forming solder pads, and ensuring the solder balls are positioned correctly to avoid damage [1] Group 2 - Shenzhen Sunnan Circuit Co., Ltd. was established in 1984 and is located in Shenzhen, primarily engaged in the manufacturing of computers, communications, and other electronic devices [2] - The company has a registered capital of 51,287.7535 million RMB [2] - The company has made investments in 10 enterprises and has participated in 2,159 bidding projects, with a total of 1,608 patent information records [2]

Core Viewpoint - The company, Shenzhen Circuit (002916.SZ), reports that its PCB factory's capacity utilization remains high due to sustained demand in computing power and automotive electronics markets [1] Group 1: Business Operations - The overall business operations of the company are normal, with a comprehensive capacity utilization rate at a relatively high level [1] - The PCB business benefits from ongoing demand in computing power and automotive electronics, maintaining high factory capacity utilization [1] - The packaging substrate business has seen a relative improvement in demand from the storage sector, leading to an increase in capacity utilization compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development - The company has achieved mass production capability for FC-BGA packaging substrates with products of 20 layers and below, with minimum line width and spacing capabilities of 9/12μm [1] - Sample certification work for various product stages is progressing in an orderly manner [1] - The technical research and sample testing for products with more than 20 layers are on schedule [1]

Group 1: Company Overview and Market Position - The company maintains high factory utilization rates, benefiting from strong demand in computing power and automotive electronics markets [1] - The PCB business focuses on high-end products, particularly in the fields of new energy and ADAS, with applications in industrial control and medical sectors [1] - The company has established factories in Shenzhen, Wuxi, Nantong, and Thailand, with ongoing capacity expansion projects [3] Group 2: PCB Business Demand and Trends - There is an increasing demand for large-size, high-layer, high-frequency, and high-speed HDI PCB products, driven by advancements in technology [2] - The PCB business has seen growth in demand for products used in high-speed communication networks, data center switches, AI accelerator cards, and storage devices since 2024 [2] Group 3: Expansion Plans and Investments - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing capabilities in high-layer and HDI PCB technologies [4] - The company is upgrading existing PCB factories to increase capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [3] Group 4: Packaging Substrate Business - The packaging substrate business includes a wide range of products, with demand improving in Q1 2025 compared to Q4 2024, particularly for storage-related products [5] - The FC-BGA packaging substrate can now produce products with up to 20 layers, with ongoing development for higher-layer products [6] Group 5: Electronic Assembly Business - The electronic assembly business focuses on communication, data centers, medical, and automotive electronics, aiming to provide integrated solutions and enhance customer loyalty [7] - The company adheres to information disclosure regulations, ensuring no significant undisclosed information was leaked during the investor relations activities [7]

Group 1 - The PCB concept has seen a continuous rise, with stocks such as Fangzheng Technology hitting the daily limit [1] - Other companies like Jin'an Guoji, Bomin Electronics, and Dongshan Precision also reached their daily limit, while Jinlu Electronics, Pengding Holdings, Jingwang Electronics, Shenzhen South Circuit, and Aoshikang increased by over 6% [1] - According to a report from Tianfeng Securities, the market space for M8 PCB boards corresponding to AI servers and switches is estimated to be between 50-60 billion by 2026 [1]

Group 1 - PCB concept stocks are experiencing a strong afternoon rally, with Zhongyi Technology (301150) hitting the 20% daily limit up [1] - Copper Crown Copper Foil (301217) has risen over 10%, while Chuan Yi Technology (002866) and Dawei Shares (002213) previously reached their daily limit up [1] - Shen Nan Circuit (002916) and Jia Yuan Technology are among the top gainers in this sector [1] Group 2 - Dark pool funds are flowing into these stocks, indicating increased investor interest [1]

Group 1 - The A-share PCB concept stocks experienced a surge, with Jin'an Guoji hitting the daily limit, indicating strong market interest [1] - Pengding Holdings rose over 7%, reflecting positive investor sentiment towards the PCB sector [1] - Other companies such as Zhongjing Electronics, Shennan Circuit, Yihua New Materials, and Guanghe Technology also saw increases, suggesting a broader rally in the industry [1]

Group 1 - PCB concept stocks experienced a surge, with Jin'an Guoji (002636) hitting the daily limit up [1] - Pengding Holdings (002938) rose over 7%, indicating strong market interest [1] - Other companies such as Zhongjing Electronics (002579), Shennan Circuit (002916), Yihau New Materials (301176), and Guanghe Technology (001389) also saw increases in their stock prices [1]

Core Viewpoint - The establishment of the International Industry College between Shenzhen South Circuit Co., Ltd. and Liuzhou Vocational and Technical University aims to cultivate high-quality skilled talents with international vision and professional capabilities to support the international development of Shenzhen South Circuit [1][3][4] Group 1: College Establishment and Objectives - The International Industry College was inaugurated on June 25 in Liuzhou, Guangxi, focusing on customized talent training for Shenzhen South Circuit's Thailand base and local electronic information companies [1][3] - The college will implement a dual-language training program, offering "foreign language + vocational skills" for Chinese students and "Chinese + vocational skills" for Thai students [3][4] Group 2: Collaboration and Equipment Donation - Shenzhen South Circuit donated 9 sets of advanced manufacturing equipment to Liuzhou Vocational and Technical University to support the establishment of a modern PCB manufacturing training base [3] - Since 2016, Shenzhen South Circuit and Liuzhou Vocational and Technical University have collaborated, with a recent focus on developing a dual training program for Chinese and Thai students, resulting in the training of 77 students to support the Thailand base's production [3][4] Group 3: Future Plans and Educational Model - The International Industry College will adopt a "dual president system" management model and establish four functional institutions to create a highly integrated talent training system linking education, talent, and industry [4] - Future initiatives include the development of an international vocational certification system in PCB manufacturing and collaboration with ASEAN institutions for course co-construction and skills training [4]

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen an improvement in capacity utilization compared to Q4 2024 and Q1 2025 due to a relative improvement in demand in the storage sector [1] Group 2: PCB Business Applications and Market Trends - The PCB business focuses on high-end PCB product design, development, and manufacturing, primarily serving communication devices, data centers, automotive electronics, and industrial control sectors [1] - The demand for large-size, high-layer, high-frequency, high-speed, high-level HDI, and high-heat dissipation PCB products has increased due to the urgent need for high computing power and high-speed networks in the electronic industry [2] Group 3: Expansion Plans and Investments - The company has factories in Shenzhen, Wuxi, Nantong, and a factory under construction in Thailand. It is enhancing capacity through technological upgrades and is progressing with the Nantong Phase IV project to establish an HDI technology platform [3] - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule. The factory will have capabilities for high-layer and HDI PCB processes, aiding in expanding overseas markets [4] Group 4: Packaging Substrate Business Development - The packaging substrate products cover a wide range, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers/storage [5] - The FC-BGA packaging substrate currently has mass production capabilities for products with 20 layers or fewer, with ongoing development for products exceeding 20 layers [6] - The Guangzhou packaging substrate project is in the early stages of capacity ramp-up, with a reduction in losses in Q1 2025 compared to previous quarters [7]